Patents by Inventor Chi Hung Yuen
Chi Hung Yuen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12027179Abstract: A thermally assisted magnetic head includes a slider having a slider substrate and a magnetic head part, and a light source unit having a laser diode and a sub-mount. The magnetic head part includes a medium-opposite surface, a light source-opposite surface, and a slider-front end surface. The sub-mount includes a joined-end surface and a mount-front end surface, the laser diode includes an electrode surface and an LD-front end surface. The light source unit includes a shift joined structure which the laser diode is joined to a shift area of the joined-end surface, and the light source unit is mounted on the slider substrate so that the electrode surface intersects with a laminated surface of the magnetic head part. The shift area is set in a position which is shifted so that the LD-front end surface is away from the slider-front end surface than the mount-front end surface.Type: GrantFiled: May 26, 2023Date of Patent: July 2, 2024Assignee: SAE MAGNETICS (H.K.) LTD.Inventors: Seiichi Takayama, Ryuji Fujii, Yasutoshi Fujita, Ka Yip Wong, Chi Hung Yuen
-
Patent number: 11763842Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap between an electrode surface of the laser diode and the flexure, and being in unmelted-solid condition.Type: GrantFiled: May 12, 2022Date of Patent: September 19, 2023Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Ka Yip Wong, Chi Hung Yuen, Ryo Hosoi, Seiichi Takayama
-
Patent number: 11749302Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.Type: GrantFiled: May 12, 2022Date of Patent: September 5, 2023Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Ka Yip Wong, Chi Hung Yuen, Ryo Hosoi, Seiichi Takayama
-
Patent number: 11626133Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.Type: GrantFiled: March 30, 2022Date of Patent: April 11, 2023Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Ka Yip Wong, Chi Hung Yuen, Ryo Hosoi, Seiichi Takayama
-
Patent number: 9036301Abstract: A slider includes a substrate having a trailing edge, a leading edge opposite the trailing edge, and an air bearing surface connecting the trailing edge with the leading edge; a read/write transducer formed at the trailing edge; and a coat layer attached on the trailing edge and covering on the read/write transducer. The slider further includes a protection layer for shielding the read/write transducer thereby preventing the read/write transducer from damaging during a laser soldering process. The present invention can prevent the read/write transducer from damaging during the laser bonding process and, in turn improve the reading and writing performance of the slider. The invention also discloses an HGA and a disk drive unit.Type: GrantFiled: August 31, 2011Date of Patent: May 19, 2015Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Shen kuang sidney Chou, Chi hung Yuen, Yan bin Wang, Li ping Peng, Lu Xiao
-
Patent number: 8810965Abstract: A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.Type: GrantFiled: February 19, 2013Date of Patent: August 19, 2014Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Li ping Peng, Shen kuang Sidney Chou, Chi hung Yuen, Yan bin Wang, Lu Xiao
-
Publication number: 20140198411Abstract: A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.Type: ApplicationFiled: February 19, 2013Publication date: July 17, 2014Applicant: SAE Magnetics (H.K.) Ltd.Inventors: Li ping PENG, Shen kuang Sidney CHOU, Chi hung YUEN, Yan bin WANG, Lu Xiao
-
Patent number: 8422170Abstract: A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.Type: GrantFiled: September 21, 2011Date of Patent: April 16, 2013Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Shen kuang Sidney Chou, Chi hung Yuen, Yan bin Wang, Shu ming Zhang, Bin Zhao, Ming liang Lin
-
Publication number: 20130070369Abstract: A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.Type: ApplicationFiled: September 21, 2011Publication date: March 21, 2013Applicant: SAE Magnetics (H.K.) Ltd.Inventors: Shen kuang sidney CHOU, Chi hung Yuen, Yan bin Wang, Shu ming Zhang, Bin Zhao, Ming liang Lin
-
Publication number: 20130050877Abstract: A slider includes a substrate having a trailing edge, a leading edge opposite the trailing edge, and an air bearing surface connecting the trailing edge with the leading edge; a read/write transducer formed at the trailing edge; and a coat layer attached on the trailing edge and covering on the read/write transducer. The slider further includes a protection layer for shielding the read/write transducer thereby preventing the read/write transducer from damaging during a laser soldering process. The present invention can prevent the read/write transducer from damaging during the laser bonding process and, in turn improve the reading and writing performance of the slider. The invention also discloses an HGA and a disk drive unit.Type: ApplicationFiled: August 31, 2011Publication date: February 28, 2013Applicant: SAE Magnetics (H.K.) Ltd.Inventors: Shen kuang Sidney CHOU, Chi hung YUEN, Yan bin WANG, Li ping PENG, Lu XIAO
