Patents by Inventor Chi-hsun Li

Chi-hsun Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060146262
    Abstract: A method to improve the effect of the overflow of the anisotropic conductive film has the steps of providing guide blocks on electrodes of a panel or on a flexible printing circuit (FPC) or on both of them, and then processing a bonding process of the flexible printing circuit (FPC) to melt a conductive film between the flexible printing circuit (FPC) and the panel. The melted conductive film is restricted by the guide blocks to flow to the electrodes and to cover them.
    Type: Application
    Filed: January 3, 2005
    Publication date: July 6, 2006
    Inventors: Chun-Wei Yu, Chi-hsun Li, Kuo-Chuan Huang