Patents by Inventor Chi-Jung Lee
Chi-Jung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133949Abstract: An outlier IC detection method includes acquiring first measured data of a first IC set, training the first measured data for establishing a training model, acquiring second measured data of a second IC set, generating predicted data of the second IC set by using the training model according to the second measured data, generating a bivariate dataset distribution of the second IC set according to the predicted data and the second measured data, acquiring a predetermined Mahalanobis distance on the bivariate dataset distribution of the second IC set, and identifying at least one outlier IC from the second IC set when at least one position of the at least one outlier IC on the bivariate dataset distribution is outside a range of the predetermined Mahalanobis distance.Type: ApplicationFiled: October 3, 2023Publication date: April 25, 2024Applicant: MEDIATEK INC.Inventors: Yu-Lin Yang, Chin-Wei Lin, Po-Chao Tsao, Tung-Hsing Lee, Chia-Jung Ni, Chi-Ming Lee, Yi-Ju Ting
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Publication number: 20240085786Abstract: The present invention relates to a naphthalimide sulfonate derivative, and a photoacid generator and a photoresist composition each comprising same and, more specifically, to a naphthalimide sulfonate derivative compound, and a photoacid generator and a photoresist composition each comprising same, wherein the compound has excellent absorbance for light of i-line (365 nm) wavelength, is greatly easy to prepare into a polymerizable composition due to very high solubility in an organic solvent, has good thermal stability, and shows a favorable acid generation rate.Type: ApplicationFiled: December 28, 2021Publication date: March 14, 2024Applicant: SAMYANG CORPORATIONInventors: Chun Rim OH, Dae Hyuk CHOI, Yu Na CHOI, Deuk Rak LEE, Ji Eun CHOI, Ki Tae KANG, Min Jung KIM, Won Jung LEE, Chi Wan LEE
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Patent number: 11545846Abstract: A system for supplying adapted power to an electronic device with a reduced level of power consumption when the device is not in use includes a first power supplying module, a control module coupled to the first power supplying module, and an MCU coupled to the control module and coupled to the electronic device. The MCU is configured to switch on the first power supplying module when the first power supplying module is in a normal state, the normal state being an AC power supply coupled to the first power supplying module. The MCU detects an instant mode of the electronic device and outputs a first signal to the control module when the electronic device is in a standby mode. The control module is configured to switch off the first power supplying module when the first signal is received. A power supplying method is further provided.Type: GrantFiled: March 1, 2021Date of Patent: January 3, 2023Assignee: Nanning FuLian FuGui Precision Industrial Co., Ltd.Inventor: Chi-Jung Lee
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Publication number: 20210184484Abstract: A system for supplying adapted power to an electronic device with a reduced level of power consumption when the device is not in use includes a first power supplying module, a control module coupled to the first power supplying module, and an MCU coupled to the control module and coupled to the electronic device. The MCU is configured to switch on the first power supplying module when the first power supplying module is in a normal state, the normal state being an AC power supply coupled to the first power supplying module. The MCU detects an instant mode of the electronic device and outputs a first signal to the control module when the electronic device is in a standby mode. The control module is configured to switch off the first power supplying module when the first signal is received. A power supplying method is further provided.Type: ApplicationFiled: March 1, 2021Publication date: June 17, 2021Inventor: CHI-JUNG LEE
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Patent number: 10992154Abstract: A system for supplying adapted power to an electronic device with a reduced level of power consumption when the device is not in use includes a first power supplying module, a control module coupled to the first power supplying module, and an MCU coupled to the control module and coupled to the electronic device. The MCU is configured to switch on the first power supplying module when the first power supplying module is in a normal state, the normal state being an AC power supply coupled to the first power supplying module. The MCU detects an instant mode of the electronic device and outputs a first signal to the control module when the electronic device is in a standby mode. The control module is configured to switch off the first power supplying module when the first signal is received. A power supplying method is further provided.Type: GrantFiled: March 28, 2019Date of Patent: April 27, 2021Assignee: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.Inventor: Chi-Jung Lee
