Abstract: The present invention provides a heat dissipative semiconductor package. The semiconductor package includes a package body in a flat rectangular shape. The semiconductor package further includes a die, a conductive block, multiple metal blocks, a molding layer, and a redistribution layer. A first contact of the die is electrically connected to a first pin. A second contact of the die is electrically connected to a second pin via the redistribution layer and the conductive block. The first pin and the second pin are respectively exposed from the bottom surface of the package body to curve, extend, and cover different side surfaces of the package body. The conductive block and the metal blocks are formed by dicing a same VCB. Heat generated by the die can be effectively dissipated externally through the first pin, the second pin, and the conductive block, and thus cooling the die.

Abstract: A die of the package device is covered by an encapsulation layer, a plurality of lead portions are configured on the bottom surface of the encapsulation layer, a side portion of each lead portion is also exposed on a side surface of the encapsulation layer, and thereby the package device is used as a side-wettable package device; wherein, in a process of manufacturing the package device, a conductive electroplated conducting layer is formed on the surface of the encapsulation layer, and the electroplated conducting layer is used to conduct electric power required during an electroplating process. After the electroplating process is completed, the electroplated conducting layer can be used as a heat dissipation layer for the package device. The heat dissipation layer completely covers the surface of the package device so as to increase heat dissipation area and to be attached by a heat sink.

Abstract: A wafer storage device is provided. The wafer storage device includes a floor, a ceiling, and one or more walls between the floor and the ceiling to define a wafer storage chamber for storage of one or more wafers. The apparatus includes a particle-attraction object, having a positive charge or a negative charge, in the wafer storage chamber and configured to attract particles in the wafer storage chamber.

Abstract: A device includes a substrate including a low-resistance top surface and a fin structure including a first fin and a second fin. Each of the first and second fins includes a low-resistance fin-top surface and two low-resistance sidewall surfaces. The device includes an insulation material over the top surface of the substrate and between the first fin and the second fin. The fin-top surface and a first portion of the sidewall surfaces of each of the first and the second fins are above the insulation material. The device further includes a dielectric layer over the insulation material and in direct contact with the fin-top surface and the first portion of the sidewall surfaces of each of the first and the second fins; a first electrode in direct contact with the fin-top surface of the first fin; and a second electrode over the dielectric layer that is over the second fin.

Abstract: Systems and methods are provided for fabricating semiconductor device structures on a substrate. A first fin structure is formed on a substrate. A second fin structure is formed on the substrate. A first semiconductor material is formed on both the first fin structure and the second fin structure. A second semiconductor material is formed on the first semiconductor material on both the first fin structure and the second fin structure. The first semiconductor material on the first fin structure is oxidized to form a first oxide. The second semiconductor material on the first fin structure is removed. A first dielectric material and a first electrode are formed on the first fin structure. A second dielectric material and a second electrode are formed on the second fin structure.

Abstract: A light source assembly is provided, including a substrate; a light-emitting element disposed on the substrate; and an optical film disposed on the light-emitting element. A diffuser layer is disposed between the optical film and the light-emitting element, wherein a haze of the diffuser layer is greater than 85%, a distance between the diffuser layer and the light-emitting element is in a range from 0 mm to 10 mm, and a thickness of the light-emitting element is less than the distance.

Abstract: A method includes forming a transistor layer; forming a first metallization layer, including: forming first conductors, aligned along alpha tracks, and representing input pins of a cell region including first and second input pins; and cutting lengths of the first and second input pins to accommodate at most two access points, each aligned to a different one of first to fourth beta tracks, the beta tracks to which are aligned the access points of the first input pin being different than the beta tracks to which are aligned the access points of the second input pin; and forming a second metallization layer, including: forming second conductors representing routing segments and a representing a power grid segment aligned with one of the beta tracks of access points of the first input pin or the access points of the second input pin.

Abstract: A method of operating a user device includes: receiving a command from a user to power on the user device; determining whether the user device is located within a restricted zone through accessing a key server located within the restricted zone by a first monitoring entity of the user device before an operating system of the user device is executed, wherein the key server is configured to store a key for encrypting or decrypting the user device; and granting access of the user to the user device by the first monitoring entity in response to determining the user device as being within the restricted zone through successfully accessing the key server.

Abstract: There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.

Abstract: A reordering method performed by a receiving apparatus is provided. The receiving apparatus may receive a first PPDU from a transmitting apparatus, wherein the first PPDU includes a plurality of MPDUs, and the MPDUs correspond to the same BA window. The receiving apparatus may determine a traffic that each of the MPDUs belongs to according to an MPDU identification, wherein traffics that the plurality of MPDUs belonging to include a first traffic and a second traffic which is different from the first traffic. The receiving apparatus may perform a reordering operation for the MPDUs belonging to the first traffic, and a reordering operation for the MPDUs belonging to the second traffic, respectively. The receiving apparatus may transmit a BA frame in response to the first PPDU to the transmitting apparatus, wherein the BA frame includes information for indicating whether the MPDUs in the first PPDU have been successfully received.

Abstract: A device includes a substrate including a low-resistance top surface and a fin structure including a first fin and a second fin. Each of the first and second fins includes a low-resistance fin-top surface and two low-resistance sidewall surfaces. The device includes an insulation material over the top surface of the substrate and between the first fin and the second fin. The fin-top surface and a first portion of the sidewall surfaces of each of the first and the second fins are above the insulation material. The device further includes a dielectric layer over the insulation material and in direct contact with the fin-top surface and the first portion of the sidewall surfaces of each of the first and the second fins; a first electrode in direct contact with the fin-top surface of the first fin; and a second electrode over the dielectric layer that is over the second fin.

