Patents by Inventor Chi Ho To

Chi Ho To has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240138174
    Abstract: Provided are an organic electronic element comprising an anode, a cathode, and an organic material layer between the anode and the cathode, and an electronic device comprising the organic electronic element, wherein the organic material layer comprises each compound represented by Formula 1, Formula 2, or Formula 3, thereby the driving voltage of the organic electronic element can be lowered and the luminous efficiency and lifespan can be improved.
    Type: Application
    Filed: March 15, 2023
    Publication date: April 25, 2024
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Hyo Min JIN, Bu Yong YUN, Jae Ho KIM, Hyung Dong LEE, Chi Hyun PARK
  • Publication number: 20240130086
    Abstract: A multimode immersion cooling system includes a first, single-phase immersion cooling mode and a second, two-phase immersion cooling mode. The system operates in a single phase mode and reserves a two-phase mode for peak energy consumption periods. A single thermal transfer fluid is used for both modes, remaining in a liquid phase in a first single-phase immersion cooling mode and vaporizing when the thermal transfer fluid temperature reaches its boiling point in a second two-phase immersion cooling mode. A heat exchanger extracts thermal energy from heated thermal transfer fluid in the single phase mode while a condenser cools vaporized thermal transfer fluid to condense the vapor during the second, two-phase immersion cooling mode. A controller determines whether the multimode immersion cooling system operates in the single-phase mode or the second two-phase mode, or both.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 18, 2024
    Inventors: Wai Chung LI, Chi Ho KWOK
  • Patent number: 11963467
    Abstract: An electronic device includes a semiconductor memory. A method for fabricating the electronic device includes forming a first memory cell extending vertically from a surface of substrate and having a first upper portion that protrudes laterally, forming a second memory cell extending vertically from the surface of the substrate and having a second upper portion that protrudes laterally towards the first upper portion, and forming a liner layer over the first and second memory cells, the liner layer having a first portion disposed over the first upper portion and a second portion disposed over the second upper portion, the first and second portions of the liner layer contacting each other.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: April 16, 2024
    Assignee: SK hynix Inc.
    Inventors: Hyo-June Kim, Hyun-Seok Kang, Chi-Ho Kim, Jae-Geun Oh
  • Publication number: 20240116184
    Abstract: An automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a resid
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Min Sung HA, Kwang-Jun KIM, Jong Kyu KIM, Hyun-Joong KIM, Jin Ho SO, Chi-Gun AN, Ki Moon LEE, Hui Gwan LEE, Beom Soo HWANG
  • Publication number: 20240109739
    Abstract: This disclosure is directed to an automatic sheet feeding device having a flipping mechanism which is used for a sheet. The automatic sheet feeding device has a sheet outputting tray, a sheet outputting channel, the flipping mechanism and a switching guide mechanism. The sheet outputting channel is disposed corresponding to the sheet outputting tray. The flipping mechanism is arranged between the sheet outputting channel and the sheet outputting tray. The switching guide mechanism is arranged between the sheet outputting channel and the flipping mechanism, and the switching guide mechanism is used for guiding the sheet to be conveyed to the sheet outputting tray from the sheet outputting channel or conveyed to the sheet outputting tray from the flipping mechanism. Therefore, an efficiency of duplex scanning of the automatic sheet feeding device may be improved.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 4, 2024
    Inventors: Pei-Chi HO, Po-Chih CHANG
  • Publication number: 20240102194
    Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.
