Abstract: A respirator (100) includes a face mask (130), a porous filter (230) comprising a filtration material, an air flow system (120) in fluid communication with the porous filter (230) and the face mask (130), and an oxidant generator (850) configured to produce at least one oxidant. The air flow system (120) includes an enclosed container (121) and a blower (310) housed within the enclosed container (121). The air flow system (120) is configured to generate a flow of air such that ambient air passes through the porous filter (230) to the face mask (130). At least one contaminant in the flow of air is adsorbed by the porous filter (230), and the filtration material catalyzes an oxidation reaction between the oxidant and the contaminant to promote decomposition of the contaminant on the porous filter (230). According to another aspect, provided is an air purification system including at least one respirator (100) and a decontamination device (800).

Abstract: In one aspect, provided is an aqueous antiseptic composition comprising glycerin 8.5-16%by weight; caprylyl glycol 0.45-3%by weight; and a first ingredient; wherein the first ingredient is acrylates/C10-30 about 0.01-0.1%by weight or ethoxydiglycol about 1-5% by weight. The glycerin, the caprylyl glycol and the first ingredient taken together form a first component. A sum of the first component is more than 13%by weight of the antiseptic composition. Other exemplary embodiments are also described. In certain embodiments, provided is an antiseptic composition useful for making skin or hand sanitizers that has a long-lasting, great antiseptic efficacy but at the same time having skin-moisturizing, low toxicity and low skin-irritating, hypo-allergenic properties, low inflammability, and low production cost.

Abstract: In one aspect, provided is an aqueous antiseptic composition comprising glycerin 8.5-16% by weight; caprylyl glycol 0.45-3% by weight; and a first ingredient; wherein the first ingredient is acrylates/C10-30 about 0.01-0.1% by weight or ethoxydiglycol about 1-5% by weight. The glycerin, the caprylyl glycol and the first ingredient taken together form a first component. A sum of the first component is more than 13% by weight of the antiseptic composition. Other exemplary embodiments are also described. In certain embodiments, provided is an antiseptic composition useful for making skin or hand sanitizers that have a long-lasting, great antiseptic efficacy but at the same time having skin-moisturizing, low toxicity and low skin-irritating, hypo-allergenic properties, low inflammability, and low production cost.

Abstract: LED packages and LED displays utilizing the LED packages are disclosed where the peak emission of the LED display can be tilted or shifted to customize its peak emission to the mounting height or location of the LED display. One embodiment of an LED display comprises a plurality of LED package where the peak emission from at least some of the LED packages is tilted off the package centerline. The LED packages are mounted within the display in such a way as to generate an image having a peak emission that is tilted off the perpendicular emission direction of the display.

Abstract: The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes.

Abstract: Surface-mount devices comprising a casing having opposed main surfaces, side surfaces, and end surfaces. A lead frame partially encased by the casing comprises; an electrically conductive LED chip carrier part carrying three LEDs, each LED having first and second terminals, the first terminal of each LED being electrically and thermally coupled to the chip carrying surface; and (2) three conductive connection parts separate from the chip carrier part, each connection part having a connection pad, the second terminal of each LED being electrically coupled to the connection pad of a corresponding one of the connection parts. The LEDs extend linearly in a first direction, and each carrier part and connection part has a lead. The leads are disposed in parallel relationship with each other and extend through the end surfaces of the casing in a second direction, the second direction being orthogonal to the first direction.

Abstract: An end cap assembly for an electric motor has an end cap body and at least two motor terminals. The end cap body has at least two holding structures for respectively holding the at least two motor terminals, each holding structure having at least one holder and a through slot. Each motor terminal has a base portion, a terminal portion and at least one mounting portion. The at least one mounting portion is mounted to the at least one holder of a corresponding holding structure. The terminal portion is inserted in the through slot to electrically connect to a male terminal of an external power supply plug. The terminal portion and the at least one mounting portion integrally extend from the base portion.

Abstract: The present invention is directed to LED packages and LED displays utilizing water resistant packages with improved structural integrity and customizable attributes. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, water resistant package. Moreover, in some embodiments the improved structural integrity and water resistance is further provided by cavity features that improve adhesion between the cavity and a protective encapsulant. Some embodiments also provide for packages with a greater overall height than the length of their side-exposed solder pins, which improves gel coverage of the side-exposed solder pins between adjacent packages.

