Abstract: A height of a vertical wire interconnection bonded onto a substrate is measured by first capturing a top view of the vertical wire interconnection and identifying a position of a tip end of the vertical wire interconnection from the top view. A conductive probe is located over the tip end of the vertical wire interconnection, and is lowered towards the vertical wire interconnection until an electrical connection is made between the conductive probe and the tip end of the vertical wire interconnection. A contact height at which the electrical connection is made may thus be determined, wherein the contact height corresponds to the height of the vertical wire interconnection.

Abstract: A wire bonding method, comprising the steps of: extending a length of bonding wire from a capillary to form a wire tail; deforming a point on the wire tail to form a weakened portion between the wire tail and a remainder of the bonding wire retained within the capillary; and retracting at least a portion of the wire tail including the weakened portion into the capillary prior to bonding the wire tail to at least one of a bonding pad and a substrate.

Abstract: A height of a vertical wire interconnection bonded onto a substrate is measured by first capturing a top view of the vertical wire interconnection and identifying a position of a tip end of the vertical wire interconnection from the top view. A conductive probe is located over the tip end of the vertical wire interconnection, and is lowered towards the vertical wire interconnection until an electrical connection is made between the conductive probe and the tip end of the vertical wire interconnection. A contact height at which the electrical connection is made may thus be determined, wherein the contact height corresponds to the height of the vertical wire interconnection.

Abstract: A wire bonding method, comprising the steps of: extending a length of bonding wire from a capillary to form a wire tail; deforming a point on the wire tail to form a weakened portion between the wire tail and a remainder of the bonding wire retained within the capillary; and retracting at least a portion of the wire tail including the weakened portion into the capillary prior to bonding the wire tail to at least one of a bonding pad and a substrate.

Abstract: The invention provides a method of bonding wire between first and second bonding points with a bonding tool. It comprises the steps of forming a first bond at the first bonding point with the bonding tool, forming a first kink located over the first bond, and moving the bonding tool to a first position spaced from the first kink by a predetermined distance to release a length of wire from the bonding tool. It further comprises the step of moving the bonding tool in a direction away from the second bonding point to a second position which is outside a plane comprising the first bonding point, the second bonding point, and the first kink. It also comprises the steps of forming a second kink which lies outside the plane, and moving the bonding tool to the second bonding point to form a second bond.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.