Abstract: Provided is a semiconductor device including a substrate having a lower portion and an upper portion on the lower portion; an isolation region disposed on the lower portion of the substrate and surrounding the upper portion of the substrate in a closed path; a gate structure disposed on and across the upper portion of the substrate; source and/or drain (S/D) regions disposed in the upper portion of the substrate at opposite sides of the gate structure; and a channel region disposed below the gate structure and abutting between the S/D regions, wherein the channel region and the S/D regions have different conductivity types, and the channel region and the substrate have the same conductivity type.

Abstract: The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.

Abstract: The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.

Abstract: A light-emitting module with a focus adjusting function is described. A light-emitting module includes a light-emitting diode, a first hollow cylinder and a second hollow cylinder. A first hollow cylinder encloses the light-emitting diode and has a first thread around an outer surface thereof. A second hollow cylinder has a second thread on an inner surface thereof, wherein the first thread is meshed with the first thread such that the second hollow cylinder is telescoped from the first hollow cylinder when the second hollow cylinder rotates relative to the first hollow cylinder. An optical lens is disposed within the second hollow cylinder, wherein the optical lens moves relative to the light-emitting diode so as to adjust a projected beam's focus.

Abstract: A socket LED device includes a first body, a second body, a conducting device, a heat-dissipation device and an LED module. The first body is demountably connected to the second body. The heat-dissipation device is set between the first body and the second body. The conducting device includes two conducting pins and two conducting sockets respectively located on the first connecting surface and the second connecting surface to embed with each other. The LED module is secured on the first body and includes a heat-conducting substrate touching the heat-dissipation device and a conductive portion electrically connected with the conducting pins. Therefore, the heat is gradually decreased through this kind of stacked formation.

Abstract: The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.