    Type: Application
    Filed: August 7, 2023
    Publication date: March 28, 2024
    Inventors: Cheng-EN HO, Yu-Lian CHEN, Cheng-Chi WANG, Yu-Jen CHANG, Yung-Sheng LU, Cheng-Yu LEE, Yu-Ming LIN
  • Patent number: 11942750
    Abstract: A laser inspection system is provided. A laser source emits a laser with a first spectrum and the laser is transmitted by a first optical fiber. A gain optical fiber doped with special ions is connected to the first optical fiber, and a light detector is provided around the gain optical fiber. When the laser with the first spectrum passes through the gain optical fiber, the gain optical fiber absorbs part of the energy level of the laser with the first spectrum, so that the laser with the first spectrum is converted to generate light with a second spectrum based on the frequency conversion phenomenon. The light detector detects the intensity of the light with the second spectrum, so that the power of the laser source can be obtained.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: March 26, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Chi Lee, Hsin-Chia Su, Shih-Ting Lin, Yu-Cheng Song, Fu-Shun Ho, Chih-Chun Chen
  • Patent number: 11942632
    Abstract: A positive electrode active material particle includes a core that contains lithium cobalt oxide represented by the following Chemical Formula LiaCo(1-x)MxO2-yAy and a shell that is coated on the surface of the core and contains composite metal oxide of a metal with an oxidation number of +2 and a metal with an oxidation number of +3. In particular, M is at least one selected from the group consisting of Ti, Mg, Zn, Si, Al, Zr, V, Mn, Nb and Ni. A is oxygen-substitutional halogen and 1.00?a?1.05, 0?x?0.05, and 0?y?0.001.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: March 26, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Hyuck Hur, Chi Ho Jo, Bo Ram Lee, Sung bin Park, Young uk Park, Wang Mo Jung
  • Publication number: 20240096769
    Abstract: The disclosure provides a method for manufacturing a semiconductor package assembly, which results in a semiconductor package assembly with a more even distributed stress concentrations, reduced solder crack occurrences and limited solder filler joint connections.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Applicant: NEXPERIA B.V.
    Inventors: Haibo Fan, Zhou Zhou, Chi Ho Leung
  • Publication number: 20240084259
    Abstract: The present invention relates to stem cell-derived mature cardiomyocytes and a cardiovascular disease model using same and, more specifically, to differentiation into mature ventricular cardiomyocytes by culturing stem cells in a medium containing FGF4 and ascorbic acid, and use of the differentiated mature ventricular cardiomyocytes as a cardiovascular disease cell model. The mature ventricular cardiomyocytes, obtained by culturing stem cells in a medium containing FGF4 and ascorbic acid and inducing the differentiation thereof, and cardiovascular disease cell model using same according to the present invention are very useful for screening for cardiovascular disease therapeutic agents and evaluation of the toxicity of new drugs.
    Type: Application
    Filed: November 13, 2019
    Publication date: March 14, 2024
    Applicant: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Do-Sun LIM, Seung Cheol CHOI, Hyung Joon JOO, Jong-Ho KIM, Chi-Yeon PARK, Yongdoo PARK
  • Publication number: 20240088156
    Abstract: A semiconductor device includes at least one fin, a first dielectric layer and a second dielectric layer. The first dielectric layer is disposed on the at least one fin. The second dielectric layer between the at least one fin and the first dielectric layer. A thickness of the first dielectric layer on a sidewall of the at least one fin is less than a thickness of the second dielectric layer on the sidewall of the at least one fin.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-I Lin, Chun-Heng Chen, Ming-Ho Lin, Chi-On Chui
  • Publication number: 20240079584
    Abstract: The present disclosure discloses a positive electrode active material for a lithium secondary battery comprising a secondary particle having an average particle size (D50) of 1 to 15 ?m, formed by agglomeration of at least two primary macro particles having an average particle size (D50) of 0.1 to 3 ?m; and a coating layer of a lithium-metal oxide on a surface of the secondary particle, wherein the primary macro particles are represented by LiaNi1-x-yCoxM1yM2wO2 (1.0?a?1.5, 0?x?0.2, 0?y?0.2, 0?w?0.1, 0?x+y?0.2, M1 includes at least one metal of Mn or Al, and M2 includes at least one metal selected from the group consisting of Ba, Ca, Zr, Ti, Mg, Ta, Nb and Mo), and wherein the lithium-metal oxide is a low-temperature phase LixCoO2(0<x?1) having at least one of a spinel structure (Fd-3m) or a disordered rock-salt structure (Fm-3m).
