Abstract: In a method for obtaining the equivalent oxide thickness of a dielectric layer, a first semiconductor capacitor including a first silicon dioxide layer and a second semiconductor capacitor including a second silicon dioxide layer are provided and a modulation voltage is applied to the semiconductor capacitors to measure a first scanning capacitance microscopic signal and a second scanning capacitance microscopic signal. According to the equivalent oxide thicknesses of the silicon dioxide layers and the scanning capacitance microscopic signals, an impedance ratio is calculated. The modulation voltage is applied to a third semiconductor capacitor including a dielectric layer to measure a third scanning capacitance microscopic signal. Finally, the equivalent oxide thickness of the dielectric layer is obtained according to the equivalent oxide thickness of the first silicon dioxide layer, the first scanning capacitance microscopic signal, third scanning capacitance microscopic signal, and the impedance ratio.

Abstract: A flooring panel (50) is provided with a quick-release adhesive sheet (10) such that the flooring panel (50) can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel (50) includes a top floor layer (52) attached or laminated to the adhesive sheet (10), which underlies the floor layer (52). The top flooring layer (52) can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc. (FIG. 8).

Abstract: A flooring panel (50) is provided with a quick-release adhesive sheet (10) such that the flooring panel (50) can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel (50) includes a top floor layer (52) attached or laminated to the adhesive sheet (10), which underlies the floor layer (52). The top flooring layer (52) can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc. (FIG. 8).

Abstract: A flooring panel is provided with a quick-release adhesive sheet such that the flooring panel can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel includes a top floor layer attached or laminated to the adhesive sheet, which underlies the floor layer. The top flooring layer can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc.

Abstract: A flooring panel is provided with a quick-release adhesive sheet such that the flooring panel can be quickly attached to a support surface and removed therefrom. More particularly, the flooring panel includes a top floor layer attached or laminated to the adhesive sheet, which underlies the floor layer. The top flooring layer can be any type of flooring material, such as vinyl flooring, real or engineered wood flooring, etc.

Abstract: A method for data transmission within a server that includes a processor, a main memory, a southbridge, a chipset, and a buffer, the chipset including a baseboard management controller (BMC), the method including: obtaining memory information about a segment of the peripheral memory allocated for a peripheral controller included in the chipset; transmitting a notifying command to the BMC indicating a data size of to-be-transmitted data associated with a booting operation of the server; transmitting at least a part of the to-be-transmitted data to the segment, according to the memory information; and transmitting a standby command to the BMC indicating that the part of the to-be-transmitted data has been stored in the segment.

Abstract: A method for data transmission within a server that includes a processor, a main memory, a southbridge, a chipset, and a buffer, the chipset including a baseboard management controller (BMC), the method including: obtaining memory information about a segment of the peripheral memory allocated for a peripheral controller included in the chipset; transmitting a notifying command to the BMC indicating a data size of to-be-transmitted data associated with a booting operation of the server; transmitting at least a part of the to-be-transmitted data to the segment, according to the memory information; and transmitting a standby command to the BMC indicating that the part of the to-be-transmitted data has been stored in the segment.

Abstract: A floor tile structure includes a surface layer, an intermediate layer mounted on a bottom face of the surface layer, and a bottom layer arranged on a bottom face of the intermediate layer and stuck to the surface layer. The intermediate layer includes an adhesive that is applied over the bottom face of the surface layer. The bottom layer includes a film layer attached to the bottom face of the intermediate layer, a reusable sticky layer attached to a bottom face of the film layer and a release paper attached to a bottom face of the reusable sticky layer. The reusable sticky layer can be used and stuck repeatedly. The release paper can be removed from the reusable sticky layer.

Abstract: A semiconductor wafer includes a substrate, an aluminum layer on the substrate, an anti-reflection coating on the aluminum layer, a dielectric layer on the anti-reflection coating, and a via hole that passes through the dielectric layer and the anti-reflection coating down to a predetermined depth within the aluminum layer. A titanium layer is formed on the bottom and on the walls of the via hole. A physical vapor deposition process is then performed to form a first titanium nitride layer on the titanium layer. A chemical vapor deposition process is then performed to form a second titanium nitride layer on the first titanium nitride layer.