Abstract: A high-efficiency matrix-type LED device comprises an epitaxial wafer on which a plurality of independently insulated LEDs are formed by a method of manufacturing integrated circuits; and a conducting line mounted on each one of the LEDs by an evaporation method for forming a large-sized matrix-type LED unit capable of increasing brightness, simplifying manufacturing procedure, and saving manufacturing cost effectively. In addition, a sub-mount having a two-way Zener diode embedded therein is applied to the matrix-type LED unit. By mounting the matrix-type LED unit on the sub-mount, the two-way Zener diode can protect the LEDs against damage from electrostatic discharge (ESD) so as to increase lifetime of LEDs.

Abstract: A submount holder for flip chip packaging of light emitting diode (LED) includes a substrate on which a body is formed. The submount body defines a cavity sized and shaped to snugly receive an LED die therein. The cavity precisely retains the die in position and prevents the die from arbitrary movement during a packaging and wiring process. First and second connection sections are formed on opposite sides of the cavity and respectively connected to the cavity by a channel. A conductively layer is formed on the substrate in the cavity, the first and second connection sections and the channels connecting the connection sections and the cavity. A groove is defined in the body and extends through the cavity with the connection sections located on opposite sides of the groove. The conductive layer is divided by the groove into separated and isolated portions.