Patents by Inventor Chi-Hsun Hsieh
Chi-Hsun Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967446Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein ?C×Hsat?1800, where ?C is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of ?C0, where ?C0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.Type: GrantFiled: January 4, 2021Date of Patent: April 23, 2024Assignee: CYNTEC CO., LTD.Inventors: Chun-Tiao Liu, Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang
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Publication number: 20230155349Abstract: A semiconductor light emitting device includes a substrate, a first epitaxial structure and a second epitaxial structure, a connecting layer, a first electrode structure, a second electrode structure, and a third electrode structure. The first epitaxial structure and the second epitaxial structure are on the substrate side by side. The connecting layer is between the first epitaxial structure and the substrate, between the second epitaxial structure and the substrate, and between the first epitaxial structure and the second epitaxial structure. The first electrode structure is on the first epitaxial structure away from the substrate. The second electrode structure is on the second epitaxial structure away from the substrate. The third electrode structure is connected to the connecting layer.Type: ApplicationFiled: November 8, 2022Publication date: May 18, 2023Inventors: Shou-Lung CHEN, Hsin-Chan CHUNG, Tzu-Chieh HSU, Chi-Hsun HSIEH
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Publication number: 20230005900Abstract: A chip package structure includes a substrate having a first surface and a second surface being opposite surfaces of the substrate; a housing disposed on the first surface of the substrate and enclosing a chip region; and a chip set disposed in the chip region and electrically connected to the substrate. The chip set includes a first chip and a second chip, and an active surface of the second chip faces the active surface of the first chip.Type: ApplicationFiled: June 30, 2022Publication date: January 5, 2023Inventors: Hsiu-Ju YANG, Hsin-Chan CHUNG, Shou-Lung CHEN, Chi-Hsun HSIEH
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Publication number: 20220158413Abstract: A semiconductor laser includes a base, an epitaxial structure on the base, and a first electrode and a second electrode on the epitaxial structure. The epitaxial structure includes a first semiconductor structure on the base, a second semiconductor structure on the first semiconductor structure, an intermediate layer on the second semiconductor structure, a third semiconductor structure on the intermediate layer, a current-confining layer in the third semiconductor structure, a fourth semiconductor structure on the third semiconductor structure, and an active structure between the third semiconductor structure and the fourth semiconductor structure. The first electrode and the second electrode are on the fourth semiconductor structure, wherein a part of the first electrode passes through the fourth semiconductor structure, the active structure, the current-confining layer and the third semiconductor structure and is connected to the intermediate layer.Type: ApplicationFiled: November 15, 2021Publication date: May 19, 2022Inventors: Bing-Cheng LIN, Shou-Lung CHEN, Chi-Hsun HSIEH, Hsin-Chan CHUNG
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Patent number: 10418361Abstract: An exemplary integrated circuit comprises: a first device gate disposed over the first device region, the first device gate comprising a first interfacial layer and a first dielectric layer; a second device gate disposed over the second device region, the second device gate comprising a second interfacial layer and a second dielectric layer; and a third device gate disposed over the third device region, the third device gate comprising a third interfacial layer and a third dielectric layer, wherein the first interfacial layer, the second interfacial layer, and the third interfacial layer are different from each other in at least one of a thickness and an interfacial material.Type: GrantFiled: June 24, 2016Date of Patent: September 17, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Nien Chen, Bao-Ru Young, Chi-Hsun Hsieh, Harry Hak-Lay Chuang, Wei Cheng Wu, Eric Huang
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Patent number: 10276575Abstract: The present disclosure provides an FET structure including a transistor of a first conductive type. The transistor includes a substrate having a region of a second conductive type, a channel between source and drain, and a gate over the channel. The channel includes dopants of the first conductive type. The gate includes a work function setting layer of the second conductive type. The present disclosure also provides a method for manufacturing an FET with multi-threshold voltages scheme. The method includes exposing channels of a first transistor of a first conductive type and a first transistor of a second conductive type from a first mask, doping the channels with dopants of the first conductive type, exposing channels of a second transistor of the first conductive type and a second conductive type from a second mask, and doping the channels with dopants of the second conductive type.Type: GrantFiled: December 4, 2017Date of Patent: April 30, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Amey Mahadev Walke, Chi-Hsun Hsieh, Che-Min Chu, Yu-Hsuan Kuo
