Patents by Inventor Chi Kuen Leung

Chi Kuen Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic Circuit Package
    Publication number: 20090189269
    Abstract: A electronic circuit package having a flexible substrate with metals layers on one or more of its surfaces forming a wiring pattern and/or surface mount bonding pads. Passive electronic components are integrated onto component packages that are mounted to the flexible substrate and electrically connected with the wiring pattern or bonding pad. An active electronic device is mounted on the flexible substrate or bonding pad.
    Type: Application
    Filed: January 24, 2008
    Publication date: July 30, 2009
    Inventors: Lap-Wai Lydia Leung, Chang Hwa Chung, Jie Liu, Chi Kuen Leung, Chiu Lun Chan
  • Electronic Circuit Package
    Publication number: 20090115051
    Abstract: An electronic circuit package has a thin-film circuit integrated with the ceramic substrate. The thin-film circuit includes at least two passive circuit elements joined by an integrated electrical interconnect. At least one active power electronic component mounted on the ceramic substrate and is electrically connected with the integrated thin-film circuit.
    Type: Application
    Filed: November 1, 2007
    Publication date: May 7, 2009
    Inventors: Lap-Wai Lydia Leung, Yu-Chih Chen, Chi Kuen Leung, Jyh-Rong Lin, Chang Hwa Chung