Patents by Inventor Chi Hung HO

Chi Hung HO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11957722
    Abstract: The present invention discloses an anti-aging composition, which includes: (a) isolated lactic acid bacterial strains or a fermented product thereof; and (b) an excipient, a diluent, or a carrier; wherein the isolated lactic acid bacterial strains include: Bifidobacterium bifidum VDD088 strains, Bifidobacterium breve Bv-889 strains, and Bifidobacterium longum BLI-02 strains. The present invention further provides a method for preventing aging by administering the foregoing anti-aging composition to a subject in need thereof.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: April 16, 2024
    Assignee: GLAC BIOTECH CO., LTD
    Inventors: Hsieh-Hsun Ho, Yi-Wei Kuo, Wen-Yang Lin, Jia-Hung Lin, Yen-Yu Huang, Chi-Huei Lin, Shin-Yu Tsai
  • Patent number: 11935804
    Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
  • Patent number: 11923337
    Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: March 5, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chi-Ching Ho, Bo-Hao Ma, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu, Hong-Da Chang
  • Publication number: 20160008878
    Abstract: A mold for making a workpiece is shown performing the steps of positioning a workpiece in a cavity of the mold, moving a first mold piece and a second mold piece towards a closed configuration with an extending wall of the first mold piece pressing into a peripheral portion of the workpiece so as to hold the workpiece between the first and second mold pieces, wherein a space is defined between the workpiece and a surface of the first mold piece in the closed configuration, the space receiving a molding material so as to form at least a second layer of the workpiece, and pressing the extending wall of the first mold piece into the peripheral portion of the workpiece to form a seal between the extending wall and the workpiece to prevent flow of a fluid through the seal. Moveable pieces for such a mold are shown.
    Type: Application
    Filed: September 19, 2015
    Publication date: January 14, 2016
    Inventors: Chi Hung Kevin LIU, Chi Hung HO
  • Publication number: 20140057126
    Abstract: A method of manufacturing a workpiece with multiple metal layers is disclosed as including steps (a) providing a mold with at least a runner and a cavity, (b) providing in the cavity of the mold a first metal layer made of a first metal, the first metal layer having a surface which is roughened and/or includes an engagement structure, and (c) injecting a molten second metal onto the surface of the first metal layer to form a second metal layer on the first metal layer in which the second metal layer engages with the roughened surface of the first metal layer or with the engagement structure of the surface of the first metal layer, and the molten second metal enters the cavity of the mold at a speed of at least 70 meters per second (m/s).
    Type: Application
    Filed: October 29, 2013
    Publication date: February 27, 2014
    Applicants: (Dongguan) Grand Fame Industrial Limited, Zoltrix Material (Guangzhou) Limited
    Inventors: Chi Hung Kevin LIU, Chi Hung HO
  • Publication number: 20140054001
    Abstract: A method of manufacturing a workpiece with multiple metal layers is disclosed as including steps (a) providing a mold with at least a runner and a cavity, (b) providing in the cavity of the mold a first metal layer made of a first metal, the first metal layer having a surface which is roughened and/or includes an engagement structure, and (c) injecting a molten second metal onto the surface of the first metal layer to form a second metal layer on the first metal layer in which the second metal layer engages with the roughened surface of the first metal layer or with the engagement structure of the surface of the first metal layer, and the molten second metal enters the cavity of the mold at a speed of at least 70 meters per second (m/s).
    Type: Application
    Filed: October 29, 2013
    Publication date: February 27, 2014
    Applicants: (DONGGUAN) GRAND FAME INDUSTRIAL ZONE, ZOLTRIX MATERIAL (GUANGZHOU) LIMITED
    Inventors: Chi Hung Kevin LIU, Chi Hung HO
  • Publication number: 20120298324
    Abstract: A method and a device for manufacturing a cover including multiple metal layers are provided. The method includes: injecting a second metal in liquid form which is a metal different from a first metal layer onto a semi-finished cover disposed in a mold and formed of the first metal layer, so as to form a second metal layer on the first metal layer; and pressing the second metal layer with a pressure in the mold. Not only does the multi-layer metal cover manufactured according to the method have the strength and elasticity of a composite metal, but also subsequent surface treatment may be performed on the metal cover as required, such as anodizing surface treatment, and corrosion resistant treatment, to further improve the adhesiveness between metal layers, the strength and the corrosion resistance, and make the design of the cover more flexible.
    Type: Application
    Filed: July 20, 2012
    Publication date: November 29, 2012
    Applicants: Dongguan Grand Fame Industry, Zoltrix Material (Guangzhou) Limited
    Inventors: Chi Hung Kevin Liu, Chi Hung Ho
  • Publication number: 20120193061
    Abstract: A method and a device for manufacturing a cover including multiple metal layers are provided. The method includes: injecting a second metal in liquid form which is a metal different from a first metal layer onto a semi-finished cover disposed in a mold and formed of the first metal layer, so as to form a second metal layer on the first metal layer; and pressing the second metal layer with a pressure in the mold. Not only does the multi-layer metal cover manufactured according to the method have the strength and elasticity of a composite metal, but also subsequent surface treatment may be performed on the metal cover as required, such as anodizing surface treatment, and corrosion resistant treatment, to further improve the adhesiveness between metal layers, the strength and the corrosion resistance, and make the design of the cover more flexible.
    Type: Application
    Filed: October 20, 2011
    Publication date: August 2, 2012
    Applicants: DONGGUAN GRAND FAME INDUSTRY, ZOLTRIX MATERIAL (GUANGZHOU) LIMITED
    Inventors: Chi Hung Kevin LIU, Chi Hung HO