Abstract: A multiple element emitter package is disclosed for increasing color fidelity and heat dissipation, improving current control, and increasing rigidity of the package assembly. In one embodiment, the package comprises a casing with a cavity extending into the interior of the casing from a first main surface. A lead frame is at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive parts carrying a linear array of LEDs. Electrically conductive parts, separate from the parts carrying the LEDs, have a connection pad, wherein the LEDs are electrically coupled to the connection pad, such as by a wire bond. This arrangement allows for a respective electrical signal to be applied to each of the LEDs. The emitter package may be substantially waterproof, and an array of the emitter packages may be used in an LED display such as an indoor and/or outdoor LED screen.

Abstract: One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.

Abstract: A surface mount LED package includes a lead frame carrying a plurality of LEDs and a plastic casing at least partially encasing the lead frame. The lead frame includes an electrically conductive chip carrier and first, second, and third electrically conductive connection parts separate from the electrically conductive chip carrier. Each of the first, second and third electrically conductive connection parts has an upper surface, a lower surface, and a connection pad on the upper surface. The plurality of LEDs are disposed on an upper surface of the electrically conductive chip carrier. Each LED has a first electrical terminal electrically coupled to the electrically conductive chip carrier. Each LED has a second electrical terminal electrically coupled to the connection pad of a corresponding one of the first, second, and third electrically conductive connection parts.

Abstract: LED devices are provided including an LED package including an LED and an optical element in an optical receiving relationship with the LED. The optical element has a higher light absorbing property at an exit surface away from the LED than at a bottom surface proximal to the LED. The optical element may include different epoxies, dye, and opaque particles. Methods for producing disclosed LED devices are also disclosed.

Abstract: The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.

Abstract: The disclosure provides an LED package including a first plastic portion having a mounting surface and a lower surface. In some embodiments, the LED package includes a second portion surrounding the first plastic portion and exposing the mounting surface and the lower surface of the first plastic portion. In other embodiments, the first plastic portion includes at least one of a hole or a protrusion and the second portion includes corresponding structure filing the hole or surrounding the protrusion of the first plastic portion. The first plastic portion and the second portion have different optical properties.

Abstract: The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.

Abstract: LED devices are provided including an LED package including an LED and an optical element in an optical receiving relationship with the LED. The optical element has a higher light absorbing property at an exit surface away from the LED than at a bottom surface proximal to the LED. The optical element may include different epoxies, dye, and opaque particles. Methods for producing disclosed LED devices are also disclosed.

Abstract: The present invention is directed to LED packages and LED displays utilizing the LED packages, wherein the LED chips within the packages are arranged in unique orientations to provide the desired package or display FFP. One LED package according to the present invention comprises a reflective cup and an LED chip mounted in the reflective cup. The reflective cup has a first axis and a second axis orthogonal to the first axis, wherein the LED chip is rotated within the reflective cup so that the LED chip is out of alignment with said first axis. Some of the LED packages can comprise a rectangular LED chip having a chip longitudinal axis and an oval shaped reflective cup having a cup longitudinal axis. The LED chip is mounted within the reflective cup with the chip longitudinal axis angled from the cup longitudinal axis.

Abstract: LED devices includes a lead frame having a reflector cup with a round bottom surface and a wall surface having a variable inclination with respect to the bottom surface and defining an opening at an upper end thereof. An LED is mounted on the bottom surface of the reflector cup, and an LED module includes first and second LED device that emit different colors. The first and second LED devices have substantially matched far field patterns in a first and second direction, where a first viewing angle in the first direction is less than about 99°.

Abstract: A surface mount LED package includes a lead frame carrying a plurality of LEDs and a plastic casing at least partially encasing the lead frame. The lead frame includes an electrically conductive chip carrier and first, second, and third electrically conductive connection parts separate from the electrically conductive chip carrier. Each of the first, second and third electrically conductive connection parts has an upper surface, a lower surface, and a connection pad on the upper surface. The plurality of LEDs are disposed on an upper surface of the electrically conductive chip carrier. Each LED has a first electrical terminal electrically coupled to the electrically conductive chip carrier. Each LED has a second electrical terminal electrically coupled to the connection pad of a corresponding one of the first, second, and third electrically conductive connection parts.