Patents by Inventor Chi Ho

Chi Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190317540
    Abstract: A power conversion apparatus for tracking maximum power point, includes: a signal processing circuit, which generates a sensing signal at a sensing node according to an input voltage; and a comparison circuit, which controls a converter circuit according to a difference between the sensing signal and a reference voltage, to convert the input voltage to an output power. The signal processing circuit includes: a bias sensing circuit, which generates the sensing signal at the sensing node according to the input voltage; and a clamp circuit coupled to the sensing node, for clamping the sensing signal to be not greater than a clamp voltage. The converter circuit adjusts an output voltage and/or an output current of the output power, so that a power retrieval source operates near its maximum power point.
    Type: Application
    Filed: February 20, 2019
    Publication date: October 17, 2019
    Inventors: Kuo-Chi Liu, Chang-Yu Ho
  • Publication number: 20190312260
    Abstract: Provided is a positive electrode active material particle including a core that includes lithium cobalt oxide represented by the following Chemical Formula 1; and a shell that is located on the surface of the core and includes lithium cobalt phosphate represented by the following Chemical Formula 2, wherein the shell has a tetrahedral phase: LiaCo(1-x)MxO2-yAy??(1) wherein M is at least one of Ti, Mg, Zn, Si, Al, Zr, V, Mn, Nb, and or Ni, A is oxygen-substitutional halogen, and 0.95?a?1.05, 0?x?0.2, 0?y?0.2, and 0?x+y?0.2, LibCoPO4??(2) wherein 0?b?1.
    Type: Application
    Filed: July 27, 2017
    Publication date: October 10, 2019
    Applicant: LG Chem, Ltd.
    Inventors: Younguk Park, Chi Ho Jo, Bo Ram Lee, Sungbin Park, Hyuck Hur, Wang Mo Jung
  • Patent number: 10439105
    Abstract: A light emitting diode including a first conductive type semiconductor layer, a mesa disposed on the first conductive type semiconductor layer, the mesa including an active layer and a second conductive type semiconductor layer, a reflective electrode disposed on the mesa and configured to be in ohmic-contact with the second conductive type semiconductor layer, a current spreading layer disposed on the mesa and the reflective electrode, the current spreading layer including a first portion configured to be in ohmic-contact with an upper surface of the first conductive type semiconductor layer, a first n-contact region spaced apart from a second n-contact region with the mesa disposed between the first and second n-contact regions, and an insulation layer including a first opening exposing the reflective electrode between the first and second n-contact regions. The first and second n-contact regions have a second opening that exposes the first conductive type semiconductor layer.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: October 8, 2019
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Jong Hyeon Chae, Jong Min Jang, Won Young Roh, Daewoong Suh, Dae Sung Cho, Joon Sup Lee, Kyu Ho Lee, Chi Hyun In
  • Patent number: 10428055
    Abstract: The present invention relates to a substituted piperidines represented by following Chemical Formula 1, which have a GPR119 agonistic activity, a method for preparing the same, and a pharmaceutical composition including the same: wherein A, B, and X are defined therein.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: October 1, 2019
    Assignee: DONG-A ST CO., LTD.
    Inventors: Jae Sung Yang, Gye Rim Baek, Yoon Jung Kim, Chi Young Ahn, Jae Young Lee, Il Hoon Jung, Mi Kyung Kim, So Mi Kang, Hyo Ju Lee, Yu Na Chae, Ye Hwang Cheong, Tae Hyoung Kim, Eun Kyoung Yang, Moon Ho Son, Chang Yell Shin
  • Patent number: 10428731
    Abstract: A method for cleaning a continuously variable valve timing (CVVT) system for removing foreign materials includes: switching a target operating value of the CVVT system to a predetermined setting value within a set operating region and performing cleaning of the CVVT system; and determining whether a valve timing control learning request exists for the CVVT system, and, when the valve timing control learning request exists, aborting the cleaning.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: October 1, 2019
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Chi-Ho Moon
  • Patent number: 10432028
    Abstract: A wireless power relay apparatus includes a relay resonator configured to relay power from a source resonator configured to wirelessly transmit the power, to a target resonator configured to wirelessly receive the power through a mutual resonance, the relay resonator having a higher quality factor than the source resonator and the target resonator.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: October 1, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chi Hyung Ahn, Sang Wook Kwon, Ki Young Kim, Nam Yun Kim, Dong Zo Kim, Bong Chul Kim, Yun Kwon Park, Jae Hyun Park, Keum Su Song, Young Ho Ryu, Byoung Hee Lee
  • Publication number: 20190286351
    Abstract: A method for configuring host memory buffer, a memory storage apparatus and a memory control circuit unit are provided. The method includes: loading an initial program stored in an option ROM of a memory storage apparatus to a buffer memory of a host system; executing the initial program to configure continuous physical addresses in the buffer memory as a host memory buffer of the memory storage apparatus and setting a signature at the continuous physical addresses and storing the signature. The method further includes: re-establishing a link with the continuous physical addresses when receiving a reset command corresponding to a suspend-to-RAM mode and determining whether a signature set at the continuous physical addresses is the same as the stored signature; and resuming to use the continuous physical addresses as the host memory buffer of the memory storage apparatus if the signature is the same as the stored signature.
