Abstract: In certain aspects, the disclosure relates to anti-idiotype antibodies and antigen-binding portions thereof that specifically bind a KL2B413 containing protein, e.g., an antibody or antigen-binding portions thereof. In some aspects, the anti-idiotype antibodies and antigen-binding portions of the present disclosure can be used in methods to detect and quantify cells expressing chimeric antigen receptors that include KL2B413.

Abstract: A display may have a stretchable portion with hermetically sealed rigid pixel islands. A flexible interconnect region may be interposed between the hermetically sealed rigid pixel islands. The hermetically sealed rigid pixel islands may include organic light-emitting diode (OLED) pixels. A conductive cutting structure may have an undercut that causes a discontinuity in a conductive OLED layer to mitigate lateral leakage. The conductive cutting structure may also be electrically connected to a cathode for the OLED pixels and provide a cathode voltage to the cathode. First and second inorganic passivation layers may be formed over the OLED pixels. Multiple discrete portions of an organic inkjet printed layer may be interposed between the first and second inorganic passivation layers.

Abstract: Provided is a compound of formula (I) in which Ar1, R1, U, V, W, X, and p are as described herein. Also provided are methods of using a compound of formula (I), including a method of treating cancer, a method of treating a patient with cancer cells resistant to an anti-cancer agent, and a method of inhibiting lactate dehydrogenase A (LDHA) and/or lactate dehydrogenase B (LDHB) activity in a cell.

Abstract: Methods of fabricating infrared bandpass filters and infrared bandpass filters fabricated thereby. The methods include forming metallic and dielectric spacer layers on a mold that defines nanoscale-sized recesses or protuberances, depositing a stress-absorbing layer on the dielectric spacer layer opposite the mold, and applying a force to the stress-absorbing layer to peel a first intermediate structure comprising the metallic layer, the dielectric spacer layer, and the stress-absorbing layer from the mold. The stress-absorbing layer may be dissolved from the first intermediate structure with a solvent to define a second intermediate structure. The second intermediate structure may be transferred to a receiver substrate to define the IR bandpass filter. The recesses or protuberances of the metallic and dielectric spacer layers are configured to function as quasi-three-dimensional (quasi-3D) plasmonic metal-dielectric hybrid nanostructures.

Abstract: An apparatus for detecting a dimension error obtains an image of a target object, estimates dimensional data for a region of interest (ROI) for which dimensions are to be measured from the image of the target object using a learned dimensional measurement model, and determines whether there is a dimension error in the ROI from the estimated dimension data using a learned dimension error determination model.

Abstract: A blower motor includes a motor assembly 100 including a stator assembly 1 comprising a stator core 10, an upper insulator 11 coupled to an upper portion of the stator core 10 and a lower insulator 12 coupled to a lower portion of the stator core 10, a rotor assembly 2 rotating around the stator assembly 1, a stator block 3 to which the stator assembly 1 is coupled, a printed circuit board 4 located at a lower portion of the stator block 3, and a motor cover 5 coupled to the stator block 3; a flange 200; and a damper plate 300.

Abstract: A blower motor according to the present invention includes a stator assembly 1 including a stator core 10, an upper insulator 11 coupled to an upper portion of the stator core 10, and a lower insulator 12 coupled to a lower portion of the stator core 10; a rotor assembly 2 rotating around the stator assembly 1; a stator block 3 to which the stator assembly 1 is coupled; a printed circuit board 4 located at a lower portion of the stator block 3; and a motor cover 5 coupled to the stator block 3.

Abstract: A blower motor includes a motor assembly 100; a flange 200 on which the motor assembly 100 is mounted; and a damper plate 300 coupled to the flange 200 and supporting the motor assembly 100, wherein the motor assembly 100 includes: a stator assembly 20; a rotor assembly 30 disposed on an outer periphery of the stator assembly 20 and rotating with a shaft 10; a stator block 40 coupled to the stator assembly 20; a printed circuit board 50 installed in the stator block 40; and a motor cover 60 coupled to the stator block 40.

Abstract: A blower motor includes a motor assembly 100 including a stator assembly 1 comprising a stator core 10, an upper insulator 11 coupled to an upper portion of the stator core 10 and a lower insulator 12 coupled to a lower portion of the stator core 10, a rotor assembly 2 rotating around the stator assembly 1, a stator block 3 to which the stator assembly 1 is coupled, a printed circuit board 4 located at a lower portion of the stator block 3, and a motor cover 5 coupled to the stator block 3; a flange 200; and a damper plate 300.

Abstract: A method includes receiving, at a first device via a first radio, a trigger from a second device, the first device configured for wireless communication using multiple radios sharing a clock, the multiple radios comprising the first radio and a second radio, the trigger including a timing indication. The method also includes determining, based on the timing indication in the trigger and a time of reception of the trigger, a timing of one or more operations of a radio of the second device for a discovery session between the first device and the second device. The method further includes starting the discovery session with the second device based on the determined timing of the one or more operations.

Abstract: A dual-path signal interconnect is provided. The interconnect can include a first signal trace, first and second solder pads positioned above and connected to the first signal trace, and a third solder pad. The second solder pad separates from the first solder pad. The third solder pad separates from the second solder pad and is connected to a second signal trace. The first and second solder pads are to allow a pin of a connector to be soldered to the first and second solder pads, such that, when the pin of the external connector is soldered, high-speed electrical signals from the first signal trace are routed to the connector. The second and third solder pads are to allow a conductor to be soldered to the second and third solder pads, such that, when the conductor is soldered, the high-speed electrical signals are routed to the second signal trace.

