Patents by Inventor Chi Liang

Chi Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260142342
    Abstract: Embodiments provide a battery cell having a cylindrical housing with a first end and a second end opposite the first end, wherein the second end is enclosed. The battery cell also includes an electrode assembly positioned within the housing between the first end and the second end. The electrode assembly includes an anode, a cathode, and one or more separator sheets. The battery cell further includes a conductor configured to electrically couple one of the anode or the cathode to the housing. The conductor includes a first side facing the electrode assembly, a second side opposite the first side and facing the housing, and an embossed portion for improving a welding operation for welding the conductor to the housing.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 21, 2026
    Inventors: Dan GENG, Denis Gaston FAUTEUX, Jin Wei LI, Chi LIANG
  • Publication number: 20260058329
    Abstract: A battery cell includes a housing (14), a terminal (30) coupled to the housing (14), an electrode assembly (18) positioned within the housing (14), a conductor (38) including a first portion (74) coupled to the electrode assembly (18) and a second portion (78) coupled to the terminal (30), and one or more fuses coupled to the conductor (38) and situated at least partially between the first and second portions. The first and second portions of the conductor (38) are folded in opposite directions to form the conductor into an S-shape, and the one or more fuses are rated for interrupting current flow between the terminal (30) and the electrode assembly (18) in response to an overcurrent event.
    Type: Application
    Filed: September 14, 2022
    Publication date: February 26, 2026
    Inventors: Dan GENG, Denis Gaston FAUTEUX, Jin Wei LI, Chi LIANG
  • Patent number: 7365978
    Abstract: A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: April 29, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxcomm Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Meng Fu, Chi Liang
  • Patent number: 7218522
    Abstract: A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: May 15, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Meng Fu, Chi Liang
  • Publication number: 20070077880
    Abstract: An airflow-guiding device for being mounted into a computer system to periodically change airflow passing therethrough, comprises a motor, a gearing driven by the motor and a plurality of airflow-guiding plates pivoted to a frame and linked to the gearing and driven thereby to turn back and forth periodically. The gearing comprises a cam driven by the motor and a sliding board slideably mounted on a supporting member. The sliding board has a lateral side always in contact with the cam so that when the cam rotates, the sliding plate slides on the supporting member. The airflow-guiding plates each have a linking rod linked to the sliding board. The airflow-guiding plates periodically turn within a given angle following the rotation of the cam so as to change direction of airflow passing through the airflow-guiding plates.
    Type: Application
    Filed: October 3, 2005
    Publication date: April 5, 2007
    Applicant: Focxonn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Chi Liang
  • Patent number: 7047640
    Abstract: A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: May 23, 2006
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Meng Fu, Chi Liang
  • Publication number: 20060104036
    Abstract: A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.
    Type: Application
    Filed: May 23, 2005
    Publication date: May 18, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhuo, Meng Fu, Chi Liang
  • Publication number: 20060059684
    Abstract: A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.
    Type: Application
    Filed: March 1, 2005
    Publication date: March 23, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Meng Fu, Chi Liang
  • Publication number: 20060032617
    Abstract: A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of heat absorbing portion. The first heat dissipation member is made of a second metal material and coupled to the heat absorbing portion of the base. The second heat dissipation member is made of second metal material and coupled to the heat conductive portion of the base. The first metal material differs from and has higher heat conductivity than the second metal material.
    Type: Application
    Filed: December 14, 2004
    Publication date: February 16, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Chi Liang, Meng Fu
  • Publication number: 20060018096
    Abstract: A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.
    Type: Application
    Filed: May 23, 2005
    Publication date: January 26, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Meng Fu, Chi Liang