Abstract: A method of repairing an oral defect model includes performing a three-dimensional oral defect model obtaining step, a defect cutting line detecting step, a defect point selecting step and a smoothing step. The three-dimensional oral defect model obtaining step is performed to scan an oral cavity to obtain a three-dimensional oral defect model message. The defect cutting line detecting step is performed to detect a defect cutting line of the three-dimension oral defect model message, and drive a displayer to display the defect cutting line. The defect point selecting step is performed to select at least one defect feature point of the defect cutting line via the displayer. The smoothing step is performed to perform a smoothing process at the at least one defect feature point, and convert the three-dimensional oral defect model message into a three-dimensional oral repaired model message to smooth the defect cutting line.

Abstract: A display control integrated circuit (IC) applicable to performing video output (VO) generator reset control in a display device includes multiple sub-circuits such as a VO generator and a display output control circuit. The VO generator generates an input vertical synchronization (IVS) signal for controlling playback of video data. The display output control circuit performs display output control, and more particularly, generates a set of display control signals to control a display output module within the display device to perform display operations. The set of display control signals may include a display vertical synchronization (DVS) signal for being used as timing reference of a timing controller within the display output module. During a time interval between time points when two consecutive pulses carried by the DVS signal appear, the display output control circuit sends a reset signal to the VO generator at an intermediate time point to reset it.

Abstract: A method of repairing an oral defect model includes performing a three-dimensional oral defect model obtaining step, a defect cutting line detecting step, a defect point selecting step and a smoothing step. The three-dimensional oral defect model obtaining step is performed to scan an oral cavity to obtain a three-dimensional oral defect model message. The defect cutting line detecting step is performed to detect a defect cutting line of the three-dimension oral defect model message, and drive a displayer to display the defect cutting line. The defect point selecting step is performed to select at least one defect feature point of the defect cutting line via the displayer. The smoothing step is performed to perform a smoothing process at the at least one defect feature point, and convert the three-dimensional oral defect model message into a three-dimensional oral repaired model message to smooth the defect cutting line.

Abstract: A display panel includes a first substrate, a second substrate, a display medium layer, pixel units, and a light-shielding conductive pattern layer. The first substrate has a first inner surface and a first outer surface, and the first outer surface serves as a display surface of the display panel. The second substrate is disposed opposite to the first substrate and has a second inner surface and a second outer surface. The display medium layer is disposed between the first inner surface and the second inner surface. The pixel units are disposed between the display medium layer and the first inner surface, and at least one of the pixel units includes an active element. The light-shielding conductive pattern layer is disposed between the display medium layer and the second inner surface, at least partially overlaps the active element in a vertical projection direction, and includes a first patterned light-shielding conductive layer and a first patterned low-reflection layer.

Abstract: The present invention discloses an image processing device and an image processing method. The image processing method includes steps of: referring to multiple frames or an auxiliary data associated with the frames to determine whether the frames contain substantially the same frames; selecting the frames according to whether the frames contain substantially the same frames to generate multiple selected frames; and performing video processing on the selected frames. When the frames do not contain substantially the same frames, the selected frames are the same as the frames, and when the frames contain substantially the same frames, the selected frames are part of the frames.

Abstract: A smart diaper sensor, which may be disposed inside a diaper, and may include a sensing element and a wireless RF circuit. The wireless RF circuit may include a transmitter and a wake-up receiver. The wake-up receiver may receive a wake-up signal transmitted from a backend platform to wake up the transmitter. The sensing element may sense the environmental status inside the diaper to generate a sensing signal. The transmitter may receive the sensing signal, and then transmit the sensing signal to the backend platform.

Abstract: The present invention discloses an image processing device and an image processing method. The image processing method includes steps of: referring to multiple frames or an auxiliary data associated with the frames to determine whether the frames contain substantially the same frames; selecting the frames according to whether the frames contain substantially the same frames to generate multiple selected frames; and performing video processing on the selected frames. When the frames do not contain substantially the same frames, the selected frames are the same as the frames, and when the frames contain substantially the same frames, the selected frames are part of the frames.

Abstract: Facility for transferring data over a network between two network endpoints by transferring hash signatures over the network instead the actual data. The hash signatures are pre-generated from local static data and stored in a hash database before any data is transferred between source and destination. The hash signatures are created on both sides of a network at the point where data is local, and the hash database consists of hash signatures of blocks of data that are stored locally. The hash signatures are created using different traversal patterns across local data so that the hash database can represent a larger dataset then the actual physical storage of the local data. If no local data is present, then arbitrary data is generated and then remains static.

Abstract: A display panel includes a first substrate, a second substrate, a display medium layer, pixel units, and a light-shielding conductive pattern layer. The first substrate has a first inner surface and a first outer surface, and the first outer surface serves as a display surface of the display panel. The second substrate is disposed opposite to the first substrate and has a second inner surface and a second outer surface. The display medium layer is disposed between the first inner surface and the second inner surface. The pixel units are disposed between the display medium layer and the first inner surface, and at least one of the pixel units includes an active element. The light-shielding conductive pattern layer is disposed between the display medium layer and the second inner surface, at least partially overlaps the active element in a vertical projection direction, and includes a first patterned light-shielding conductive layer and a first patterned low-reflection layer.