    Type: Application
    Filed: May 14, 2018
    Publication date: September 19, 2019
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Hsiao-Chi Ho, Cheng-Nan Wu, Chien-Hua Chu
  • Patent number: 10420245
    Abstract: A circuit board module includes a bracket, a first circuit board, a first resilient member and a second resilient member. The bracket has at least one protruding pillar. The first circuit board is disposed on the bracket. The first circuit board has at least one through hole and at least one first connector. The at least one protruding pillar passes through the at least one through hole. The at least one first connector defines an assembling direction. The first resilient member is disposed at a first side of the first circuit board. The first circuit board is configured to move in a first direction and compressing the first resilient member. The second resilient member is disposed at a second side of the first circuit board. The first circuit board is configured to move in a second direction and compressing the second resilient member.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: September 17, 2019
    Assignee: Wistron Corporation
    Inventor: Fong-Chi Ho
  • Patent number: 10418178
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: September 17, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park
  • Publication number: 20190281215
    Abstract: Color, luminance, and sharpness balancing across images that are stitched together in a panorama compensates for exposure, alignment, and other differences between the images. Histograms counting occurrences of Y, U, and V values in overlapping regions between images are generated. The Y-value histograms are converted to Cumulative Density Functions (CDF's) and then to a Y color transfer curve which is averaged to generate a smoother averaged Y color transfer curve. Artifacts and loss of image detail caused by color transfer are suppressed by the averaging. For U and V color values the histogram bars are directly averaged using a moving average and then CDF's generated from the moving average of the histograms. Color transfer curves are generated for U and V from the CDF's for source and target images that overlap. All pixels in the source image are adjusted using the color transfer curves to perform color and luminance balancing.
    Type: Application
    Filed: March 6, 2018
    Publication date: September 12, 2019
    Inventors: Chi Ho CHAN, Dongpeng WANG
  • Patent number: 10410941
    Abstract: A semiconductor device includes a semiconductor die having a top surface that has one or more electrical contacts formed thereon, and an opposite bottom surface. A molding material encapsulates the top surface and at least a part of a side surface of the semiconductor die. The molding material defines a package body that has a top surface and a side surface. Openings are formed on the top surface of the package body, and the electrical contacts are partially exposed from the molding material through the openings. A metal layer is formed over and electrically connected to the electrical contacts through the openings. The metal layer extends to and at least partially covers the side surface of the package body.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: September 10, 2019
    Assignee: Nexperia B.V.
    Inventors: Chi Ho Leung, Pompeo V. Umali, Shun Tik Yeung, Kan Wae Lam
  • Publication number: 20190273399
    Abstract: A wireless power transmission apparatus includes resonators configured to transmit a power wirelessly to another resonator, and a controller configured to control a current magnitude and/or a voltage magnitude of a power to be provided to each of the resonators. The apparatus further includes a feeder configured to provide the power to each of the resonators.
