Patents by Inventor Chi-Hsiung Wang
Chi-Hsiung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11970342Abstract: The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.Type: GrantFiled: September 7, 2022Date of Patent: April 30, 2024Assignee: CHROMA ATE INC.Inventors: Chien-Ming Chen, Jui-Hsiung Chen, Chi-Wei Wang
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Publication number: 20240120241Abstract: The present invention provides an electrostatic charge detecting packaging device comprising a carrier, multiple dies, and multiple electrostatic-charge-sensitive components; the carrier has a surface; the dies are mounted on the surface of the carrier; and the electrostatic-charge-sensitive components are mounted on the surface of the carrier; since an electrostatic voltage tolerance of each of the electrostatic-charge-sensitive components is lower than an electrostatic voltage tolerance of each of the dies, accumulated electrostatic charges are more likely to discharge towards the electrostatic-charge-sensitive components than towards the dies, and as such, by electrically testing whether the electrostatic-charge-sensitive components are functioning normally when packaging the dies, the present invention allows personnel to debug for knowing which packaging steps exactly cause more serious problems that lead to damaging electrostatic discharges in the dies.Type: ApplicationFiled: November 30, 2022Publication date: April 11, 2024Inventors: Chung-Hsiung HO, Chien-Chun Wang, Li-Qiang Ye, Chi-Hsueh Li
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Publication number: 20190321238Abstract: A smart diaper sensor, which may be disposed inside a diaper, and may include a sensing element and a wireless RF circuit. The wireless RF circuit may include a transmitter and a wake-up receiver. The wake-up receiver may receive a wake-up signal transmitted from a backend platform to wake up the transmitter. The sensing element may sense the environmental status inside the diaper to generate a sensing signal. The transmitter may receive the sensing signal, and then transmit the sensing signal to the backend platform.Type: ApplicationFiled: October 3, 2018Publication date: October 24, 2019Inventors: HORNG-YUAN SHIH, JEN-SHIUN CHIANG, WEI-BIN YANG, CHI-HSIUNG WANG, YU-CHUAN CHANG, CHENG-WEI YANG
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Publication number: 20160146592Abstract: A spatial motion sensing device and a spatial motion sensing method are provided. The spatial motion sensing device includes an image sensing device, a lens, a diffuser, a reference light source, and an image processor. The diffuser is disposed between the image sensing device and the lens. The reference light source is configured for providing a reference light to the diffuser, and the diffuser guides the reference light to the image sensing device. The lens is configured for imaging scenery onto the diffuser to form an image. The image sensing device receives the optical information of the image and the reference light. The image processor is electrically connected to the image sensing device for analyzing the optical information.Type: ApplicationFiled: November 10, 2015Publication date: May 26, 2016Inventors: Chi-Hsiung WANG, Jui-Hung KAO
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Publication number: 20150200698Abstract: A radio frequency module of a wireless communication device is provided. The radio frequency module is coupled between an antenna and a micro-control unit and includes a radio frequency front-end, a radio frequency integrated circuit, a baseband low-pass filter and a comparator. The radio frequency front-end receives a radio frequency signal through the antenna. The radio frequency integrated circuit receives the radio frequency signal from the radio frequency front-end and converts the radio frequency signal into a baseband signal. The baseband low-pass filter receives the baseband signal from the radio frequency integrated circuit and filters the baseband signal. The comparator compares the filtered baseband signal with a first reference signal and outputs a comparison result signal to the micro-control unit.Type: ApplicationFiled: April 7, 2014Publication date: July 16, 2015Applicant: Climax Technology Co., Ltd.Inventors: Hsiao-Pin LIANG, Meng-Chih LIN, Chi-Hsiung WANG
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Patent number: 7570436Abstract: An optical lens, especially an optical lens for mobile phones or image sensors such as CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) is formed by a two-piece lens featuring high performance, minimized total length and low cost.Type: GrantFiled: February 28, 2007Date of Patent: August 4, 2009Assignee: E-Pin Optical Industry Co., Ltd.Inventors: San-Woei Shyu, Chi-Hsiung Wang
