Patents by Inventor Chi Leung Vincent Mok

Chi Leung Vincent Mok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vision system for positioning a bonding tool
    Patent number: 7810698
    Abstract: An apparatus for correcting a positional offset of a bonding tool during bonding operations comprises a first fiducial mark and a second fiducial mark spaced from the first fiducial mark located on the bonding tool. A first imaging path emanates from the first fiducial mark and a second imaging path emanates from the second fiducial mark when the first and second fiducial marks are illuminated at a reference position. An optical system is positioned along the first and second imaging paths to view images of the first and second fiducial marks. A processor is operative to calculate a current position of the bonding tool and to compare it to a desired position so that the bonding tool's positional offset may be corrected by moving it to the desired position.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: October 12, 2010
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Kwok Kee Chung, Wing Hong Leung, Ka Fai Fung, Chi Leung Vincent Mok, Shun Ming Kenneth Fung
  • VISION SYSTEM FOR POSITIONING A BONDING TOOL
    Publication number: 20100125348
    Abstract: An apparatus for correcting a positional offset of a bonding tool during bonding operations comprises a first fiducial mark and a second fiducial mark spaced from the first fiducial mark located on the bonding tool. A first imaging path emanates from the first fiducial mark and a second imaging path emanates from the second fiducial mark when the first and second fiducial marks are illuminated at a reference position. An optical system is positioned along the first and second imaging paths to view images of the first and second fiducial marks. A processor is operative to calculate a current position of the bonding tool and to compare it to a desired position so that the bonding tool's positional offset may be corrected by moving it to the desired position.
    Type: Application
    Filed: November 20, 2008
    Publication date: May 20, 2010
    Inventors: Kwok Kee CHUNG, Wing Hong LEUNG, Ka Fai FUNG, Chi Leung Vincent MOK, Shun Ming Kenneth FUNG