Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.

Abstract: A display control method applicable to an all-in-one (AIO) computer is provided. The AIO computer includes a first monitor and a second monitor. The display control method includes: receiving a control instruction from the first monitor; projecting a display content on the second monitor according to the control instruction; and selectively enabling a touch control function of the second monitor according to the control instruction.

Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A fault detection method, includes the following steps. A target sequence is received, the target sequence includes several data. A first moving average operation is performed on the target sequence to establish a first moving average sequence. A second moving average operation is performed on the target sequence to establish a second moving average sequence. A difference operation between the first moving average sequence and the second moving average sequence is performed to obtain a difference sequence, the difference sequence includes several difference values. An upper limit value is set. When one of the difference values is greater than the upper limit value, the target sequence is determines as abnormal.

Abstract: A semiconductor device includes a device layer, a semiconductor layer, a sensor element, a dielectric layer, a color filter layer, and a micro-lens. The semiconductor layer is over the device layer. The semiconductor layer has a plurality of microstructures thereon. Each of the microstructures has a substantially triangular cross-section. The sensor element is under the microstructures of the semiconductor layer and is configured to sense incident light. The dielectric layer is over the microstructures of the semiconductor layer. The color filter layer is over the dielectric layer. The micro-lens is over the color filter layer.

Abstract: An auxiliary screening system and an auxiliary screening method for a hip joint of a baby are provided. The auxiliary screening method includes: collecting plural images of the hip joint; performing an image analysis operation on each of the images of the hip joint to extract plural image features of each of the images of the hip joint and determining whether each of the images of the hip joint is a standard image according to the image features of each of the images of the hip joint; and when at least one of the images of the hip joint is determined as the standard image, plural angle parameters are calculated and the at least one of the images of the hip joint that is determined as the standard image is outputted, in which the angle parameters include values of an angle ? and an angle ?.

Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.

Abstract: A fan device includes a hub and a plurality of fan blades. Each of the fan blades includes a driving surface, and the driving surface includes a first tooth column and a second tooth column. The first tooth column includes a plurality of first skin-tooth units. Each of the first skin-tooth units includes a first body. A first middle ridge and two first side ridges protrude from a surface of the first body, and a groove is formed between two adjacent first skin-tooth units. The second tooth column includes a plurality of second skin-tooth units. Each of the second skin-tooth units includes a second body and an extension element. A second middle ridge and two second side ridges protrude from a surface of the second body, and the extension element is located in the groove and includes an extension rib.

Abstract: An antenna structure includes a ground element, a first radiation element, a second radiation element, a third radiation element, and a nonconductive support element. The first radiation element is coupled to a first grounding point on the ground element. The second radiation element has a feeding point. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to a second grounding point on the ground element. The third radiation element is adjacent to the second radiation element. The first radiation element, the second radiation element, and the third radiation element are disposed on the nonconductive support element. The second radiation element is at least partially surrounded by the first radiation element. The third radiation element is at least partially surrounded by the second radiation element.

Abstract: Methods, systems, and apparatuses are provided for sidelink resource selection or exclusion of multi-consecutive slot transmission (MCSt) in a wireless communication system to enhance and/or modify Legacy sidelink Mode 2 operation for the MCSt. A method of a first device can comprise triggering or requesting sensing-based resource selection or re-selection for performing one or more Physical Sidelink Shared Channel (PSSCH) or Physical Sidelink Control Channel (PSCCH) transmissions in a sidelink resource pool in unlicensed or shared spectrum, determining a first parameter for determining or initializing candidate multi-slot resources, receiving a Sidelink Control Information (SCI) for reserving one or more sidelink resources, selecting a number of sidelink resources from valid/identified/remaining candidate multi-slot resources after exclusion, and performing the one or more PSSCH or PSCCH transmissions on at least one of the selected number of sidelink resources.

Abstract: A switch device includes a driver circuit, a switch circuit and a level transition circuit. The driver circuit includes an input terminal for receiving an input signal, an output terminal for outputting an output signal, a first terminal coupled to a first reference terminal, and a second terminal coupled to a second reference terminal. The switch circuit includes a control terminal for receiving the output signal. The level transition circuit includes a first terminal for receiving the output signal, a second terminal coupled to a third reference terminal, and a third terminal for receiving the input signal. In a transition interval, the input signal is transitioned from a first input signal level to a second input signal level, the level transition circuit transitions the output signal from a first output signal level to a third output signal level between the first output signal level and a second output signal level.

Abstract: A smart wearable device has a signal calibration function executed by a signal calibration method and applied to a finger, a limb and/or a neck of a user. The smart wearable device includes at least one physiological signal detector, at least one pressure detector and an operation processor. The at least one physiological signal detector is adapted to abut against a detection area of the user for detecting a physiological signal. The at least one pressure detector is disposed around the at least one physiological signal detector and adapted to detect a pressure value of the detection area. The operation processor is electrically connected with the at least one physiological signal detector and the at least one pressure detector. The operation processor is adapted to optimize the physiological signal when the pressure value exceeds a predefined pressure threshold.

Abstract: The present invention provides a white light LED package structure and a white light source system, which includes a substrate, an LED chip, and a wavelength conversion material layer. The peak emission wavelength of the LED chip is between 400 nm and 425 nm; the peak emission wavelength of the wavelength conversion material layer is between 440 nm and 700 nm, and the wavelength conversion material layer absorbs light emitted from the LED chip and emits a white light source; and the emission spectrum of the white light source is set as P(?), the emission spectrum of a blackbody radiation having the same color temperature as the white light source is S(?), P(?max) is the maximum light intensity within 380-780 nm, S(?max) is the maximum light intensity of the blackbody radiation within 380-780 nm, D(?) is a difference between the spectrum of the white light LED and the spectrum of the blackbody radiation, and within 510-610 nm, the white light source satisfies: D(?)=P(?)/P(?max)?S(?)/S(?max), ?0.

Abstract: A zoned heat dissipation control system for a water cooling radiator and a water cooling heat dissipation system having the zoned heat dissipation control system includes a plurality of fans, a plurality of heat dissipation zones defined on the water cooling radiator, a thermal detector, and a control unit. At least one of the fans is disposed within each of the heat dissipation zones. The thermal detector is disposed within at least one of the heat dissipation zones and configured to detect the temperature of the water cooling radiator. The control unit is electrically connected to the fans and the thermal detector and configured to modulate the rotational speed of the fan within each of the heat dissipation zones based on the detected data from the thermal detector.

Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.

Abstract: An automatic material changing and welding system for stamping materials includes a welding transfer sliding table and a welding platform. The automatic material changing device further includes a feeding system. The feeding system includes a double-head uncoiling machine, an automatic feeding machine and a flattening machine. The automatic material changing device is used for automatic feeding for a stamping machine. The system triggers a material changing signal through a sensor to control and integrate the welding transfer sliding table and the welding platform to act to execute a welding procedure, so that the stamping materials are in welding connection with new and old coiled materials through a welding connection plate to realize continuous production operation of an automated stamping production line.

Abstract: A method for matching parameters applied to a display device and a circuit system that performs the method are provided. In the method, when a display device is activated, a circuit system connects to a panel module of the display device for retrieving parameters from a panel memory. The parameters are such as video display parameters, camera image parameters, speaker audio parameters, and microphone receiving parameters. After the parameters are applied to the circuit system, the circuit system operates the display device using the parameters. The data generated by the circuit system can be adjusted for matching new parameters. Afterwards, when the new parameters are applied to the circuit system, video and audio are outputted according to the matched parameters, and the camera and microphone in the panel module are also operated according to the matched parameters.