Abstract: A method for fabricating a semiconductor device includes the steps of first forming a shallow trench isolation (STI) in a substrate, forming a first gate structure on the substrate and adjacent to the STI, forming a first doped region between the first gate structure and the STI, forming a second doped region between the first doped region and the first gate structure, forming a first contact plug on the first doped region, and then forming a second contact plug on the second doped region.

Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.

Abstract: Provided are a tank support jig and a tank cleaning method. The tank support jig for supporting a cylindrical tank includes a curved body having a first end and a second end that face with an interval in between; and a connecting member disposed across the interval, the connecting member connecting the first end and the second end of the curved body such that the interval is adjustable, in which the curved body and the connecting member form an annular structure for the tank that is to be placed horizontally inside the annular structure with the curved body in close contact with at least part of an outer circumferential face of the tank along a circumferential direction of the tank.

Abstract: A method of forming an IC structure includes forming first and second power rails at a power rail level. First metal segments are formed at a first metal level above the power rail level. Each first metal segment of the plurality of first metal segments overlap one or both of the first power rail or the second power rail. First vias are formed between the power rail level and the first metal level. Second metal segments are formed at a second metal level above the first metal level. At least one second metal segment of the plurality of second metal segments overlaps the first power rail. At least one second metal segment of the plurality of second metal segments overlaps the second power rail. A plurality of second vias are formed between the first metal level and the second metal level.

Abstract: Methods for revitalizing components of a plasma processing apparatus that includes a sensor for detecting a thickness or roughness of a peeling weakness layer on a protective surface coating of a plasma processing tool and/or for detecting airborne contaminants generated by such peeling weakness layer. The method includes detecting detrimental amounts of peeling weakness layer buildup or airborne concentration of atoms or molecules from the peeling weakness layer, and initiating a revitalization process that bead beats the peeling weakness layer to remove it from the component while maintaining the integrity of the protective surface coating.

Abstract: An aimer is provided. The aimer includes an object lens unit, a body and an eyepiece unit. The body is connected to the object lens unit. The eyepiece unit is connected to the body. The eyepiece unit includes a first pipe, a second pipe, a lens unit and a graduated pattern. The first pipe is connected to the body. The second pipe is connected to the first pipe, wherein the second pipe is rotated to move between a first position and a second position relative to the first pipe. The lens unit is disposed in the second pipe. The graduated pattern is formed on the second pipe.

Abstract: An optical sight includes an outer barrel unit, an objective lens unit, an ocular lens unit, a magnification unit, amounting unit, and a range-finding module. The outer barrel unit extends about an axis and has a front end and a rear end. The objective lens unit is mounted to the front end of the outer barrel unit. The ocular lens unit is mounted to the rear end of the outer barrel unit. The magnification unit is disposed between the objective lens unit and the ocular lens unit. The mounting unit is disposed in the outer barrel unit between the objective lens unit and the magnification unit, and has an outer peripheral surface, and an inner passage extending along the axis. The range-finding module is disposed in the outer barrel unit, and includes a light emitter, a light receiver, and a circuit board unit.

Abstract: An optical sight includes an outer barrel unit, an objective lens unit, an ocular lens unit, a magnification unit, amounting unit, and a range-finding module. The outer barrel unit extends about an axis and has a front end and a rear end. The objective lens unit is mounted to the front end of the outer barrel unit. The ocular lens unit is mounted to the rear end of the outer barrel unit. The magnification unit is disposed between the objective lens unit and the ocular lens unit. The mounting unit is disposed in the outer barrel unit between the objective lens unit and the magnification unit, and has an outer peripheral surface, and an inner passage extending along the axis. The range-finding module is disposed in the outer barrel unit, and includes a light emitter, a light receiver, and a circuit board unit.

Abstract: Multi-function chipset and related design/manufacturing method for realizing different kinds of chipsets respectively supporting accelerated graphic port (AGP) bus and peripheral component interconnect extended (PCI-X) bus. The integrated circuit of the chipset includes both the AGP and PCI-X bus controllers, which share a common I/O pad configuration, and the chipset is selected to be an AGP-supported chipset or a PCI-X supported chipset by pin strapping. Also, the chipset can be packaged with different wire bonding configurations to alternatively realize chipsets supporting AGP bus or PCI-X bus.

Abstract: According to the claimed invention, the computer system has a central processing unit, a north bridge electrically connected to the central processing unit, memory electrically connected to the north bridge, and a south bridge electrically connected to the north bridge, the south bridge having a general purpose serial input/output port. The computer also includes at least one peripheral device electrically connected to the south bridge and an interfacing circuit for providing a plurality of extended general purpose input/output ports, the interfacing circuit having a connection end electrically connected to the general purpose serial input/output port. When inputting a data signal from a general purpose input/output (GPIO) port, the data signal is transmitted to the general purpose serial input/output port through the connection end of the interfacing circuit.

Abstract: According to the claimed invention, the computer system has a central processing unit, a north bridge electrically connected to the central processing unit, memory electrically connected to the north bridge, and a south bridge electrically connected to the north bridge, the south bridge having a general purpose serial input/output port. The computer also includes at least one peripheral device electrically connected to the south bridge and an interfacing circuit for providing a plurality of extended general purpose input/output ports, the interfacing circuit having a connection end electrically connected to the general purpose serial input/output port. When inputting a data signal from a general purpose input/output (GPIO) port, the data signal is transmitted to the general purpose serial input/output port through the connection end of the interfacing circuit.