Abstract: The present invention relates to a clamping apparatus for an antenna device and, particularly, to a clamping apparatus comprising: two or more clamping block bodies tightly combined to occupy a part of the outer surface of a support pole having a horizontal cross section in various shapes; and a clamping band coupled so as to pass through the two or more clamping block bodies, the clamping band coupling by fastening the two or more clamping block bodies to the outer surface of the support pole, wherein each of the two or more clamping block bodies has a detachable clamping gear plate having gear teeth which come in close contact with the outer surface of the support pole, thereby providing the advantage of enhancing general use with respect to replacement installation.

Abstract: One aspect provides a printed circuit board (PCB). The PCB can include a plurality of layers and a plurality of plated through-hole (PTH) vias extending through the plurality of layers. The plurality of layers can include at least a top layer for mounting components, a second surface layer, and a first power layer positioned between the top layer and the second surface layer. The plurality of PTH vias can include at least one power via coupled to the first power layer to provide power to components mounted on the top layer. A stub length of the power via can be less than a distance between the power layer and the second surface layer.

Abstract: One aspect of the instant application provides techniques to reduce the amount of crosstalk on single-ended signals in the pin field region of an integrated circuit device on a printed circuit board (PCB). The PCB can include a plurality of layers and an array of vias comprising a plurality of rows configured to route signals across layers. An inner layer of the PCB can include first and second signal traces positioned between first and second adjacent rows of the vias, the first signal trace positioned adjacent to the first row and the second signal trace positioned adjacent to the second row. The first signal trace can include at least one curved segment that curves around a substantial portion of a corresponding via in the first row such that separation between the first and second signal traces varies along the curved segment.

Abstract: Columns of a table are stored in either row-major format or column-major format in an in-memory DBMS. For a given table, one set of columns is stored in column-major format; another set of columns for a table are stored in row-major format. This way of storing columns of a table is referred to herein as dual-major format. In addition, a row in a dual-major table is updated “in-place”, that is, updates are made directly to column-major columns without creating an interim row-major form of the column-major columns of the row. Users may submit database definition language (“DDL”) commands that declare the row-major columns and column-major columns of a table.

Abstract: A database is stored as a plurality of database shards in a distributed database grid comprising a plurality of grid elements, each including a mid-tier database system. A first grid element receives, from an application executing in the same memory as a mid-tier database system of the first grid element, a first database transaction including at least one database operation on specific data stored in a first database shard that belongs to the first grid element. The first grid element performs and commits the first database transaction without participation of another grid element of the plurality of grid elements. The first grid element receives a second database transaction that requires access to another database shard that does not belong to the first grid element. Multiple grid elements of the plurality of grid elements perform the second database transaction and commit the second database transaction using a two-phase commit protocol.

Abstract: One aspect of the instant application provides techniques to reduce the amount of crosstalk on single-ended signals in the pin field region of an integrated circuit device on a printed circuit board (PCB). The PCB can include a plurality of layers and an array of vias comprising a plurality of rows configured to route signals across layers. An inner layer of the PCB can include first and second signal traces positioned between first and second adjacent rows of the vias, the first signal trace positioned adjacent to the first row and the second signal trace positioned adjacent to the second row. The first signal trace can include at least one curved segment that curves around a substantial portion of a corresponding via in the first row such that separation between the first and second signal traces varies along the curved segment.

Abstract: A dual-path signal interconnect is provided. The interconnect can include a first signal trace, first and second solder pads positioned above and connected to the first signal trace, and a third solder pad. The second solder pad separates from the first solder pad. The third solder pad separates from the second solder pad and is connected to a second signal trace. The first and second solder pads are to allow a pin of a connector to be soldered to the first and second solder pads, such that, when the pin of the external connector is soldered, high-speed electrical signals from the first signal trace are routed to the connector. The second and third solder pads are to allow a conductor to be soldered to the second and third solder pads, such that, when the conductor is soldered, the high-speed electrical signals are routed to the second signal trace.

Abstract: This invention relates generally to a software-enabled, computer-implemented neural processing system for a non-player character (NPC) in a computer-enabled virtual environment. The system includes a plurality of virtual sensors configured to detect one or more virtual stimuli presented by the virtual environment to the NPC and present corresponding stimuli detection signals in response to the one or more virtual stimuli. The neural processing system may also include a virtual neo cortex, which may include a plurality of processing modules that are each configured to process stimuli detection signals output from the plurality of virtual sensors. The neural processing system also may include a virtual thalamus module configured to receive the stimuli detection signals and transmit the stimuli detection signals to the appropriate processing modules of the virtual neo cortex.

Abstract: An approach for consistent database recovery for distributed database systems uses “synchronization points”. A synchronization point is a global timestamp for which across all nodes of a distributed database system, the nodes have stored change records for any transaction occurring at and before the synchronization point in persistent logs. Each node may employ asynchronous flushing. However, on a periodic basis, each node coordinates to establish a synchronization point, which may entail ensuring change records for transactions that committed at or before the synchronization point are stored in persistent logs. In effect, a synchronization point represents that any transaction committed at or before the synchronization point has been durably committed.