Patents by Inventor Chi-Han Chang

Chi-Han Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100310907
    Abstract: The present disclosure relates generally to indicating an end of life condition of an electrochemical device, and more particularly to systems and methods for sensing and determining an end of life condition in a cell comprising a high capacity cathode material suitable for use in a non-aqueous electrochemical cell. The high capacity cathode material has an amorphous or semi-crystalline form of copper manganese oxide, and optionally fluorinated carbon. The present disclosure additionally relates to transmitting the determined end of life condition to a user or monitoring device of the cell.
    Type: Application
    Filed: March 5, 2010
    Publication date: December 9, 2010
    Applicant: EAGLEPICHER TECHNOLOGIES, LLC
    Inventors: Greg Miller, William Studyvin, Michael Parrot, John C. Pugsley, Ernest Ndzebet, Min Qi Yang, Viet Vu, Umamahaswari Viswanathan, Jeremy Chi-Han Chang, Ramanathan Thillaiyan, Dong Zhang, Mario Destephen, Umamaheswari Janakiraman
  • Publication number: 20100221616
    Abstract: The present disclosure relates generally to a high capacity cathode material suitable for use in a non-aqueous electrochemical cell that comprises copper manganese oxide, which may be in amorphous or semi-crystalline form, and optionally fluorinated carbon. The present disclosure additionally relates to a non-aqueous electrochemical cell comprising such a cathode material and, in particular, to such a non-aqueous electrochemical cell that can deliver a higher capacity than conventional cell.
    Type: Application
    Filed: November 9, 2009
    Publication date: September 2, 2010
    Applicant: EAGLEPICHER TECHNOLOGIES, LLC
    Inventors: Jeremy Chi-Han Chang, Ernest Ndzebet, Viet Vu, Min Qi Yang, Umamaheswari Janakiraman, Ramanathan Thillaiyan, Dong Zhang, Mario Destephen
  • Patent number: 6368912
    Abstract: A method of fabricating a horizontal isolation structure between a deep trench capacitor and a vertical transistor thereon is provided. A deep trench capacitor is in the bottom of a deep trench of a substrate. An insulating layer is formed to partially fill the deep trench and also on the substrate by high-density plasma chemical vapor deposition. The insulating layer on the sidewall of the deep trench and on the substrate is removed to transform the insulating layer in the deep trench to an isolation structure. An alternative approach is to form an insulating layer on the substrate and in the deep trench. Then a CMP is performed to remove the insulating layer on the substrate and an etching back is performed to remove the upper portion of the insulating layer in the deep trench. Then the remained insulating layer in the deep trench is served as an isolation structure between the deep trench capacitor and a vertical transistor thereron.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: April 9, 2002
    Assignee: Nanya Technology Corporation
    Inventors: Chi-Han Chang, Tzu-En He, Hsin-Chuan Tsai, Pei-Ing Lee