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Patent number: 10963547Abstract: A wearable device may store a biometric token associated with a wearer of the wearable device, the wearable device including: a wireless communications interface; a processing circuitry; a memory configured to store a biometric token associated with a wearer of the wearable device, the biometric token including a device identifier that is associated with the wearable device, a biometric template for each of one or more biometric scans of the wearer of the wearable device, and an indication of whether or not the biometric token is valid, wherein the biometric token, if valid, establishes a trust that wearer identifying information, linked to the biometric token, is associated with the wearer; an invalidating event detector configured to determine if an invalidating event has occurred; wherein the processing circuitry is configured to invalidate the biometric token in response to detecting that an invalidating event has occurred for the biometric token.Type: GrantFiled: July 12, 2018Date of Patent: March 30, 2021Assignee: Securiport LLCInventors: Chi Jung Lee, Frank Buscaglio
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Publication number: 20200019682Abstract: According to an implementation, a wearable device is configured to store a biometric token associated with a wearer of the wearable device, the wearable device including: a wireless communications interface; a processing circuitry; a memory configured to store a biometric token associated with a wearer of the wearable device, the biometric token including a device identifier that is associated with the wearable device, a biometric template for each of one or more biometric scans of the wearer of the wearable device, and an indication of whether or not the biometric token is valid, wherein the biometric token, if valid, establishes a trust that wearer identifying information, linked to the biometric token, is associated with the wearer; an invalidating event detector configured to determine if an invalidating event has occurred; wherein the processing circuitry is configured to invalidate the biometric token in response to detecting that an invalidating event has occurred for the biometric token.Type: ApplicationFiled: July 12, 2018Publication date: January 16, 2020Inventors: Chi Jung Lee, Frank Buscaglio
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Publication number: 20190222048Abstract: A system for supplying adapted power to an electronic device with a reduced level of power consumption when the device is not in use includes a first power supplying module, a control module coupled to the first power supplying module, and an MCU coupled to the control module and coupled to the electronic device. The MCU is configured to switch on the first power supplying module when the first power supplying module is in a normal state, the normal state being an AC power supply coupled to the first power supplying module. The MCU detects an instant mode of the electronic device and outputs a first signal to the control module when the electronic device is in a standby mode. The control module is configured to switch off the first power supplying module when the first signal is received. A power supplying method is further provided.Type: ApplicationFiled: March 28, 2019Publication date: July 18, 2019Inventor: CHI-JUNG LEE
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Patent number: 10355506Abstract: A system for supplying adapted power to an electronic device with a reduced level of power consumption when the device is not in use includes a first power supplying module, a control module coupled to the first power supplying module, and an MCU coupled to the control module and coupled to the electronic device. The MCU is configured to switch on the first power supplying module when the first power supplying module is in normal state, the normal state being an AC power supply coupled to the first power supplying module. The MCU detects an instant mode of the electronic device and outputs a first signal to the control module when the electronic device is in a standby mode. The control module is configured to switch off the first power supplying module when the first signal is received. A power supplying method is further provided.Type: GrantFiled: August 22, 2016Date of Patent: July 16, 2019Assignee: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.Inventor: Chi-Jung Lee
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Patent number: 10205280Abstract: A connector includes a cavity, a detecting portion, and a door. The cavity includes a first interface, the detecting portion is set in the cavity, and the door is set at the first interface. A first door first end includes a metal portion, such that when an external device enters in the cavity through the first interface by pushing the door, the metal portion is coupled to the detecting portion, and the detecting portion outputs a first control signal accordingly. When an external device is inserted into the connector, a power is supplied to the connector, when the external device is not inserted into the connector, the power is not supplied to the connector, thus achieving the purpose of energy conservation.Type: GrantFiled: July 19, 2017Date of Patent: February 12, 2019Assignee: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.Inventor: Chi-Jung Lee
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Patent number: 10163701Abstract: Multi-stack package-on-package structures are disclosed. In a method, a first stacked semiconductor device is formed on a first carrier wafer. The first stacked semiconductor device is singulated. The first stacked semiconductor device is adhered to a second carrier wafer. A second semiconductor device is attached on the first stacked semiconductor device. The second semiconductor device and the first stacked semiconductor device are encapsulated. Electrical connections are formed on and electrically coupled to the first stacked semiconductor device and the second semiconductor device.Type: GrantFiled: October 30, 2017Date of Patent: December 25, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Jung Lee, Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang, Li-Hsien Huang
