Abstract: Disclosed are optical detection device, system, and method which increase photodetection area and enables omnidirectional and self-aligning photodetection through the use of a fluorescent lens. An optical detection device comprises a fluorescent lens having a light collecting area being a spherical, hemispherical, or cylindrical surface of the fluorescent lens, and a light outcoupling area; and a fluorophore dispersed throughout the light collection area and the fluorescent lens, wherein the fluorophore is excitable by a light beam, which is incident at any position or angle in relation to the spherical surface, to produce a light emission, wherein the light outcoupling area is arranged to allow an extraction of the light emission from the fluorescent lens, wherein the light collecting area is larger than the light outcoupling area.

Abstract: A light emitting device, a method of fabricating a light emitting device and a method of controlling light emission. The light emitting device includes a plasmonic structure. The plasmonic structure is configured to have a plurality of localized surface plasmon resonances. The light emitting device also includes a broadband light emitting layer having an emission spectrum substantially overlapping wavelengths of the localized surface plasmon resonances. A spacer layer is disposed between the plasmonic structure and the broadband light emitting layer. A color of light emitted by the broadband light emitting layer is tunable by the localized surface plasmon resonances of the plasmonic structure.

Abstract: The present invention discloses a wireless perception system energy and information transmission method of an unmanned aerial vehicle (UAV) swarm, comprising: building a wireless perception system architecture based on multi-UAV energy supply, wherein the system comprises a plurality of wireless powered sensors and a UAV swarm, and each sensor establishes connection with a UAV based on random access to realize network construction; designing energy and information transmission protocols in the swarm and between the swarm and the sensors, designing a joint optimization algorithm and solving optimal system configuration to obtain optimal transmission strategies. The present invention firstly proposes a joint optimization method of multi-network power allocation, time slot design and beam forming under the condition of multi-UAV autonomous collaborative energy supply, and also provides an efficient and reliable communication means for autonomous cooperative control of the UAV swarm.

Abstract: The present invention discloses a wireless perception system energy and information transmission method of an unmanned aerial vehicle (UAV) swarm, comprising: building a wireless perception system architecture based on multi-UAV energy supply, wherein the system comprises a plurality of wireless powered sensors and a UAV swarm, and each sensor establishes connection with a UAV based on random access to realize network construction; designing energy and information transmission protocols in the swarm and between the swarm and the sensors, designing a joint optimization algorithm and solving optimal system configuration to obtain optimal transmission strategies. The present invention firstly proposes a joint optimization method of multi-network power allocation, time slot design and beam forming under the condition of multi-UAV autonomous collaborative energy supply, and also provides an efficient and reliable communication means for autonomous cooperative control of the UAV swarm.

Abstract: A light emitting device, a method of fabricating a light emitting device and a method of controlling light emission. The light emitting device includes a plasmonic structure. The plasmonic structure is configured to have a plurality of localized surface plasmon resonances. The light emitting device also includes a broadband light emitting layer having an emission spectrum substantially overlapping wavelengths of the localized surface plasmon resonances. A spacer layer is disposed between the plasmonic structure and the broadband light emitting layer. A color of light emitted by the broadband light emitting layer is tunable by the localized surface plasmon resonances of the plasmonic structure.

Abstract: Improvements in speed and reductions in computational resource expenditure are realized in the improved tuning of hyperparameters for machine learning processes. To ensure that the values selected for hyperparameters are tuned appropriately, but quickly, several rounds of optimization are performed, each with as many or more iterations of cross-validation than prior rounds; cutting short the analysis unpromising results to devote more time and resources in analyzing promising value sets. The results are used to build suggested sets of hyperparameter values for that round, which are also cross-validated and enable the tuning process to incorporate previous operations to improve its value sets. The most promising sets of hyperparameter values from each round are selected as the basis set for the next round until a final set of values for the hyperparameters is developed.

Abstract: A chip package structure including a lead frame, a chip, a plurality of solder bumps, a solder resist layer and an encapsulant is provided. The lead frame has a plurality of inner leads. Each of the inner leads has an upper surface, a lower surface, two side surfaces opposite to each other and a bonding area on the upper surface. The chip is disposed on the lead frame and has an active surface. Each of the solder bumps connects the active surface and the bonding area of each of the inner leads. The solder resist layer is disposed on at least one of the lower surface or the two side surfaces of each of the inner leads. The encapsulant covers the lead frame, the chip, the solder bumps and the solder resist layer. A manufacturing method of the chip package structure is also provided.

Abstract: A quad flat no-lead package includes an encapsulant, and a plurality of chip pads, a plurality of bond pads and a chip disposed in the encapsulant. Each chip pad is connected to at least one of the chip pads adjacent thereto by a first extending portion. The chip pads and the bond pads are arranged in an array. The chip pads are disposed at the center of the array and the bond pads are disposed around the chip pads. Each of the bond pads and at least one of the bond pads or one of the chip pads adjacent thereto each has a second extending portion formed therebetween and corresponding to each other. Every two of the second extending portions corresponding to each other are separated by a groove. The chip is mounted on a top surface of the chip pads and is electrically coupled to the bond pads.

Abstract: A flat no-lead package includes an encapsulating material, and a die pad, a chip, a plurality of first contact pads and a plurality of second contact pads disposed in the encapsulating material. The encapsulating material has a package bottom surface. The die pad has a plurality of die pad extensions extending from the edges thereof. The chip is mounted on the die pad. The first contact pads are disposed near the edges of the encapsulating material and electrically coupled to the chip. The second contact pads are located between the die pad and the first contact pads and electrically coupled to the chip. Each of the second contact pads have a second contact pad extension corresponding to one of the die pad extensions respectively. The bottom surfaces of the first contact pads, the second contact pads and the second contact pad extensions are exposed on the package bottom surface.