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Publication number: 20180090497Abstract: The present disclosure provides an FET structure including a transistor of a first conductive type. The transistor includes a substrate having a region of a second conductive type, a channel between source and drain, and a gate over the channel. The channel includes dopants of the first conductive type. The gate includes a work function setting layer of the second conductive type. The present disclosure also provides a method for manufacturing an FET with multi-threshold voltages scheme. The method includes exposing channels of a first transistor of a first conductive type and a first transistor of a second conductive type from a first mask, doping the channels with dopants of the first conductive type, exposing channels of a second transistor of the first conductive type and a second conductive type from a second mask, and doping the channels with dopants of the second conductive type.Type: ApplicationFiled: December 4, 2017Publication date: March 29, 2018Inventors: Amey Mahadev Walke, Chi-Hsun Hsieh, Che-Min Chu, Yu-Hsuan Kuo
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Patent number: 9837416Abstract: The present disclosure provides an FET structure including a transistor of a first conductive type. The transistor includes a substrate having a region of a second conductive type, a channel between source and drain, and a gate over the channel. The channel includes dopants of the first conductive type. The gate includes a work function setting layer of the second conductive type. The present disclosure also provides a method for manufacturing an FET with multi-threshold voltages scheme. The method includes exposing channels of a first transistor of a first conductive type and a first transistor of a second conductive type from a first mask, doping the channels with dopants of the first conductive type, exposing channels of a second transistor of the first conductive type and a second conductive type from a second mask, and doping the channels with dopants of the second conductive type.Type: GrantFiled: July 31, 2015Date of Patent: December 5, 2017Assignee: Taiwan Semiconductor Manufacturing Company Ltd.Inventors: Amey Mahadev Walke, Chi-Hsun Hsieh, Che-Min Chu, Yu-Hsuan Kuo
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Publication number: 20170033106Abstract: The present disclosure provides an FET structure including a transistor of a first conductive type. The transistor includes a substrate having a region of a second conductive type, a channel between source and drain, and a gate over the channel. The channel includes dopants of the first conductive type. The gate includes a work function setting layer of the second conductive type. The present disclosure also provides a method for manufacturing an FET with multi-threshold voltages scheme. The method includes exposing channels of a first transistor of a first conductive type and a first transistor of a second conductive type from a first mask, doping the channels with dopants of the first conductive type, exposing channels of a second transistor of the first conductive type and a second conductive type from a second mask, and doping the channels with dopants of the second conductive type.Type: ApplicationFiled: July 31, 2015Publication date: February 2, 2017Inventors: AMEY MAHADEV WALKE, CHI-HSUN HSIEH, CHE-MIN CHU, YU-HSUAN KUO
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Publication number: 20160372462Abstract: An exemplary integrated circuit comprises: a first device gate disposed over the first device region, the first device gate comprising a first interfacial layer and a first dielectric layer; a second device gate disposed over the second device region, the second device gate comprising a second interfacial layer and a second dielectric layer; and a third device gate disposed over the third device region, the third device gate comprising a third interfacial layer and a third dielectric layer, wherein the first interfacial layer, the second interfacial layer, and the third interfacial layer are different from each other in at least one of a thickness and an interfacial material.Type: ApplicationFiled: June 24, 2016Publication date: December 22, 2016Inventors: Po-Nien CHEN, Bao-Ru YOUNG, Chi-Hsun HSIEH, Harry Hak-Lay CHUANG, Wei Cheng WU, Eric HUANG
