Abstract: A method of forming a semiconductor device includes: forming a gate structure over a fin that protrudes above a substrate; forming a source/drain region over the fin adjacent to the gate structure; forming an interlayer dielectric (ILD) layer over the source/drain region around the gate structure; forming an opening in the ILD layer to expose the source/drain region; forming a silicide region and a barrier layer successively in the openings over the source/drain region, where the barrier layer includes silicon nitride; reducing a concentration of silicon nitride in a surface portion of the barrier layer exposed to the opening; after the reducing, forming a seed layer on the barrier layer; and forming an electrically conductive material on the seed layer to fill the opening.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and multiple first conductive lines over the semiconductor substrate. The first conductive lines are not electrically connected to each other. The semiconductor device structure also includes multiple first magnetic structures wrapped around portions of the first conductive lines and multiple second conductive lines over the semiconductor substrate. The second conductive lines are electrically connected in series. The semiconductor device structure further includes multiple second magnetic structures wrapped around portions of the second conductive lines. A size of each of the second magnetic structures and a size of each of the first magnetic structures are substantially the same.

Abstract: An electronic device includes a display surface, a back surface with a first portion and a second portion, and a support assembly. The support assembly includes a first, second, and third boards. The first board includes a first surface, detachably covering the first portion, and a second surface. The second board is bendably connected to the first board and combined with the second portion. The third board includes a pivoted end and a free end. The pivoted end is pivotally connected to the second surface and covers the second board and a portion of the first board. When the first board rotates relative to the first portion, the third board also rotates relative to the second board, the second surface faces the third board, and the second board simultaneously moves along the third board. Accordingly, the display surface is raised up a distance relative to the free end.

Abstract: An electronic device includes a display surface, a back surface with a first portion and a second portion, and a support assembly. The support assembly includes a first, second, and third boards. The first board includes a first surface, detachably covering the first portion, and a second surface. The second board is bendably connected to the first board and combined with the second portion. The third board includes a pivoted end and a free end. The pivoted end is pivotally connected to the second surface and covers the second board and a portion of the first board. When the first board rotates relative to the first portion, the third board also rotates relative to the second board, the second surface faces the third board, and the second board simultaneously moves along the third board. Accordingly, the display surface is raised up a distance relative to the free end.

Abstract: A mounting apparatus for a duplex module of a printer, includes a bracket, a left lock hung on a left portion of the bracket, a right lock hung on a right portion of the bracket; and a left transmission module and a right transmission module movably mounted on the bracket. The duplex module is secured to the bracket. The left transmission module abuts the left lock. The right transmission module abuts the right lock. The left transmission module and the right transmission module move synchronously to move the left lock and the right lock synchronously to attach the duplex module to the printer or detach the duplex module from the printer.

Abstract: A transmission mechanism includes a guide rod, a gear assembly meshed with the guide rod, a blocking member attached to the guide rod, and a resilient member. The resilient member surrounds the guide rod. A first end of the resilient member abuts the blocking member, and a second end opposite to the first end is configured to abut a printer. The resilient member drives the guide rod to rotate the gear assembly.

Abstract: A chargeable electric winch for driving a to-be-controlled object to rotate. The electric winch includes a housing, a driving device, a driven shaft, a first switch and a battery. The driving device is disposed in the housing. The driven shaft penetrates through the housing and is driven by the driving device to rotate. The first switch is disposed on the housing and has a controller. The controller has an opposite connector and is electrically connected to the driving device. The battery has an inner battery body and an outer connector electrically connected to the inner battery body. The battery for providing power is electrically connected to the opposite connector of the first switch through the outer connector of the battery, and the battery is separatably assembled with the housing.

Abstract: The present invention discloses a Bluetooth audio relay, which comprises: a printed circuit board (PCB); a Bluetooth chip mounted on the PCB for processing the Bluetooth signals and transforming the Bluetooth signals into digital audio signals; an antenna coupled to the Bluetooth chip for receiving and transmitting the Bluetooth signals, and transferring the Bluetooth signals to the Bluetooth chip; memory mounted on the PCB and coupled to the Bluetooth chip for storing digital data; a power supply coupled to the Bluetooth ship for providing power; a codec chip mounted on the PCB and coupled to the Bluetooth chip for transforming the digital audio signals into analog audio signals; and a plurality of audio jacks mounted on the PCB and coupled the codec chip for outputting the analog audio signals