Patents by Inventor Chi-Huan Lo

Chi-Huan Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyimide film incorporating polyimide powder delustrant, and manufacture thereof
    Patent number: 9267057
    Abstract: A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: February 23, 2016
    Assignee: TAIMIDE TECHNOLOGY INCORPORATED
    Inventors: Chung-Yi Chen, Chih-Wei Lin, Chi-Huan Lo, Shihan Tai
  • BLACK POLYIMIDE FILM AND PROCESSING METHOD THEREOF
    Publication number: 20150072158
    Abstract: A black polyimide film includes a polyimide polymer formed by reaction of diamine monomers with dianhydride monomers, and a carbon black having an oxygen-to-carbon weight ratio higher than 11%. The black polyimide film can prevent flaking of carbon black when it is subject to an etching process, and exhibit desirable characteristics of extension rate and insulation.
    Type: Application
    Filed: June 30, 2014
    Publication date: March 12, 2015
    Inventors: Chih-Wei LIN, Chi-Huan LO
  • POLYIMIDE FILM INCORPORATING POLYIMIDE POWDER DELUSTRANT, AND MANUFACTURE THEREOF
    Publication number: 20140050935
    Abstract: A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films.
    Type: Application
    Filed: October 22, 2013
    Publication date: February 20, 2014
    Applicant: TAIMIDE TECHNOLOGY INCORPORATION
    Inventors: Chung-Yi CHEN, Chih-Wei LIN, Chi-Huan LO, Shihan TAI
  • Multilayer Polyimide-Containing Film and Manufacturing Method Thereof
    Publication number: 20130065033
    Abstract: A multilayer polyimide-containing film comprises a coloring layer containing a pigment, and a first protection layer disposed on one surface of the coloring layer, the first protection layer having a thickness between about 0.5 and about 3 micrometers. In some embodiments, methods of manufacturing the multilayer polyimide-containing film are also described.
    Type: Application
    Filed: June 29, 2012
    Publication date: March 14, 2013
    Applicant: TAIMIDE TECHNOLOGY INCORPORATED
    Inventors: Paul S. C. WU, Chi-Huan Lo, Ching-Wen Yu, Chung-Yi Chen, Sheng-Yu Huang, Cheng-Han Chen WU, Wen-Hsuan Chung