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Patent number: 9378961Abstract: A method including providing a substrate having a first region, a second region, and a third region defined thereupon. A first interfacial layer is formed over the first region, the second region, and the third region. The first interfacial layer is etched to remove a portion of the first interfacial layer from the first region and a portion of the first interfacial layer from the second region. Etching of the first interfacial layer defines a gate stack within the third region. After the etching of the first interfacial layer, a second interfacial layer is formed over at least a portion of the second region. The second interfacial layer is etched to define a gate stack within the second region. After the etching of the second interfacial layer, a third interfacial layer is formed on the substrate over at least a portion of the first region to define a gate stack within the first region.Type: GrantFiled: May 29, 2015Date of Patent: June 28, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Nien Chen, Bao-Ru Young, Chi-Hsun Hsieh, Harry Hak-Lay Chuang, Wei Cheng Wu, Eric Huang
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Publication number: 20150262825Abstract: A method including providing a substrate having a first region, a second region, and a third region defined thereupon. A first interfacial layer is formed over the first region, the second region, and the third region. The first interfacial layer is etched to remove a portion of the first interfacial layer from the first region and a portion of the first interfacial layer from the second region. Etching of the first interfacial layer defines a gate stack within the third region. After the etching of the first interfacial layer, a second interfacial layer is formed over at least a portion of the second region. The second interfacial layer is etched to define a gate stack within the second region. After the etching of the second interfacial layer, a third interfacial layer is formed on the substrate over at least a portion of the first region to define a gate stack within the first region.Type: ApplicationFiled: May 29, 2015Publication date: September 17, 2015Inventors: Po-Nien Chen, Bao-Ru Young, Chi-Hsun Hsieh, Harry Hak-Lay Chuang, Wei Cheng Wu, Yu-Fang (Eric) Huang
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Patent number: 9048335Abstract: An integrated circuit having multiple different device gate configurations and a method for fabricating the circuit are disclosed. An exemplary embodiment of forming the circuit includes receiving a substrate having a first device region, a second device region, and a third device region. A first interfacial layer is formed over at least a portion of each of the first device region, the second device region, and the third device region. The first interfacial layer is patterned to define a gate stack within the third device region. A second interfacial layer is formed over at least a portion of the second device region. The second interfacial layer is patterned to define a gate stack within the second device region. A third interfacial layer is formed over at least a portion of the first device region. The third interfacial layer defines a gate stack within the first device region.Type: GrantFiled: March 1, 2013Date of Patent: June 2, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Nien Chen, Eric Huang, Chi-Hsun Hsieh, Wei Cheng Wu, Bao-Ru Young, Harry Hak-Lay Chuang
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Publication number: 20140246732Abstract: An integrated circuit having multiple different device gate configurations and a method for fabricating the circuit are disclosed. An exemplary embodiment of forming the circuit includes receiving a substrate having a first device region, a second device region, and a third device region. A first interfacial layer is formed over at least a portion of each of the first device region, the second device region, and the third device region. The first interfacial layer is patterned to define a gate stack within the third device region. A second interfacial layer is formed over at least a portion of the second device region. The second interfacial layer is patterned to define a gate stack within the second device region. A third interfacial layer is formed over at least a portion of the first device region. The third interfacial layer defines a gate stack within the first device region.Type: ApplicationFiled: March 1, 2013Publication date: September 4, 2014Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Nien Chen, Eric Huang, Chi-Hsun Hsieh, Wei Cheng Wu, Bao-Ru Young, Harry Hak-Lay Chuang
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Patent number: 8748952Abstract: A system and method for image sensing is disclosed. An embodiment comprises a substrate with a pixel region, the substrate having a front side and a backside. A co-implant process is performed along the backside of the substrate opposing a photosensitive element positioned along the front side of the substrate. The co-implant process utilizes a first pre-amorphization implant process that creates a pre-amorphization region. A dopant is then implanted wherein the pre-amorphization region retards or reduces the diffusion or tailing of the dopants into the photosensitive region. An anti-reflective layer, a color filter, and a microlens may also be formed over the co-implant region.Type: GrantFiled: May 10, 2013Date of Patent: June 10, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Tsung Chen, Hsun-Ying Huang, Yung-Cheng Chang, Yung-Fu Yeh, Yu-Ping Chen, Chi-Yuan Liang, Shou Shu Lu, Juan-Lin Chen, Jia-Ren Chen, Horng-Daw Shen, Chi-Hsun Hsieh