    Type: Application
    Filed: May 14, 2019
    Publication date: September 5, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Keum Su SONG, Sang Wook Kwon, Ki Young Kim, Yun Kwon Park, Jae Hyun Park, Chi Hyung AHN, Young Ho RYU
  • Patent number: 10398976
    Abstract: A display controller includes a frame rate converter creating a second reference image having a second frame rate higher than a first frame rate of a first reference image, based on the first reference image, a buffer storing the second reference image, and an image processor creating an output image by selecting at least a portion of the second reference image.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: September 3, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyu Tae Lim, Chi Ho Cha, Hwa Hyun Cho, Yoon Ho Ko
  • Patent number: 10400184
    Abstract: Heavy oil feeds are hydroprocessed in the presence of a solvent and in the presence of a catalyst with a median pore size of about 85 ? to about 120 ? under conditions that provide a variety of benefits. The solvent can be an added solvent or a portion of the liquid effluent from hydroprocessing. The processes allow for lower pressure processing of heavy oil feeds for extended processing times or extended catalyst lifetimes be reducing or mitigating the amount of coke formation on the hydroprocessing catalyst.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: September 3, 2019
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Hyung Suk Woo, Jane Chi-Ya Cheng, Teh C. Ho, Stephen Harold Brown
  • Patent number: 10400324
    Abstract: Disclosed herein is a method of treating a composite piston pin, including: preparing the piston pin of which at least surface layer includes a composite material including a reinforcing fiber and a resin; improving roughness by processing the surface layer of the piston pin; and forming a coating layer on the surface layer processed to reduce a friction coefficient of the piston pin.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: September 3, 2019
    Assignee: Hyundai Motor Company
    Inventors: Sung Chul Cha, June Ho Yang, Hee Sam Kang, Chi Hoon Choi, Sang Yoon Park, Jong Dae Lim, Seung Hyun Hong
  • Patent number: 10401644
    Abstract: The present invention relates to a thermoplastic laminate for an eyewear, a decorative part comprising the thermoplastic laminate and a preparation process therefor. In particular, during the preparation of the laminate, a high frequency welding machine is used for bonding thermoplastic layers. The present invention uses a high frequency welding machine for the instant welding of the thermoplastic layers. Good bonding strength exists between different layers. Further, the patterns of the core layer are intact, and have high-definition images. The patterns are located in the core layer, not affected by external environmental factors, and not easily abraded. Further, multiple surfaces of the part for an eyewear have patterns, increasing the beautiful appearance of the part for an eyewear, and meeting the requirements of customers to the largest extent.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: September 3, 2019
    Assignee: OKIA OPTICAL CO., LTD.
    Inventors: Yan Zhang, Chi Ho Lam
  • Patent number: 10398226
    Abstract: A bracket assembly includes a bracket, a mounting member, a supporting member, and a fixing member. The mounting member and the supporting member are mounted on the bracket. The supporting member includes a first supporting portion and a second supporting portion. The first supporting portion is larger in size than the second supporting portion. A mounting hole communicates with the first supporting portion and the second supporting portion. A portion of the fixing member can be mounted to the mounting hole.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: September 3, 2019
    Assignees: King Slide Works Co., Ltd., King Slide Technology Co., Ltd.
    Inventors: Ken-Ching Chen, Shun-Ho Yang, Chi-Chih Chou, Chun-Chiang Wang
  • Patent number: 10389182
    Abstract: A wireless power relay apparatus includes a relay resonator configured to relay power from a source resonator configured to wirelessly transmit the power, to a target resonator configured to wirelessly receive the power through a mutual resonance, the relay resonator having a higher quality factor than the source resonator and the target resonator.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: August 20, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chi Hyung Ahn, Sang Wook Kwon, Ki Young Kim, Nam Yun Kim, Dong Zo Kim, Bong Chul Kim, Yun Kwon Park, Jae Hyun Park, Keum Su Song, Young Ho Ryu, Byoung Hee Lee
  • Publication number: 20190252354
    Abstract: A method includes bonding a first wafer to a second wafer, with a first plurality of dielectric layers in the first wafer and a second plurality of dielectric layers in the second wafer bonded between a first substrate of the first wafer and a second substrate in the second wafer. A first opening is formed in the first substrate, and the first plurality of dielectric layers and the second wafer are etched through the first opening to form a second opening. A metal pad in the second plurality of dielectric layers is exposed to the second opening. A conductive plug is formed extending into the first and the second openings.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai
  • Publication number: 20190246996
    Abstract: A handheld radiation image detecting system and an operation method thereof are provided. The handheld radiation image detecting system includes a handheld device including a radiation emitter and a first transceiver and a sensing device including a radiation image sensor and a second transceiver. The first transceiver is coupled to the radiation emitter and used for generating a first wave with directionality. The second transceiver is used for receiving the first wave and for generating a second wave with directionality, and the first transceiver is used for receiving the second wave.
    Type: Application
    Filed: June 6, 2018
    Publication date: August 15, 2019
    Inventors: Chi-Kuang Lai, Hsu-Ho Wu, Wei-Hsuan Ho, Ching-Feng Tsai, Che-Yu Chuang, Tsung-Min Yang, Yu-Wei Chen