Abstract: A guaranteeing server and a guaranteeing method for transaction on blockchain are disclosed. The guaranteeing server is coupled to a blockchain network and comprises a memory unit and one or more processing units. The memory unit stores a plurality of instructions and the processing units execute the instructions to perform steps of: receiving a transaction data from a user, wherein the transaction data includes a wallet data including a wallet address data and a user's signature data; checking whether a cryptocurrency balance associated with the wallet address data on the blockchain network is sufficient to execute the transaction; when the cryptocurrency balance is sufficient to execute the transaction, transmitting the transaction data to the blockchain network for performing a blockchain operation; and transmitting a transaction guarantee information corresponding to the transaction data to an opposing party of the transaction.

Abstract: An authenticating server is coupled to a blockchain network is configured to: (1) receive a transaction application data from a user, wherein the transaction application data includes a wallet data containing a wallet address data and a user's signature data; (2) check whether an amount of a cryptocurrency corresponding to the wallet address data on the blockchain network is sufficient to perform the transaction; and (3) when the amount of the cryptocurrency corresponding to the wallet address data on the blockchain network is sufficient to perform the transaction, transmit a multi-signature wallet transaction data to the blockchain network for validating a blockchain operation, and send a confirmation data of the transaction associated with the transaction application data to an opposing party of the transaction. The multi-signature wallet transaction data includes the wallet address data, the user's signature data and a signature date of the authenticating server.

Abstract: A method for depositing a copper layer on a substrate is disclosed. The method is achieved by heating a plating solution located between a heating device and a target substrate. Through the process illustrated above, metal nano-particles come out from the plating solution and deposit on a substrate with high aspect ratio. Surfactant can be selectively added for obtaining ultra-thin continuous film, void-free copper connectors. Furthermore, a copper film would achieve a preferred (111) crystallization orientation.