Abstract: The present invention relates to a naphthalimide sulfonate derivative, and a photoacid generator and a photoresist composition each comprising same and, more specifically, to a naphthalimide sulfonate derivative compound, and a photoacid generator and a photoresist composition each comprising same, wherein the compound has excellent absorbance for light of i-line (365 nm) wavelength, is greatly easy to prepare into a polymerizable composition due to very high solubility in an organic solvent, has good thermal stability, and shows a favorable acid generation rate.

Abstract: An electrochemical detector integrated on a capillary electrophoresis chip according to the present invention includes: a first substrate having a microchannel; a second substrate adapted to mate with the first substrate and having at least one peripheral electrode for conducting electrophoresis of a sample injected along the microchannel of the first substrate, in which a separation channel is formed along the microchannel by bonding the first substrate with the second substrate; a first electrode, made of indium tin oxide (ITO), formed on the first substrate to be positioned over the separation channel; and a second electrode, made of indium tin oxide (ITO), formed on the second substrate to be positioned under the separation channel, and spaced apart from the first electrode at a predetermined interval, wherein the first electrode and the second electrode constitute a detector to measure electrical characteristics of the sample passing along the separation channel.

Abstract: An apparatus for bonding semiconductor wafers firmly bonds the wafers to each other and can always lay the bonded wafers on a desired bonding plate. The bonding plates have a plurality of grooves formed on their respective surfaces to reduce the bond force between the wafers and the bonding plates of the apparatus, and to prevent the wafers from sliding off the plates due to an air cushion. An interval controlling pin projects from the surface of one of the bonding plates to reduce breakage of the wafers by maintaining an interval between the bonding plates as they are are rotated towards each other. An elastic pad portion is installed on one the bonding plates for providing an elastic force for the wafers placed on the bonding plates so that the wafers bond to each other properly when the bonding plates are further rotated towards each other.

Abstract: A SOI substrate manufacturing method which corrects the warpage in the SOI substrate by varying the thickness of a semiconductor material layer additionally formed over the bonded combination of a semiconductor substrate and supporting substrate.