Patents by Inventor Chi-Hung PAN

Chi-Hung PAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Driving method for display panel and related source operational amplifier
    Publication number: 20240420612
    Abstract: A driving method includes steps of: providing a source operational amplifier (SOP) to drive a display element; operating the SOP at a first bias current value when the display element is refreshed with a first refresh rate; and operating the SOP at a second bias current value different from the first bias current value when the display element is refreshed with a second refresh rate different from the first refresh rate.
    Type: Application
    Filed: April 22, 2024
    Publication date: December 19, 2024
    Applicant: NOVATEX Microelectronics Corp
    Inventors: Po-Sheng Liao, Chi-Hung Lin, Shih-Hsiang Pan
  • Semiconductor device package having an underfill barrier
    Patent number: 10217649
    Abstract: A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: February 26, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jin-Yuan Lai, Tang-Yuan Chen, Ying-Xu Lu, Dao-Long Chen, Kwang-Lung Lin, Chih-Pin Hung, Tse-Chuan Chou, Ming-Hung Chen, Chi-Hung Pan
  • SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER
    Publication number: 20180358238
    Abstract: The present disclosure relates to a semiconductor device package comprising a substrate, a semiconductor device, and a underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.
    Type: Application
    Filed: June 9, 2017
    Publication date: December 13, 2018
    Inventors: Jin-Yuan LAI, Tang-Yuan CHEN, Ying-Xu LU, Dao-Long CHEN, Kwang-Lung LIN, Chih-Pin HUNG, Tse-Chuan CHOU, Ming-Hung CHEN, Chi-Hung PAN