Patents by Inventor Chi Hung Yuen

Chi Hung Yuen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11763842
    Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap between an electrode surface of the laser diode and the flexure, and being in unmelted-solid condition.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: September 19, 2023
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ka Yip Wong, Chi Hung Yuen, Ryo Hosoi, Seiichi Takayama
  • Patent number: 11749302
    Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: September 5, 2023
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ka Yip Wong, Chi Hung Yuen, Ryo Hosoi, Seiichi Takayama
  • Patent number: 11626133
    Abstract: A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: April 11, 2023
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ka Yip Wong, Chi Hung Yuen, Ryo Hosoi, Seiichi Takayama
  • Patent number: 9036301
    Abstract: A slider includes a substrate having a trailing edge, a leading edge opposite the trailing edge, and an air bearing surface connecting the trailing edge with the leading edge; a read/write transducer formed at the trailing edge; and a coat layer attached on the trailing edge and covering on the read/write transducer. The slider further includes a protection layer for shielding the read/write transducer thereby preventing the read/write transducer from damaging during a laser soldering process. The present invention can prevent the read/write transducer from damaging during the laser bonding process and, in turn improve the reading and writing performance of the slider. The invention also discloses an HGA and a disk drive unit.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: May 19, 2015
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Shen kuang sidney Chou, Chi hung Yuen, Yan bin Wang, Li ping Peng, Lu Xiao
  • Patent number: 8810965
    Abstract: A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: August 19, 2014
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Li ping Peng, Shen kuang Sidney Chou, Chi hung Yuen, Yan bin Wang, Lu Xiao
  • Publication number: 20140198411
    Abstract: A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.
    Type: Application
    Filed: February 19, 2013
    Publication date: July 17, 2014
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Li ping PENG, Shen kuang Sidney CHOU, Chi hung YUEN, Yan bin WANG, Lu Xiao
  • Patent number: 8422170
    Abstract: A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: April 16, 2013
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Shen kuang Sidney Chou, Chi hung Yuen, Yan bin Wang, Shu ming Zhang, Bin Zhao, Ming liang Lin
  • Publication number: 20130070369
    Abstract: A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 21, 2013
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Shen kuang sidney CHOU, Chi hung Yuen, Yan bin Wang, Shu ming Zhang, Bin Zhao, Ming liang Lin
  • Publication number: 20130050877
    Abstract: A slider includes a substrate having a trailing edge, a leading edge opposite the trailing edge, and an air bearing surface connecting the trailing edge with the leading edge; a read/write transducer formed at the trailing edge; and a coat layer attached on the trailing edge and covering on the read/write transducer. The slider further includes a protection layer for shielding the read/write transducer thereby preventing the read/write transducer from damaging during a laser soldering process. The present invention can prevent the read/write transducer from damaging during the laser bonding process and, in turn improve the reading and writing performance of the slider. The invention also discloses an HGA and a disk drive unit.
    Type: Application
    Filed: August 31, 2011
    Publication date: February 28, 2013
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Shen kuang Sidney CHOU, Chi hung YUEN, Yan bin WANG, Li ping PENG, Lu XIAO
  • Patent number: 7733609
    Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: June 8, 2010
    Assignee: Sae Magnetics (H.K.) Ltd.
    Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Kai Wu
  • Patent number: 7701673
    Abstract: A gimbal design for a hard disk drive are disclosed. In one embodiment, a gimbal tongue is supported by a gimbal cross bar coupled to a suspension body by a pair of gimbal struts. A pair of grounding pads are mounted on either side of the leading edge of the gimbal tongue. A first limiter tab is coupled to the leading edge of the gimbal tongue and a second limiter tab is coupled to the trailing edge of the gimbal tongue. Notches on either side of the trailing edge limiter tab increase the strength of the tab. One or more cutouts allow the slider to be electrically coupled to bonding pads on the opposite side of the gimbal tongue. Angled slots at the juncture of the gimbal cross bar and the gimbal tongue relieve stress on the gimbal.
