Abstract: An integrated circuit package including integrated circuit dies with slanted sidewalls and a method of forming are provided. The integrated circuit package may include a first integrated circuit die, a first gap-fill dielectric layer around the first integrated circuit die, a second integrated circuit die underneath the first integrated circuit die, and a second gap-fill dielectric layer around the second integrated circuit die. The first integrated circuit die may include a first substrate, wherein a first angle is between a first sidewall of the first substrate and a bottom surface of the first substrate, and a first interconnect structure on the bottom surface of the first substrate, wherein a second angle is between a first sidewall of the first interconnect structure and the bottom surface of the first substrate. The first angle may be larger than the second angle.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A method for using a processing equipment commercial platform that can be used by a manufacturer-side and a client-side to perform processing equipment selection, quotation and trading through a comprehensive browser or an application program. Because the processing equipment commercial platform is available to the manufacturer-side and the client-side for online use, it can save the communication time and transportation between the manufacturer-side and the client-side personnel, thereby saving time and reducing costs.

Abstract: The present disclosure provides a touch device. The touch device includes a touch panel and an external circuit. The touch panel is configured to detect touch operations. The external circuit is configured to drive the touch panel. A plurality of connection structures extend from edges of the touch panel towards the external circuit. The plurality of connection structures are electrically conductive and are electrically coupled to the external circuit. The connection structures are configured to transmit touch signals from the touch panel to the external circuit.

Abstract: The invention provides a plasma processing device, wherein the upper electrode and the lower electrode are in the vacuum chamber. The chip is placed in the lower electrode. The first plate is placed between the upper electrode and the lower electrode, and the first plate includes a plurality of first voids. The second plate is placed between the first plate and the lower electrode, and the second plate includes a plurality of second voids. The high frequency power is provided by the upper electrode and the lower electrode in the vacuum chamber, and the plasma is generated between the third plate and the upper electrode. The plasma is filtered by the third void, the first void, and the second void.

Abstract: The present disclosure provides a touch device. The touch device includes a touch panel and an external circuit. The touch panel is configured to detect touch operations. The external circuit is configured to drive the touch panel. A plurality of connection structures extend from edges of the touch panel towards the external circuit. The plurality of connection structures are electrically conductive and are electrically coupled to the external circuit. The connection structures are configured to transmit touch signals from the touch panel to the external circuit.

Abstract: A hard disk drive case mounting structure includes a case formed of a top cover shell and a bottom holder shell, an electronic system accommodated in the case, and fasteners each including a female fastening component having an annular head press-fitted in one respective vertical mounting hole at the top cover shell of the case and a split tube-like mating connection socket downwardly extended from the annular head, and a male fastening component having a flat circular head press-fitted into one respective vertical mounting hole at the bottom holder shell of the case and a retaining shank extended from the flat circular head and inserted through one respective mounting through hole at a flat frame member of the electronic system and then fastened to the split tube-like mating connection socket of the female fastening component by means of a hook block.

Abstract: A hard disk drive case mounting structure includes a case formed of a top cover shell and a bottom holder shell, an electronic system accommodated in the case, and fasteners each including a female fastening component having an annular head press-fitted in one respective vertical mounting hole at the top cover shell of the case and a split tube-like mating connection socket downwardly extended from the annular head, and a male fastening component having a flat circular head press-fitted into one respective vertical mounting hole at the bottom holder shell of the case and a retaining shank extended from the flat circular head and inserted through one respective mounting through hole at a flat frame member of the electronic system and then fastened to the split tube-like mating connection socket of the female fastening component by means of a hook block.

Abstract: The invention provides a plasma processing device, wherein the upper electrode and the lower electrode are in the vacuum chamber. The chip is placed in the lower electrode. The first plate is placed between the upper electrode and the lower electrode, and the first plate includes a plurality of first voids. The second plate is placed between the first plate and the lower electrode, and the second plate includes a plurality of second voids. The high frequency power is provided by the upper electrode and the lower electrode in the vacuum chamber, and the plasma is generated between the third plate and the upper electrode. The plasma is filtered by the third void, the first void, and the second void.

Abstract: A method of manufacturing an organic electroluminescent device is provided. First, a substrate and an anode on the substrate are provided, and then, an organic electroluminescent material layer is formed on the anode. Next, a multi-layer transparent cathode is formed on the organic electroluminescent layer. The step of forming the multi-layer transparent cathode comprises performing a co-evaporation process to form a doped buffer layer comprising electron transport materials and dopant so as to distribute the dopant uniformly in the electron transport materials.

Abstract: A customer premises equipment (CPE) for sending location information of the customer premises equipment over the Internet includes a request module, a positioning module, and an address sending module. The request module is configured for determining if a physical location of the CPE needs to be sent based at least partly on a setting or a command from a user, and sending a request message to request the physical location of the CPE. The positioning module is configured for searching positioning coordinates of the CPE according to the request message, and transforming the positioning coordinates to the physical location of the CPE. The address sending module is configured for sending the physical location of the CPE over the Internet.

Abstract: A network communication device establishes a communication connection between a terminal device and an electronic communication network. The network communication device includes a database module, a transceiving module, a determining module, and a connection determining module. The database module stores a plurality of internet protocol (IP) sessions, a maximum number of connections provided for the plurality of IP sessions, and an allowable number of connections provided for the plurality of IP sessions. The transceiving module receives an IP session request sent by the terminal device. The determining module determines an IP session type corresponding to the IP session request. The connection determining module determines if a current connection number of the IP session type corresponding to the IP session request exceeds the maximum number of connections from the plurality of IP sessions and determining whether to establish an IP session connection responding to the IP session request.

Abstract: An organic electroluminescent device includes an anode, an organic electroluminescent material layer, and a multi-layer transparent cathode on a substrate in sequence. The multi-layer transparent cathode has a thin metal layer in the bottom of the transparent cathode, a doped buffer layer on the thin metal layer, and a transparent electrode on the doped buffer layer.