Abstract: An immersion lithography system, comprising a lens unit configured to project a pattern from an end thereof and onto a wafer, a hood unit configured to confine an immersion fluid to a region of the wafer surrounding the end of the lens unit, a wafer stage configured to position the wafer proximate the end of the lens unit, and at least one of an image capturing apparatus and a scattering light detection apparatus, wherein the image capturing apparatus is coupled to the wafer stage and is configured to capture an image of a surface of the hood unit proximate the wafer stage, and wherein the scattering light detection apparatus is proximate the end of the lens unit and the hood unit and is configured to detect particles on a surface of the wafer stage.

Abstract: A method of cleaning a spin coater apparatus is provided. In one embodiment, the method comprises providing a spin coater apparatus having a coater cup comprising a basin with sidewalls, a rotatable platform situated inside the cup adapted for holding and rotating a wafer to be coated, and a solvent dispensing means mounted under the rotatable platform; placing the substrate on the rotatable platform; rotating the rotatable platform; continuously dispensing a cleaning solvent from the solvent dispensing means to rinse the backside of the wafer with the cleaning solvent and to pre-wet an interior surface of the sidewalls; and dispensing a coating material upon the wafer, the substrate mounted on the rotatable platform.

Abstract: An immersion lithography system, comprising a lens unit configured to project a pattern from an end thereof and onto a wafer, a hood unit configured to confine an immersion fluid to a region of the wafer surrounding the end of the lens unit, a wafer stage configured to position the wafer proximate the end of the lens unit, and at least one of an image capturing apparatus and a scattering light detection apparatus, wherein the image capturing apparatus is coupled to the wafer stage and is configured to capture an image of a surface of the hood unit proximate the wafer stage, and wherein the scattering light detection apparatus is proximate the end of the lens unit and the hood unit and is configured to detect particles on a surface of the wafer stage.

Abstract: A method of cleaning a spin coater apparatus is provided. In one embodiment, the method comprises providing a spin coater apparatus having a coater cup comprising a basin with sidewalls, a rotatable platform situated inside the cup adapted for holding and rotating a wafer to be coated, and a solvent dispensing means mounted under the rotatable platform; placing the substrate on the rotatable platform; rotating the rotatable platform; continuously dispensing a cleaning solvent from the solvent dispensing means to rinse the backside of the wafer with the cleaning solvent and to pre-wet an interior surface of the sidewalls; and dispensing a coating material upon the wafer, the substrate mounted on the rotatable platform.

Abstract: A heat treatment control system to cure a photoresist that is deposited upon a semiconductor substrate is described. The heat treatment system has a hot plate with a heating element and temperature sensing devices that are in close proximity to the semiconductor substrate. The heat treatment system also has a controlling device that will selectively provide an electrical power source to the heating element to heat the semiconductor wafer. The coupling of the heating element to an electrical power source is determined by an electrical signal from one of the temperature sensing devices that have been conditioned and compared to a set temperature signal to provide an error signal. The controlling device will examine the error signal and adjust the temperature. An over temperature alarm circuit is connected to the second temperature sensing device.