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Publication number: 20130249037Abstract: A system and method for image sensing is disclosed. An embodiment comprises a substrate with a pixel region, the substrate having a front side and a backside. A co-implant process is performed along the backside of the substrate opposing a photosensitive element positioned along the front side of the substrate. The co-implant process utilizes a first pre-amorphization implant process that creates a pre-amorphization region. A dopant is then implanted wherein the pre-amorphization region retards or reduces the diffusion or tailing of the dopants into the photosensitive region. An anti-reflective layer, a color filter, and a microlens may also be formed over the co-implant region.Type: ApplicationFiled: May 10, 2013Publication date: September 26, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Tsung Chen, Hsun-Ying Huang, Yung-Cheng Chang, Yung-Fu Yeh, Yu-Ping Chen, Chi-Yuan Liang, Shou Shu Lu, Juan-Lin Chen, Jia-Ren Chen, Horng-Daw Shen, Chi-Hsun Hsieh
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Patent number: 8466530Abstract: A system and method for image sensing is disclosed. An embodiment comprises a substrate with a pixel region, the substrate having a front side and a backside. A co-implant process is performed along the backside of the substrate opposing a photosensitive element positioned along the front side of the substrate. The co-implant process utilizes a first pre-amorphization implant process that creates a pre-amorphization region. A dopant is then implanted wherein the pre-amorphization region retards or reduces the diffusion or tailing of the dopants into the photosensitive region. An anti-reflective layer, a color filter, and a microlens may also be formed over the co-implant region.Type: GrantFiled: June 30, 2011Date of Patent: June 18, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Tsung Chen, Hsun-Ying Huang, Yung-Cheng Chang, Yung-Fu Yeh, Yu-Ping Chen, Chi-Yuan Liang, Shou Shu Lu, Juan-Lin Chen, Jia-Ren Chen, Horng-Daw Shen, Chi-Hsun Hsieh
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Publication number: 20130001722Abstract: A system and method for image sensing is disclosed. An embodiment comprises a substrate with a pixel region, the substrate having a front side and a backside. A co-implant process is performed along the backside of the substrate opposing a photosensitive element positioned along the front side of the substrate. The co-implant process utilizes a first pre-amorphization implant process that creates a pre-amorphization region. A dopant is then implanted wherein the pre-amorphization region retards or reduces the diffusion or tailing of the dopants into the photosensitive region. An anti-reflective layer, a color filter, and a microlens may also be formed over the co-implant region.Type: ApplicationFiled: June 30, 2011Publication date: January 3, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Tsung Chen, Hsun-Ying Huang, Yung-Cheng Chang, Yung-Fu Yeh, Yu-Ping Chen, Chi-Yuan Liang, Shou Shu Lu, Juan-Lin Chen, Jia-Ren Chen, Horng-Daw Shen, Chi-Hsun Hsieh
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Patent number: 7371629Abstract: A method is provided for improving Idsat in NMOS and PMOS transistors. A silicon nitride etch stop layer is deposited by a PECVD technique on STI and silicide regions and on sidewall spacers during a MOSFET manufacturing scheme. A dielectric layer is formed on the nitride and then contact holes are fabricated through the dielectric layer and nitride layer to silicide regions and are filled with a metal. For NMOS transistors, silane and NH3 flow rates and a 400° C. temperature are critical in improving NMOS short channel Idsat. Hydrogen content in the nitride is increased by higher NH3 and SiH4 flow rates but does not significantly degrade HCE and Vt. With PMOS transistors, deposition temperature is increased to 550° C. to reduce hydrogen content and improve HCE and Vt stability.Type: GrantFiled: December 9, 2002Date of Patent: May 13, 2008Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Chu-Yun Fu, Chi-Hsun Hsieh, Yi-Ming Sheu, Syun-Ming Jang
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Patent number: 6995064Abstract: A thermal oxidation method for forming a gate dielectric layer for use within a field effect transistor device employs a thermal oxidizing atmosphere comprising a halogen getter material. By employing the halogen getter material, the field effect transistor device is formed with enhanced performance, in particular with respect to negative bias temperature instability lifetime.Type: GrantFiled: March 30, 2004Date of Patent: February 7, 2006Assignee: Taiwan Semiconductor Manufacturing Co., LtdInventors: Ching-Chen Hao, Chao-Chi Chen, Chih-Heng Shen, Chi-Hsun Hsieh