Abstract: A method of making a semiconductor device includes manufacturing a first transistor over a first side of a substrate. The method further includes depositing a spacer material against a sidewall of the first transistor. The method further includes recessing the spacer material to expose a first portion of the sidewall of the first transistor. The method further includes manufacturing a first electrical connection to the transistor, a first portion of the electrical connection contacts a surface of the first transistor farthest from the substrate, and a second portion of the electrical connect contacts the first portion of the sidewall of the first transistor. The method further includes manufacturing a self-aligned interconnect structure (SIS) extending along the spacer material, wherein the spacer material separates a portion of the SIS from the first transistor, and the first electrical connection directly contacts the SIS.

Abstract: The present application discloses a crosstalk elimination method and a playback system for crosstalk elimination. The method includes steps: inputting a first test signal into a signal processor via an audio source input cable; detecting a first crosstalk signal generated by a second speaker and caused by a first test signal when the signal processor transmitting the first test signal to the first speaker; reversing the detected first crosstalk signal to a first reversed signal having equal volume and opposite phase, wherein when the signal processor transmits the first test signal to the first speaker again, the second speaker receives the first crosstalk signal and emits a first crosstalk sound, the first reversed signal is transmitted to the second speaker to emit a first reversed phase sound, and the first reversed phase sound eliminates the first crosstalk sound.

Abstract: A device includes a plurality of tracks, wherein at least one of the plurality of tracks comprises a first power rail for a first voltage. The device further includes a first via in electrical contact with the power rail. The device further includes a first contact in electrical contact with the first via. The device further includes a first transistor in electrical contact with the first contact. The device further includes a second transistor in electrical isolation with the first transistor. The device further includes a second contact in electrical contact with the second transistor. The device further includes a second via in electrical contact with the second contact. The device further includes a second power rail in electrical contact with the second via, wherein the second power rail is configured to carry a second voltage.

Abstract: A stripper composition and a method for stripping a photoresist are provided. The stripper composition includes an ether-alcohol-based organic solvent (A), another organic solvent (B), an alkaline substance (C), a substrate corrosion inhibitor (D), and water (E). The another organic solvent (B) does not include the ether-alcohol-based organic solvent. The alkaline substance (C) includes an organic base (C1), an inorganic base (C2), or a combination thereof. Based on a total usage amount of 100 parts by weight of the stripper composition, a usage amount of the ether-alcohol-based organic solvent (A) is 7 parts by weight to 70 parts by weight, and a usage amount of the substrate corrosion inhibitor (D) is greater than 0 part by weight and less than 18 parts by weight.

Abstract: A method for producing graphene, configured for forming a graphene layer on a surface of an object. The method includes steps of: depositing a poly-p-xylene material layer on the surface: and converting the poly-p-xylene material layer into a graphene layer by using a laser sintering process or a plasma-assisted sintering process.

Abstract: A method for producing graphene, configured for forming a graphene layer on a surface of an object. The method includes steps of: depositing a poly-p-xylene material layer on the surface: and converting the poly-p-xylene material layer into a graphene layer by using a laser sintering process or a plasma-assisted sintering process.

Abstract: An electronic device is disclosed. The electronic device includes a display unit, a light sensor, and a processor. The display unit has a brightness value. The light sensor senses an ambient light to generate a light intensity signal. The processor is coupled to the display unit and the light sensor and accesses a program instruction from a memory to perform the following steps: continuously receiving the light intensity signal from the light sensor; smoothing a plurality of light intensity signals to generate a plurality of smoothing signals; and maintaining the brightness value of the display unit for a preset time period and then determining whether to adjust the brightness value when a difference generated by subtracting a previous smoothing signal of a target smoothing signal of the smoothing signals from the target smoothing signal is less than the first threshold or greater than the second threshold.

Abstract: An electronic device is disclosed. The electronic device includes a display unit, a light sensor, and a processor. The display unit has a brightness value. The light sensor senses an ambient light to generate a light intensity signal. The processor is coupled to the display unit and the light sensor and accesses a program instruction from a memory to perform the following steps: continuously receiving the light intensity signal from the light sensor; smoothing a plurality of light intensity signals to generate a plurality of smoothing signals; and maintaining the brightness value of the display unit for a preset time period and then determining whether to adjust the brightness value when a difference generated by subtracting a previous smoothing signal of a target smoothing signal of the smoothing signals from the target smoothing signal is less than the first threshold or greater than the second threshold.

Abstract: A memory card with a SATA connecter includes a SATA connector, a memory module, a controller, and a power control circuit. The SATA connector of the memory card is used for being connected with an electronic device. The SATA connector includes nine pins for receiving electric power, identifying a SATA interface signal, transmitting the SATA interface signal, and being connected with ground. The controller is electrically connected with the SATA connector and the memory module to control the data transmission between the memory card and the electronic device. The power control circuit is electrically connected with the connector, the memory module, and the controller to provide the electric power needed by the memory card.