    Type: Application
    Filed: February 7, 2022
    Publication date: March 7, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Jong-Wook Heo, Ji-Hye Kim, Tae-Gu Yoo, Wang-Mo Jung, Hae-Jung Jung, Chi-Ho Jo
  • Patent number: 11923338
    Abstract: A method includes bonding a first wafer to a second wafer, with a first plurality of dielectric layers in the first wafer and a second plurality of dielectric layers in the second wafer bonded between a first substrate of the first wafer and a second substrate in the second wafer. A first opening is formed in the first substrate, and the first plurality of dielectric layers and the second wafer are etched through the first opening to form a second opening. A metal pad in the second plurality of dielectric layers is exposed to the second opening. A conductive plug is formed extending into the first and the second openings.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai
  • Publication number: 20240071697
    Abstract: A light switch adapter with slight modification to an existing wall light switch turns the existing wall light switch into a smart device by replacing the existing screws with elongated screws. To further secure the adaptation, each of the elongated screw may contain an adapter screw head or fastener or knobbed protrusion that firmly couples the light switch adapter through an opening of the rear side of the light switch adapter. In another embodiment, the opening contains or shaped as a circlip or a C-clip that allows the adapter screw head snap into the opening securely.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Inventors: Chi Ho Hui, Kei Wing Nelson Ho
  • Publication number: 20240065463
    Abstract: A hookless paper hanger adapted for securement of a plastic hook thereto, and a method of assembling same. The hookless paper hanger allows display of a garment on a flat table, while the paper hanger/plastic hook combination allows display of the same item on a hanging rack.
    Type: Application
    Filed: August 23, 2022
    Publication date: February 29, 2024
    Inventors: Leung Ho, Chi Man Leung, Michael W. Dezelon
  • Publication number: 20240069561
    Abstract: A robotic garden tool includes at least one sensor configured to generate signals associated with an object within an operating area. A first electronic processor of the robotic garden tool receives, from the at least one sensor, an obstacle signal associated with an obstacle located within the operating area. The first electronic processor determines a first location of the robotic garden tool at a time corresponding to when the first electronic processor received the obstacle signal. The first electronic processor determines a second location of the obstacle based on the obstacle signal and the first location of the garden tool. The first electronic processor generates mapping information of the operating area that includes a virtual boundary based on the second location of the obstacle. The first electronic processor controls the robotic garden tool in the operating area to remain outside of the virtual boundary based on the mapping information.
    Type: Application
    Filed: August 15, 2023
    Publication date: February 29, 2024
    Inventors: Hei Man Lee, Hok Sum Sam Lai, Man Ho Choi, Ho Lam Ng, Shing Hin Li, Chi Chau Lee, Tat Hei Lai
  • Patent number: 11916126
    Abstract: A semiconductor device includes a substrate and a gate structure. The gate structure is disposed on the substrate, and the gate structure includes a titanium nitride barrier layer a titanium aluminide layer, and a middle layer. The titanium aluminide layer is disposed on the titanium nitride barrier layer, and the middle layer is disposed between the titanium aluminide layer and the titanium nitride barrier layer. The middle layer is directly connected with the titanium aluminide layer and the titanium nitride barrier layer, and the middle layer includes titanium and nitrogen. A concentration of nitrogen in the middle layer is gradually decreased in a vertical direction towards an interface between the middle layer and the titanium aluminide layer.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Hsin Hsu, Huan-Chi Ma, Chien-Wen Yu, Shih-Min Chou, Nien-Ting Ho, Ti-Bin Chen
  • Patent number: 11901618
    Abstract: An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.
    Type: Grant
    Filed: September 6, 2022
    Date of Patent: February 13, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Chia-Ping Tseng, Ker-Yih Kao, Chia-Chi Ho, Ming-Yen Weng, Hung-I Tseng, Shu-Ling Wu, Huei-Ying Chen
  • Publication number: 20240037715
    Abstract: Methods, systems and devices for preventing and/or retarding myopia onset and/or progression are provided. Particularly, the system for preventing and/or retarding myopia onset and/or progression including an eye tracker, a display, a controller, and a dynamic blurring filter for the visual content on the display. The display is first presented to a subject, then the eye tracker is employed to detect the movement and the location of the subject's eyes and generate a tracking signal. The tracking signal is further processed by the controller to determine a gaze point of the subject's eye on the display. Based on the gaze point, a dynamic blurring filter is created and applied onto the display.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 1, 2024
    Inventors: Benjamin Simon THOMPSON, Chi Ho TO, Yan Yin TSE, Ka Man CHUN, Elie Aymard Jonathan DE LESTRANGE-ANGINIEUR
  • Patent number: RE49923
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park