Abstract: A manufacturing method for a LED is disclosed. The method includes: providing a substrate with an upper surface; preparing a plurality of LEDs on the upper surface; wherein the upper surface is divided into a plurality of zones, the plurality of LEDs composes a plurality of LED groups, and each of the LED group is disposed in one of the plurality of zones; preparing a testing circuit to electrically connecting the plurality of LEDs in one of the plurality of LED groups; testing the plurality of LEDs in the one of the plurality of LED groups by the testing circuit to obtain photoelectrical characteristics of the plurality of LEDs in the one of the plurality of LED groups; and presenting the photoelectric characteristics in an image.

Abstract: The present invention relates to a driving method of a cholesteric liquid crystal display. It includes the steps in the following: driving each scan line by a dynamic driving scheme (DDS) including an Evolution phase; refreshing a frame of the cholesteric liquid crystal display by a full refresh mode, each scan line driven N times during the Evolution phase in the full refresh mode; and refreshing a part of the frame by a partial-refresh mode, each scan line driven M times in the Evolution phase in the partial-refresh mode, wherein M is greater than N.

Abstract: A method of making a semiconductor device includes manufacturing a first transistor over a first side of a substrate. The method further includes depositing a spacer material against a sidewall of the first transistor. The method further includes recessing the spacer material to expose a first portion of the sidewall of the first transistor. The method further includes manufacturing a first electrical connection to the transistor, a first portion of the electrical connection contacts a surface of the first transistor farthest from the substrate, and a second portion of the electrical connect contacts the first portion of the sidewall of the first transistor. The method further includes manufacturing a self-aligned interconnect structure (SIS) extending along the spacer material, wherein the spacer material separates a portion of the SIS from the first transistor, and the first electrical connection directly contacts the SIS.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: Provided are semiconductor devices that include a first gate structure having a first end cap portion, a second gate structure having a second end cap portion coaxial with the first gate structure, a first dielectric region separating the first end cap portion and the second end cap portion, a first conductive element extending over the first gate structure, a second conductive element extending over the second gate structure, and a gate via electrically connecting the second gate structure and the second conductive element, with the first dielectric region having a first width and being positioned at least partially under the first conductive element and defines a spacing between the gate via and an end of the second end cap portion that exceeds a predetermined distance.

Abstract: An electronic device is disclosed. The electronic device includes a display unit, a light sensor, and a processor. The display unit has a brightness value. The light sensor senses an ambient light to generate a light intensity signal. The processor is coupled to the display unit and the light sensor and accesses a program instruction from a memory to perform the following steps: continuously receiving the light intensity signal from the light sensor; smoothing a plurality of light intensity signals to generate a plurality of smoothing signals; and maintaining the brightness value of the display unit for a preset time period and then determining whether to adjust the brightness value when a difference generated by subtracting a previous smoothing signal of a target smoothing signal of the smoothing signals from the target smoothing signal is less than the first threshold or greater than the second threshold.

Abstract: An electronic device is disclosed. The electronic device includes a display unit, a light sensor, and a processor. The display unit has a brightness value. The light sensor senses an ambient light to generate a light intensity signal. The processor is coupled to the display unit and the light sensor and accesses a program instruction from a memory to perform the following steps: continuously receiving the light intensity signal from the light sensor; smoothing a plurality of light intensity signals to generate a plurality of smoothing signals; and maintaining the brightness value of the display unit for a preset time period and then determining whether to adjust the brightness value when a difference generated by subtracting a previous smoothing signal of a target smoothing signal of the smoothing signals from the target smoothing signal is less than the first threshold or greater than the second threshold.

Abstract: A memory card with a SATA connecter includes a SATA connector, a memory module, a controller, and a power control circuit. The SATA connector of the memory card is used for being connected with an electronic device. The SATA connector includes nine pins for receiving electric power, identifying a SATA interface signal, transmitting the SATA interface signal, and being connected with ground. The controller is electrically connected with the SATA connector and the memory module to control the data transmission between the memory card and the electronic device. The power control circuit is electrically connected with the connector, the memory module, and the controller to provide the electric power needed by the memory card.