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Publication number: 20180366876Abstract: A connector includes a cavity, a detecting portion, and a door. The cavity includes a first interface, the detecting portion is set in the cavity, and the door is set at the first interface. A first door first end includes a metal portion, such that when an external device enters in the cavity through the first interface by pushing the door, the metal portion is coupled to the detecting portion, and the detecting portion outputs a first control signal accordingly. When an external device is inserted into the connector, a power is supplied to the connector, when the external device is not inserted into the connector, the power is not supplied to the connector, thus achieving the purpose of energy conservation.Type: ApplicationFiled: July 19, 2017Publication date: December 20, 2018Inventor: CHI-JUNG LEE
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Publication number: 20180068979Abstract: Multi-stack package-on-package structures are disclosed. In a method, a first stacked semiconductor device is formed on a first carrier wafer. The first stacked semiconductor device is singulated. The first stacked semiconductor device is adhered to a second carrier wafer. A second semiconductor device is attached on the first stacked semiconductor device. The second semiconductor device and the first stacked semiconductor device are encapsulated. Electrical connections are formed on and electrically coupled to the first stacked semiconductor device and the second semiconductor device.Type: ApplicationFiled: October 30, 2017Publication date: March 8, 2018Inventors: Chi-Jung Lee, Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang, Li-Hsien Huang
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Publication number: 20170366030Abstract: A system for supplying adapted power to an electronic device with a reduced level of power consumption when the device is not in use includes a first power supplying module, a control module coupled to the first power supplying module, and an MCU coupled to the control module and coupled to the electronic device. The MCU is configured to switch on the first power supplying module when the first power supplying module is in normal state, the normal state being an AC power supply coupled to the first power supplying module. The MCU detects an instant mode of the electronic device and outputs a first signal to the control module when the electronic device is in a standby mode. The control module is configured to switch off the first power supplying module when the first signal is received. A power supplying method is further provided.Type: ApplicationFiled: August 22, 2016Publication date: December 21, 2017Inventor: CHI-JUNG LEE
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Publication number: 20170330858Abstract: Multi-stack package-on-package structures are disclosed. In a method, a first stacked semiconductor device is formed on a first carrier wafer. The first stacked semiconductor device is singulated. The first stacked semiconductor device is adhered to a second carrier wafer. A second semiconductor device is attached on the first stacked semiconductor device. The second semiconductor device and the first stacked semiconductor device are encapsulated. Electrical connections are formed on and electrically coupled to the first stacked semiconductor device and the second semiconductor device.Type: ApplicationFiled: May 12, 2016Publication date: November 16, 2017Inventors: Chi-Jung Lee, Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang, Li-Hsien Huang
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Patent number: 9806059Abstract: Multi-stack package-on-package structures are disclosed. In a method, a first stacked semiconductor device is formed on a first carrier wafer. The first stacked semiconductor device is singulated. The first stacked semiconductor device is adhered to a second carrier wafer. A second semiconductor device is attached on the first stacked semiconductor device. The second semiconductor device and the first stacked semiconductor device are encapsulated. Electrical connections are formed on and electrically coupled to the first stacked semiconductor device and the second semiconductor device.Type: GrantFiled: May 12, 2016Date of Patent: October 31, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Jung Lee, Hsien-Wei Chen, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang, Li-Hsien Huang
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Patent number: 5702334Abstract: An abdomen fitness equipment including a front base frame unit carrying a cushion, a substantially U-shaped handle fixed to the front end of the front base frame unit for pulling, a rear base frame unit pivoted to the rear end of the front base frame unit, a movable frame unit pivoted to the front end of the rear base frame unit, and a movable leg frame unit pivoted to the rear end of the rear base frame unit, the movable leg frame unit having an adjustable extension rod equipped with a pulley, the pulley being moved along a longitudinal rod in the rear base frame unit when the movable leg frame unit is pulled with the legs to lift the movable frame unit.Type: GrantFiled: September 23, 1996Date of Patent: December 30, 1997Inventor: Chi-Jung Lee