Abstract: A flat no-lead package includes an encapsulating material, and a die pad, a chip, a plurality of first contact pads and a plurality of second contact pads disposed in the encapsulating material. The encapsulating material has a package bottom surface. The die pad has a plurality of die pad extensions extending from the edges thereof. The chip is mounted on the die pad. The first contact pads are disposed near the edges of the encapsulating material and electrically coupled to the chip. The second contact pads are located between the die pad and the first contact pads and electrically coupled to the chip. Each of the second contact pads have a second contact pad extension corresponding to one of the die pad extensions respectively.

Abstract: A chip packaging structure includes an encapsulating material, plurality of first leads, plurality of second leads, a first chip, a second chip and an adhesion layer. The encapsulating material has a top package surface and a corresponding bottom package surface. Each first lead has a first inner lead portion and a first outer lead portion. The first chip is located on the first inner lead portion and electrically coupled to the first leads. Each second lead has a second inner lead portion and a second outer lead portion. The second chip is located on the second inner lead portion and electrically coupled to the second leads. The adhesion layer is located between the first leads and second leads so that the first leads and second leads are connected to each other.

Abstract: A quad flat no-lead package includes an encapsulant, and a plurality of chip pads, a plurality of bond pads and a chip disposed in the encapsulant. Each chip pad is connected to at least one of the chip pads adjacent thereto by a first extending portion. The chip pads and the bond pads are arranged in an array. The chip pads are disposed at the center of the array and the bond pads are disposed around the chip pads. Each of the bond pads and at least one of the bond pads or one of the chip pads adjacent thereto each has a second extending portion formed therebetween and corresponding to each other. Every two of the second extending portions corresponding to each other are separated by a groove. The chip is mounted on a top surface of the chip pads and is electrically coupled to the bond pads.

Abstract: A chip package including a die pad, a plurality of leads, a chip, an adhesive, and a molding compound is provided. The die pad has a top surface and a bottom surface opposite to the top surface, wherein the die pad has a blocking portion disposed on the top surface, and the leads are disposed around the die pad. The chip is disposed on the top surface of the die pad surrounded by the blocking portion and is electrically connected to the leads. A top surface of the blocking portion is higher than the top surface of the die pad surrounded by the blocking portion. The adhesive is disposed between the chip and the die pad. The molding compound encapsulates the chip, a portion of the leads, and the die pad.

Abstract: A chip package including a die pad, a plurality of leads, a chip, an adhesive, and a molding compound is provided. The die pad has a top surface and a bottom surface opposite to the top surface, wherein the die pad has a blocking portion disposed on the top surface, and the leads are disposed around the die pad. The chip is disposed on the top surface of the die pad surrounded by the blocking portion and is electrically connected to the leads. A top surface of the blocking portion is higher than the top surface of the die pad surrounded by the blocking portion. The adhesive is disposed between the chip and the die pad. The molding compound encapsulates the chip, a portion of the leads, and the die pad.

Abstract: An automatic document feeder includes a sheet input structure, a transfer path, a first guiding path, a second guiding path, a first guiding unit including first and second guiding strips, a second guiding unit, first and second temporary receiving paths and five roller assemblies. A first end of the first guiding strip is pivotally coupled to the position between the first guiding path and the second guiding path. A second end of the first guiding strip is sustained against the second guiding strip under the first guiding strip. A document is transported from the second guiding path into a first temporary receiving path or a second temporary receiving path through the upper surface of the second guiding strip. The document received in the first temporary receiving path or the second temporary receiving path is guided by the first guiding strip to be transported into the first guiding path.

Abstract: A document feeder for feeding a plurality of paper sheets one by one includes an engaging module and a detachable roller module. The detachable roller module is detachably mounted on the engaging module and includes a frame, a paper separation roller axel, a fixing element and a paper separation roller. The paper separation roller axel is supported on the frame. The fixing element is pivotally coupled to the paper separation roller axel for positioning the detachable roller module on the engaging module. The paper separation roller is disposed within the fixing element and sheathed around the paper separation roller axel.

Abstract: A mold for making a shoe body in a process of injection foam molding is disclosed and includes a base; a lower mold body on the base; an upper die together with the mold body to form a mold cavity; an opening mechanism; a cover on the die and secured by the opening mechanism; a cooling plate under the mold body; and a platen pressed onto the cover. Pressurized gas is supplied from a first source to the cavity, molten materials from a second source are forced into the cavity to mix with the pressurized gas, after feeding a predetermined amount of the molten materials to the cavity, the first and the second sources are deactivated for releasing the pressurized gas, and the molten materials expand to shape and produce the finished shoe body.

Abstract: An automatic document feeder includes a sheet input structure, a transfer path, a first guiding path, a second guiding path, a first guiding unit including first and second guiding strips, a second guiding unit, first and second temporary receiving paths and five roller assemblies. A first end of the first guiding strip is pivotally coupled to the position between the first guiding path and the second guiding path. A second end of the first guiding strip is sustained against the second guiding strip under the first guiding strip. A document is transported from the second guiding path into a first temporary receiving path or a second temporary receiving path through the upper surface of the second guiding strip. The document received in the first temporary receiving path or the second temporary receiving path is guided by the first guiding strip to be transported into the first guiding path.

Abstract: A document feeder for feeding a plurality of paper sheets one by one includes an engaging module and a detachable roller module. The detachable roller module is detachably mounted on the engaging module and includes a frame, a paper separation roller axel, a fixing element and a paper separation roller. The paper separation roller axel is supported on the frame. The fixing element is pivotally coupled to the paper separation roller axel for positioning the detachable roller module on the engaging module. The paper separation roller is disposed within the fixing element and sheathed around the paper separation roller axel.