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: April 20, 2010
    Assignee: SAE Magnetics (HK) Ltd.
    Inventors: Jeffery L. Wang, Hai Ming Zhou, Chi Hung Yuen, Yen Fu, Hong Tian
  • Publication number: 20080002303
    Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.
    Type: Application
    Filed: December 8, 2006
    Publication date: January 3, 2008
    Inventors: Jeffery Wang, Takehiro Kamigama, Chi Hung Yuen, Kai Wu
  • Patent number: 7299536
    Abstract: A system and method for an improved magnetic head arm assembly (HAA), reducing complexity of design and difficulty of manufacture, is disclosed.
    Type: Grant
    Filed: April 6, 2006
    Date of Patent: November 27, 2007
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Liu Jun Zhang
  • Patent number: 7165314
    Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.
    Type: Grant
    Filed: March 16, 2004
    Date of Patent: January 23, 2007
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Kai Wu
  • Patent number: 7142394
    Abstract: A system and method for an improved magnetic head arm assembly (HAA), reducing complexity of design and difficulty of manufacture, is disclosed.
    Type: Grant
    Filed: August 13, 2003
    Date of Patent: November 28, 2006
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Liu Jun Zhang
  • Publication number: 20060262456
    Abstract: A gimbal design for a hard disk drive are disclosed. In one embodiment, a gimbal tongue is supported by a gimbal cross bar coupled to a suspension body by a pair of gimbal struts. A pair of grounding pads are mounted on either side of the leading edge of the gimbal tongue. A first limiter tab is coupled to the leading edge of the gimbal tongue and a second limiter tab is coupled to the trailing edge of the gimbal tongue. Notches on either side of the trailing edge limiter tab increase the strength of the tab. One or more cutouts allow the slider to be electrically coupled to bonding pads on the opposite side of the gimbal tongue. Angled slots at the juncture of the gimbal cross bar and the gimbal tongue relieve stress on the gimbal.
    Type: Application
    Filed: May 17, 2005
    Publication date: November 23, 2006
    Inventors: Jeffery Wang, Hai Ming Zhou, Chi Hung Yuen, Yen Fu, Hong Tian
  • Patent number: 6937443
    Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: August 30, 2005
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Kai Wu
  • Patent number: 6847507
    Abstract: A head actuator mechanism and a method of manufacture for that mechanism are disclosed. The head actuator mechanism includes a head gimbal assembly coupled to the top support face of a bearing assembly and an actuator driving mechanism coupled to the opposite support face. The head gimbal assembly includes an actuator arm and a load beam, the actuator arm being mounted to the top support face. The actuator driving assembly includes a driving coil and a coil holder frame. The driving coil is positioned in a magnetic field created by a magnetic block and yoke.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: January 25, 2005
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Jeffery L. Wang, Chi Hung Yuen, Liu Jun Zhang, Ji Yang, Yiu Sing Ho
  • Publication number: 20040250412
    Abstract: A head actuator mechanism and a method of manufacture for that mechanism are disclosed. The head actuator mechanism includes a head gimbal assembly coupled to the top support face of a bearing assembly and an actuator driving mechanism coupled to the opposite support face. The head gimbal assembly includes an actuator arm and a load beam, the actuator arm being mounted to the top support face. The actuator driving assembly includes a driving coil and a coil holder frame. The driving coil is positioned in a magnetic field created by a magnetic block and yoke.
    Type: Application
    Filed: July 19, 2004
    Publication date: December 16, 2004
    Inventors: Jeffery L. Wang, Chi Hung Yuen, Liu Jun Zhang, Ji Yang, Yiu Sing Ho
  • Publication number: 20040237289
    Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.
    Type: Application
    Filed: March 16, 2004
    Publication date: December 2, 2004
    Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Kai Wu