Patents by Inventor Chi Kwong Lo

Chi Kwong Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Air cavity package configured to electrically couple to a printed circuit board and method of providing same
    Patent number: 8853564
    Abstract: In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: October 7, 2014
    Assignee: Ubotic Intellectual Property Co. Ltd.
    Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
  • Semiconductor package for MEMS device and method of manufacturing same
    Patent number: 8809974
    Abstract: In some embodiments, a semiconductor package can include: (a) a base having a cavity; (b) an interposer coupled to the base and at least partially over the cavity such that the interposer and the base form a back chamber, the interposer has a first opening into the back chamber; (c) a micro-electro-mechanical system device located over the interposer at the first opening; and (d) a lid coupled to the base. Other embodiments also are disclosed.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: August 19, 2014
    Assignee: Ubotic Intellectual Property Company Limited
    Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
  • Semiconductor package configured to electrically couple to a printed circuit board and method of providing same
    Patent number: 8742569
    Abstract: In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base coupled to the lid and having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. At least one of the lid or the base can have at least one port hole. The one or more first electrically conductive leads can be configured to couple to the printed circuit board. Other embodiments are disclosed.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: June 3, 2014
    Assignee: Ubotic Intellectual Property Co. Ltd.
    Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
  • AIR CAVITY PACKAGE CONFIGURED TO ELECTRICALLY COUPLE TO A PRINTED CIRCUIT BOARD AND METHOD OF PROVIDING SAME
    Publication number: 20130128487
    Abstract: In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole.
    Type: Application
    Filed: April 30, 2010
    Publication date: May 23, 2013
    Applicant: UBOTIC INTELLECTUAL PROPERTY CO. LTD.
    Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
  • SEMICONDUCTOR PACKAGE CONFIGURED TO ELECTRICALLY COUPLE TO A PRINTED CIRCUIT BOARD AND METHOD OF PROVIDING SAME
    Publication number: 20130032905
    Abstract: In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base coupled to the lid and having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. At least one of the lid or the base can have at least one port hole. The one or more first electrically conductive leads can be configured to couple to the printed circuit board. Other embodiments are disclosed.
    Type: Application
    Filed: April 30, 2010
    Publication date: February 7, 2013
    Applicant: UBOTIC INTELLECTUAL PROPERTY CO. LTD.
    Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
  • SEMICONDUCTOR PACKAGE FOR MEMS DEVICE AND METHOD OF MANUFACTURING SAME
    Publication number: 20120319256
    Abstract: In some embodiments, a semiconductor package can include: (a) a base having a cavity; (b) an interposer coupled to the base and at least partially over the cavity such that the interposer and the base form a back chamber, the interposer has a first opening into the back chamber; (c) a micro-electro-mechanical system device located over the interposer at the first opening; and (d) a lid coupled to the base. Other embodiments also are disclosed.
    Type: Application
    Filed: February 26, 2010
    Publication date: December 20, 2012
    Applicant: UBOTIC INTELLECTUAL PROPERTY COMPANY LIMITED
    Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam