Patents by Inventor Chi-Hsiung Yu

Chi-Hsiung Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12005711
    Abstract: The method of the present disclosure includes steps of: (S1) providing a silicon substrate; (S2) arranging and disposing an active component layer by utilizing a first type photomask on at least two high-precision regions of each of a plurality of inkjet print head chip regions on the silicon substrate; (S3) arranging and disposing a passive component layer by utilizing a second type photomask on the active component layer; and (S4) cutting the silicon substrate according to the inkjet print head chip regions so as to form the plurality of narrow type inkjet print head chips.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: June 11, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Rong-Ho Yu, Cheng-Ming Chang, Hsien-Chung Tai, Wen-Hsiung Liao, Chi-Feng Huang, Yung-Lung Han
  • Patent number: 11684463
    Abstract: A method of repairing an oral defect model includes performing a three-dimensional oral defect model obtaining step, a defect cutting line detecting step, a defect point selecting step and a smoothing step. The three-dimensional oral defect model obtaining step is performed to scan an oral cavity to obtain a three-dimensional oral defect model message. The defect cutting line detecting step is performed to detect a defect cutting line of the three-dimension oral defect model message, and drive a displayer to display the defect cutting line. The defect point selecting step is performed to select at least one defect feature point of the defect cutting line via the displayer. The smoothing step is performed to perform a smoothing process at the at least one defect feature point, and convert the three-dimensional oral defect model message into a three-dimensional oral repaired model message to smooth the defect cutting line.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: June 27, 2023
    Assignee: China Medical University
    Inventors: Yen-Wen Shen, Lih-Jyh Fuh, Chi-Hsiung Yu
  • Publication number: 20210220094
    Abstract: A method of repairing an oral defect model includes performing a three-dimensional oral defect model obtaining step, a defect cutting line detecting step, a defect point selecting step and a smoothing step. The three-dimensional oral defect model obtaining step is performed to scan an oral cavity to obtain a three-dimensional oral defect model message. The defect cutting line detecting step is performed to detect a defect cutting line of the three-dimension oral defect model message, and drive a displayer to display the defect cutting line. The defect point selecting step is performed to select at least one defect feature point of the defect cutting line via the displayer. The smoothing step is performed to perform a smoothing process at the at least one defect feature point, and convert the three-dimensional oral defect model message into a three-dimensional oral repaired model message to smooth the defect cutting line.
    Type: Application
    Filed: January 12, 2021
    Publication date: July 22, 2021
    Applicant: China Medical University
    Inventors: Yen-Wen Shen, Lih-Jyh Fuh, Chi-Hsiung Yu