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Patent number: 7540982Abstract: A molding lens with indentations for measuring eccentricity and a method for measuring eccentricity thereof are disclosed. At least one indentation concentric with an optical surface is respectively disposed on a front plane and a rear plane of the molding lens on area outside the optical surface while the indentation is observed by means of a measuring microscope. Moreover, the eccentricity of the molding lens is detected by eccentricity test function of the measuring microscope and the eccentric direction is defined so as to modify the lens mould and replace conventional eccentricity test that uses a transmission eccentric scale indicator in combination with a jig. Thus the cost of test equipment is reduced, test procedure is simplified and efficiency of mould modification is improved. Therefore, it's more convenient to manage manufacturing of the lens.Type: GrantFiled: September 27, 2007Date of Patent: June 2, 2009Assignee: E-Pin Optical Industry Co., Ltd.Inventors: San-Woei Shyu, Chi-Hsiung Wang, Chih-Hsiung Huang
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Patent number: 7460314Abstract: A three piece type optical lens includes a first lens element with positive refractive power, a second lens element with negative refractive power, a third lens element with negative refractive power, an IR cut-off filter and an image sensor arranged along an optical axis in sequence from an object side. The first lens element and the second lens element are both meniscus aspherical lens while a convex surface of the first lens element is on the object side and a convex surface of the second lens is on the image side. The third lens element is an M-shaped aspherical lens whose object side and image side are both M-shaped and a central surface of the optical axis can be a convex surface or a concave surface. A pre-aperture is disposed or a center-aperture is arranged on the optical lens.Type: GrantFiled: February 28, 2007Date of Patent: December 2, 2008Assignee: E-Pin Optical Industry Co., LtdInventors: San-Woei Shyu, Chi-Hsiung Wang
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Publication number: 20080204897Abstract: An optical lens, especially an optical lens for mobile phones or image sensors such as CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) is formed by a two-piece lens featuring high performance, minimized total length and low cost.Type: ApplicationFiled: February 28, 2007Publication date: August 28, 2008Inventors: San-Woei Shyu, Chi-Hsiung Wang
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Publication number: 20080204896Abstract: An optical lens for mobile phones or image sensors such as CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) is formed by a three-piece lens with features of high performance, minimized total length and low cost.Type: ApplicationFiled: February 28, 2007Publication date: August 28, 2008Inventors: San-Woei Shyu, Chi-Hsiung Wang
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Publication number: 20080093759Abstract: A molding lens with indentations for measuring eccentricity and a method for measuring eccentricity thereof are disclosed. At least one indentation concentric with an optical surface is respectively disposed on a front plane and a rear plane of the molding lens on area outside the optical surface while the indentation is observed by means of a measuring microscope. Moreover, the eccentricity of the molding lens is detected by eccentricity test function of the measuring microscope and the eccentric direction is defined so as to modify the lens mould and replace conventional eccentricity test that uses a transmission eccentric scale indicator in combination with a jig. Thus the cost of test equipment is reduced, test procedure is simplified and efficiency of mould modification is improved. Therefore, it's more convenient to manage manufacturing of the lens.Type: ApplicationFiled: September 27, 2007Publication date: April 24, 2008Inventors: San-Woei Shyu, Chi-Hsiung Wang, Chih-Hsiung Huang
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Patent number: 7349161Abstract: A molding lens with indentations for measuring eccentricity and a method for measuring eccentricity thereof are disclosed. At least one indentation concentric with an optical surface is respectively disposed on a front plane and a rear plane of the molding lens on area outside the optical surface while the indentation is observed by means of a measuring microscope. Moreover, the eccentricity of the molding lens is detected by eccentricity test function of the measuring microscope and the eccentric direction is defined so as to modify the lens mold and replace conventional eccentricity test that uses a transmission eccentric scale indicator in combination with a jig. Thus the cost of test equipment is reduced, test procedure is simplified and efficiency of mold modification is improved. Therefore, it's more convenient to manage manufacturing of the lens.Type: GrantFiled: October 20, 2006Date of Patent: March 25, 2008Assignee: E-Pin Optical Industry Co., Ltd.Inventors: San-Woei Shyu, Chi-Hsiung Wang, Chih-Hsiung Huang