Patents by Inventor Chi Hsiang Hsieh
Chi Hsiang Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240194999Abstract: A robot includes a limit device and an energy storehouse, the limiting device may lock or loosen a battery opened in the energy storehouse, the limiting device includes a first connecting member, a transmission rod, and a second connecting member. The first connecting member includes a first main body portion and two first connecting elements arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod includes a first end and a second end arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member includes two indexing buckles arranged at intervals, each of the indexing buckles includes a first limiting groove and a second limiting groove.Type: ApplicationFiled: February 21, 2024Publication date: June 13, 2024Inventors: CHEN-TING KAO, CHI-CHENG WEN, YU-SHENG CHANG, CHIH-CHENG LEE, CHIUNG-HSIANG WU, SHENG-LI YEN, YU-CHENG ZHANG, CHANG-JU HSIEH, CHEN CHAO
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Patent number: 11996037Abstract: A scan-type display apparatus includes an LED array and a data driver. The LED array has a common anode configuration, and includes multiple scan lines, multiple data lines and multiple LEDs. The data driver includes multiple data driving circuits, each of which includes a current driver and a detector. The current driver has an output terminal connected to the data line corresponding to the data driving circuit, and outputs one of a drive current and a clamp voltage at the output terminal of the current driver based on a pulse width control signal. The detector is connected to the current driver, and generates a detection signal that indicates whether any one of the LEDs connected to the data line corresponding to the data driving circuit is short circuited based on a detection timing signal and a feed-in voltage related to a voltage at the output terminal of the current driver.Type: GrantFiled: December 5, 2022Date of Patent: May 28, 2024Assignee: MACROBLOCK, INC.Inventors: Chi-Min Hsieh, Che-Wei Chang, Chen-Yuan Kuo, Wei-Hsiang Cheng
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Publication number: 20240120812Abstract: An integrated motor and drive assembly is disclosed and includes a housing, a motor and a drive. The housing includes a motor-accommodation portion and a drive-accommodation portion. The drive includes a power board and a control board. The power board is made of a high thermal conductivity substrate and includes a power element and an encoder disposed on the first side, the first side faces the motor, the power board and the motor are stacked along a first direction, and the second side contacts the housing to from a heat-dissipating route. The control board is disposed adjacent to the power board. The control board and the power board are arranged along a second direction perpendicular to the first direction, and the first direction is parallel to an axial direction of the motor. A part of the power board and a part of the control board are directly contacted to form an electrical connection.Type: ApplicationFiled: July 17, 2023Publication date: April 11, 2024Inventors: Chi-Hsiang Kuo, Yi-Yu Lee, Zuo-Ying Wei, Yuan-Kai Liao, Wen-Cheng Hsieh
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Patent number: 11942652Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.Type: GrantFiled: April 13, 2022Date of Patent: March 26, 2024Assignees: Futaijing Precision Electronics (Yantai) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Chen-Ting Kao, Chi-Cheng Wen, Yu-Sheng Chang, Chih-Cheng Lee, Chiung-Hsiang Wu, Sheng-Li Yen, Yu-Cheng Zhang, Chang-Ju Hsieh, Chen Chao
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Patent number: 11929016Abstract: A scan-type display apparatus includes an LED array and a scan driver. The LED array has a common anode configuration, and includes multiple scan lines, multiple data lines and multiple LEDs. The scan driver includes multiple scan driving circuits. Each scan driving circuit includes a voltage generator and a detector. The voltage generator has an output terminal that is connected to the scan line corresponding to the scan driving circuit, and is configured to output one of an input voltage and a clamp voltage at the output terminal of the voltage generator. The detector is connected to the output terminal of the voltage generator, and generates a detection signal that indicates whether any one of the LEDs connected to the scan line corresponding to the scan driving circuit is short circuited based on a voltage at the output terminal of the voltage generator and a detection timing signal.Type: GrantFiled: December 5, 2022Date of Patent: March 12, 2024Assignee: MACROBLOCK, INC.Inventors: Chi-Min Hsieh, Che-Wei Chang, Chen-Yuan Kuo, Wei-Hsiang Cheng
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Publication number: 20180358443Abstract: A silicon carbide (SiC) wafer and a positioning-edge processing method thereof are provided. The SiC wafer has a first flat and a second flat. A first rounded corner is respectively disposed at a connection between two ends of the first flat and an edge of the SiC wafer, wherein the first rounded corner has a radius of 1-10 mm. A second rounded corner is respectively disposed at a connection between two ends of the second flat and the edge of the SiC wafer, wherein the second rounded corner has a radius of 1-10 mm. Since the rounded corners at the connections between two ends of the flats and the wafer edges have optimum radii, the yield and quality of the wafer processing may be improved.Type: ApplicationFiled: December 28, 2017Publication date: December 13, 2018Applicant: GlobalWafers Co., Ltd.Inventors: Chan-Ju Wen, Wei-Kuo Huang, I-Ching Li, Chi-Hsiang Hsieh
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Patent number: 9375821Abstract: A novel polishing pad is described. The polishing pad includes a base plate, a main polishing body, a plurality of metal bottom portions, a positive electrode conductive wire and a negative electrode conductive wire. The main polishing body made from a non-conductive material and disposed on the base plate includes a plurality of cavities thereon. The metal bottom portions are disposed in the cavities with each of the cavities having one of the metal bottom portions therein. The positive electrode conductive wire electrically is connected to a positive electrode of a power supply. The negative electrode conductive wire electrically is connected to a negative electrode of the power supply. The positive electrode conductive wire and the negative electrode conductive wire alternatively pass through the base plate and connect to the metal bottom portions respectively.Type: GrantFiled: May 27, 2012Date of Patent: June 28, 2016Assignee: NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Chao-Chang Chen, Chi Hsiang Hsieh
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Publication number: 20130137263Abstract: A novel polishing pad is described. The polishing pad includes a base plate, a main polishing body, a plurality of metal bottom portions, a positive electrode conductive wire and a negative electrode conductive wire. The main polishing body made from a non-conductive material and disposed on the base plate includes a plurality of cavities thereon. The metal bottom portions are disposed in the cavities with each of the cavities having one of the metal bottom portions therein. The positive electrode conductive wire electrically is connected to a positive electrode of a power supply. The negative electrode conductive wire electrically is connected to a negative electrode of the power supply. The positive electrode conductive wire and the negative electrode conductive wire alternatively pass through the base plate and connect to the metal bottom portions respectively.Type: ApplicationFiled: May 27, 2012Publication date: May 30, 2013Applicant: National Taiwan University of Science and TechnologyInventors: Chao-Chang Chen, Chi Hsiang Hsieh