Abstract: In a method for obtaining the equivalent oxide thickness of a dielectric layer, a first semiconductor capacitor including a first silicon dioxide layer and a second semiconductor capacitor including a second silicon dioxide layer are provided and a modulation voltage is applied to the semiconductor capacitors to measure a first scanning capacitance microscopic signal and a second scanning capacitance microscopic signal. According to the equivalent oxide thicknesses of the silicon dioxide layers and the scanning capacitance microscopic signals, an impedance ratio is calculated. The modulation voltage is applied to a third semiconductor capacitor including a dielectric layer to measure a third scanning capacitance microscopic signal. Finally, the equivalent oxide thickness of the dielectric layer is obtained according to the equivalent oxide thickness of the first silicon dioxide layer, the first scanning capacitance microscopic signal, third scanning capacitance microscopic signal, and the impedance ratio.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: The present disclosure provides an automatic processing apparatus including a main body, a receiving portion, a working assembly, a workpiece magazine, a setting mechanism, a passivation bucket assembly, and a rotation driving assembly. The receiving portion is adapted for receiving a plurality of workpieces. The setting mechanism takes the workpieces to the receiving portion from the workpiece magazine. The working assembly is adapted for bringing the workpieces to the passivation bucket assembly for processing. The passivation bucket assembly includes a turning table and a plurality of passivation buckets moving when the turning table rotates. The rotation driving assembly drives one of the passivation buckets to rotate. Thereby, automatic processing can be achieved by the apparatus of the present invention, and the efficiency of processing is improved too.

Abstract: A sewing apparatus includes a sewing machine, an electronic paper and a processor. The processor is disposed in the sewing machine, is electrically connected to the electronic paper and the sewing machine, and stores one set of program codes. The processor controls the sewing machine to perform a sewing procedure upon executing the set of program codes when the sewing machine is in an activated state, and controls the electronic paper to display default content related to an operation manual of the sewing machine when the sewing machine is in an inactivated state.