-
Patent number: 7733609Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.Type: GrantFiled: December 8, 2006Date of Patent: June 8, 2010Assignee: Sae Magnetics (H.K.) Ltd.Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Kai Wu
-
Patent number: 7701673Abstract: A gimbal design for a hard disk drive are disclosed. In one embodiment, a gimbal tongue is supported by a gimbal cross bar coupled to a suspension body by a pair of gimbal struts. A pair of grounding pads are mounted on either side of the leading edge of the gimbal tongue. A first limiter tab is coupled to the leading edge of the gimbal tongue and a second limiter tab is coupled to the trailing edge of the gimbal tongue. Notches on either side of the trailing edge limiter tab increase the strength of the tab. One or more cutouts allow the slider to be electrically coupled to bonding pads on the opposite side of the gimbal tongue. Angled slots at the juncture of the gimbal cross bar and the gimbal tongue relieve stress on the gimbal.Type: GrantFiled: May 17, 2005Date of Patent: April 20, 2010Assignee: SAE Magnetics (HK) Ltd.Inventors: Jeffery L. Wang, Hai Ming Zhou, Chi Hung Yuen, Yen Fu, Hong Tian
-
Publication number: 20080002303Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.Type: ApplicationFiled: December 8, 2006Publication date: January 3, 2008Inventors: Jeffery Wang, Takehiro Kamigama, Chi Hung Yuen, Kai Wu
-
Patent number: 7299536Abstract: A system and method for an improved magnetic head arm assembly (HAA), reducing complexity of design and difficulty of manufacture, is disclosed.Type: GrantFiled: April 6, 2006Date of Patent: November 27, 2007Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Liu Jun Zhang
-
Patent number: 7165314Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.Type: GrantFiled: March 16, 2004Date of Patent: January 23, 2007Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Kai Wu
-
Patent number: 7142394Abstract: A system and method for an improved magnetic head arm assembly (HAA), reducing complexity of design and difficulty of manufacture, is disclosed.Type: GrantFiled: August 13, 2003Date of Patent: November 28, 2006Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Liu Jun Zhang
-
Publication number: 20060262456Abstract: A gimbal design for a hard disk drive are disclosed. In one embodiment, a gimbal tongue is supported by a gimbal cross bar coupled to a suspension body by a pair of gimbal struts. A pair of grounding pads are mounted on either side of the leading edge of the gimbal tongue. A first limiter tab is coupled to the leading edge of the gimbal tongue and a second limiter tab is coupled to the trailing edge of the gimbal tongue. Notches on either side of the trailing edge limiter tab increase the strength of the tab. One or more cutouts allow the slider to be electrically coupled to bonding pads on the opposite side of the gimbal tongue. Angled slots at the juncture of the gimbal cross bar and the gimbal tongue relieve stress on the gimbal.Type: ApplicationFiled: May 17, 2005Publication date: November 23, 2006Inventors: Jeffery Wang, Hai Ming Zhou, Chi Hung Yuen, Yen Fu, Hong Tian
-
Patent number: 6937443Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.Type: GrantFiled: March 13, 2002Date of Patent: August 30, 2005Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Kai Wu
-
Patent number: 6847507Abstract: A head actuator mechanism and a method of manufacture for that mechanism are disclosed. The head actuator mechanism includes a head gimbal assembly coupled to the top support face of a bearing assembly and an actuator driving mechanism coupled to the opposite support face. The head gimbal assembly includes an actuator arm and a load beam, the actuator arm being mounted to the top support face. The actuator driving assembly includes a driving coil and a coil holder frame. The driving coil is positioned in a magnetic field created by a magnetic block and yoke.Type: GrantFiled: January 31, 2003Date of Patent: January 25, 2005Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Jeffery L. Wang, Chi Hung Yuen, Liu Jun Zhang, Ji Yang, Yiu Sing Ho
-
Publication number: 20040250412Abstract: A head actuator mechanism and a method of manufacture for that mechanism are disclosed. The head actuator mechanism includes a head gimbal assembly coupled to the top support face of a bearing assembly and an actuator driving mechanism coupled to the opposite support face. The head gimbal assembly includes an actuator arm and a load beam, the actuator arm being mounted to the top support face. The actuator driving assembly includes a driving coil and a coil holder frame. The driving coil is positioned in a magnetic field created by a magnetic block and yoke.Type: ApplicationFiled: July 19, 2004Publication date: December 16, 2004Inventors: Jeffery L. Wang, Chi Hung Yuen, Liu Jun Zhang, Ji Yang, Yiu Sing Ho