Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.

Abstract: A resonant vibration actuator is provided, comprising: a casing, a mover, a plurality of electromagnet sets, two elastic suspensions, and a connecting circuit; the casing is provided with connection terminals for connection on the outside; the mover comprising: a mover frame, a plurality of permanent magnet units, two magnetic backs, the permanent magnet units and the magnetic backs being arranged in the mover frame; the electromagnet sets being arranged between two permanent magnet units of the mover; the elastic suspensions being connected to the casing and the mover respectively through two connection portions at both ends; the connecting circuit being used to connect the electromagnet set and the connection terminals outside the casing; wherein, by energizing the electromagnet set, the electromagnet acts on the permanent magnet unit to make the mover move relatively in the casing to generate vibration.

Abstract: A semiconductor light emitting device includes a multi-quantum-well structure, a first capping layer, a second capping layer, and an electron barrier layer stacked in order. The multi-quantum-well structure includes a plurality of alternately-stacked potential barrier layers and potential well layers. The first capping layer is a semiconductor layer, and the second capping layer is a p-doped semiconductor layer. Each of the first and second capping layers has an aluminum mole fraction larger than that of each of the potential barrier layers, and the aluminum mole fraction of the first capping layer is larger than that of at least a portion of the electron barrier layer. A method for preparing the semiconductor light emitting device is also provided.

Abstract: A linear vibration motor is disclosed, including: a movable part, a suspension device, and a fixed part; wherein the movable part includes at least one magnet set, and the fixed part at least includes a coil, at least one magnetically conductive element and a housing; the magnet set and the coil and the magnetically conductive element of the fixed part are arranged with a gap. The magnetically conductive element is located above, below, or both above and below the magnet set; the suspension device includes two stripe springs, respectively located on both sides of the movable part, with one side of each stripe spring connected to the movable part, and the other side connected to the fixed part. When not actuated, the suspension device is a straight full-length stripe without bending at the connections at both ends.

Abstract: A linear vibration motor is disclosed, including: a movable part, a suspension device, and a fixed part; wherein the movable part includes at least one magnet set, and the fixed part at least includes a coil, at least one magnetically conductive element and a housing; the magnet set and the coil and the magnetically conductive element of the fixed part are arranged with a gap. The magnetically conductive element is located above, below, or both above and below the magnet set; the suspension device includes two stripe springs, respectively located on both sides of the movable part, with one side of each stripe spring connected to the movable part, and the other side connected to the fixed part. When not actuated, the suspension device is a straight full-length stripe without bending at the connections at both ends.

Abstract: A method and structure for compensating tolerances in assembling modules are provided. The method applies to a pressing fixture and a module with a baseline reference plane and an assembly baseline plane. The assembly baseline plane has at least three compensation baseline bumps, having the height greater than the compensation amount. The pressing fixture has a calibration reference plane. The method comprises: adjusting the position of the module or the pressing fixture to make the baseline reference plane parallel to the calibration reference plane; the pressing fixture using the calibration reference plane to press on the compensation baseline bumps, and changing the position of bump top of each compensation baseline bump; removing the pressing fixture from the compensation baseline bumps, and the plurality of the bump tops forming a preliminary baseline plane, and the preliminary baseline plane being parallel to the baseline reference plane.

Abstract: A method and structure for compensating tolerances in assembling modules are provided. The method applies to a pressing fixture and a module with a baseline reference plane and an assembly baseline plane. The assembly baseline plane has at least three compensation baseline bumps, having the height greater than the compensation amount. The pressing fixture has a calibration reference plane. The method comprises: adjusting the position of the module or the pressing fixture to make the baseline reference plane parallel to the calibration reference plane; the pressing fixture using the calibration reference plane to press on the compensation baseline bumps, and changing the position of bump top of each compensation baseline bump; removing the pressing fixture from the compensation baseline bumps, and the plurality of the bump tops forming a preliminary baseline plane, and the preliminary baseline plane being parallel to the baseline reference plane.

Abstract: A dual-lens mechanic zero tilt angle adjustment method is disclosed, comprising a preparation step, an adjustment step and an engagement step, wherein preparation step comprising: disposing a dual-lens at one or two voice coil motors (VCM), with the dual-lens having optical axes respectively unparallel to the normal of the plane of an adaptor, and the optical axes forming a first and second tilt angles with the normal of the adaptor plane; adjustment step comprising: adjusting the first and second tilt angles by moving VCM to zero degree; and engagement step comprising: adhering the bottom of VCM to an engagement surface of adaptor to obtain a structure of dual-lens mechanic zero tilt angle. As such, the adaptor plane is engaged to the image sensor, and the tilt angles between the optical axes of dual-lens and the axis of the image sensor are both zero to improve imaging quality.

Abstract: A single-lens mechanic zero tilt angle adjustment method is disclosed, comprising a preparation step, an adjustment step and an engagement step, wherein preparation step comprising: disposing a lens at a voice coil motor (VCM), with a gap between the bottom of VCM and an engagement surface of an adaptor and the lens optical axis forming a tilt angle with the normal the adaptor plane; adjustment step comprising: adjusting the tilt angle by moving VCM and/or adaptor to zero degree and the optical axis perpendicular to the adaptor plane; and engagement step comprising: adhering the bottom of VCM to an engagement surface of adaptor to obtain a structure of single-lens mechanic zero tilt angle. As such, the adaptor plane is engaged to the image sensor, and the tilt angles between the lens optical axis o and the axis of the image sensor is zero to improve imaging quality.

Abstract: An objective lens holding apparatus includes an upper supporting portion and a bottom supporting portion not parallel with each other. The upper supporting portion and the bottom supporting portion have respectively one end connecting to an objective lens holder and another end connecting to a supporting arm anchor dock. The objective lens is mounted to the objective lens holder and is prevented from incurring an inclined angle while the objective lens is yawing. The elastic supporting arm anchor dock can keep the high resonant frequency within a desired range to enhance the stability of the optical pick-up head during reading and writing operations.

Abstract: An objective lens holding apparatus includes an upper supporting portion and a bottom supporting portion not parallel with each other. The upper supporting portion and the bottom supporting portion have respectively one end connecting to an objective lens holder and another end connecting to a supporting arm anchor dock. The objective lens is mounted to the objective lens holder and is prevented from incurring an inclined angle while the objective lens is yawing. The elastic supporting arm anchor dock can keep the high resonant frequency within a desired range to enhance the stability of the optical pick-up head during reading and writing operations.