Patents by Inventor Chi Goo KANG

Chi Goo KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11133443
    Abstract: A light emitting device package includes a mounting substrate including first and second lower electrode portions separated by a first groove, first and second upper electrode portions separated by a second groove connected to the first groove and disposed on the first and second lower electrode portions respectively, and an insulation support member filling the first groove, a light emitting device mounted on the first and second upper electrode portions of the mounting substrate, a double phosphor film covering an upper surface of the light emitting device, including a phosphor layer and a barrier layer sequentially stacked on each other, and having a thickness of 200 ?m or less, and a sealing member on the mounting substrate covering the light emitting device and the double phosphor film.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: September 28, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chi-Goo Kang, Young-Kyung Kim, Young-Ho Park, Jong-Won Park, Seog-Ho Lim
  • Publication number: 20200243731
    Abstract: A light emitting device package includes a mounting substrate including first and second lower electrode portions separated by a first groove, first and second upper electrode portions separated by a second groove connected to the first groove and disposed on the first and second lower electrode portions respectively, and an insulation support member filling the first groove, a light emitting device mounted on the first and second upper electrode portions of the mounting substrate, a double phosphor film covering an upper surface of the light emitting device, including a phosphor layer and a barrier layer sequentially stacked on each other, and having a thickness of 200 ?m or less, and a sealing member on the mounting substrate covering the light emitting device and the double phosphor film.
    Type: Application
    Filed: July 10, 2019
    Publication date: July 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chi-Goo KANG, Young-Kyung KIM, Young-Ho PARK, Jong-Won PARK, Seog-Ho LIM
  • Patent number: 10699991
    Abstract: A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chi-Goo Kang, Sun-Woo Kim, Jong-Sup Song, Ho-Young Song
  • Publication number: 20180366615
    Abstract: A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.
    Type: Application
    Filed: December 14, 2017
    Publication date: December 20, 2018
    Inventors: Chi-Goo Kang, Sun-Woo KIM, Jong-Sup SONG, Ho-Young SONG
  • Publication number: 20170186926
    Abstract: A light emitting device package having enhanced light extraction efficiency includes a body having a mounting region, a light emitting device disposed above the mounting region, and a spacer disposed between the light emitting device and the mounting region to secure a space between the light emitting device and the mounting region. The spacer has a reflective surface reflecting light emitted by the light emitting device to the mounting region in a lateral direction.
    Type: Application
    Filed: July 19, 2016
    Publication date: June 29, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Chi Goo KANG