Patents by Inventor CHI LONG LIN

CHI LONG LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240311959
    Abstract: A frame interpolation method generates an interpolated frame that is temporally between a first frame and a second frame. A first and a second interpolated frames are generated using motion vectors from a first motion estimator and a second motion estimator, respectively. A weighting map is generated based on indications from the first motion estimator. First pixel locations and second pixel locations in the weighting map are assigned weight values of 1 and 0, respectively. A weighted combination is calculated using the weighting map to produce the interpolated frame output, which includes the first pixel locations from the first interpolated frame and the second pixel locations from the second interpolated frame. The first and the second motion estimators may be an optical flow estimator and the game engine renderer, respectively. Alternatively, the first and the second motion estimators may be the game engine renderer and the optical flow estimator, respectively.
    Type: Application
    Filed: March 14, 2024
    Publication date: September 19, 2024
    Inventors: Tsung-Shian Huang, Huei-Long Wang, Yan-Hong Zhang, Chi-Chiang Huang, Kuo-Yi Wang, An-Li Wang, Chien-Nan Lin
  • Patent number: 9251953
    Abstract: A method of manufacturing common mode filter having heterogeneous laminates, the method includes steps of providing a nonmagnetic insulating substrate; forming a magnetic layer; forming a first lead; forming a first insulating layer; forming a first through hole; forming a first coil; forming a second insulating layer; forming a second coil; forming a third insulating layer; forming a second through hole; forming a second lead; forming a fourth insulating layer; and depositing a first magnetic material.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: February 2, 2016
    Assignee: INPAQ TECHNOLOGY CO., LTD.
    Inventors: Yu Chia Chang, Chi Long Lin, Huai Luh Chang, Cheng Yi Wang
  • Patent number: 9007149
    Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: April 14, 2015
    Assignee: Inpaq Technology Co., Ltd.
    Inventors: Yu Chia Chang, Chi Long Lin, Cheng Yi Wang, Shin Min Tai
  • Publication number: 20140186526
    Abstract: A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.
    Type: Application
    Filed: March 7, 2014
    Publication date: July 3, 2014
    Applicant: Inpaq Technology Co., Ltd.
    Inventors: YU CHIA CHANG, CHI LONG LIN, HUAI LUH CHANG, CHENG YI WANG
  • Publication number: 20130076456
    Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.
    Type: Application
    Filed: August 10, 2012
    Publication date: March 28, 2013
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: YU CHIA CHANG, CHI LONG LIN, CHENG YI WANG, SHIN MIN TAI
  • Publication number: 20130015935
    Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, and a fourth coil connected in series with the second coil. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils.
    Type: Application
    Filed: May 29, 2012
    Publication date: January 17, 2013
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: YU CHIA CHANG, CHI LONG LIN, CHENG YI WANG, SHIN MIN TAI
  • Publication number: 20130009740
    Abstract: A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.
    Type: Application
    Filed: March 26, 2012
    Publication date: January 10, 2013
    Applicant: INPAQ TECHNOLOGY CO., LTD.
    Inventors: YU CHIA CHANG, CHI LONG LIN, HUAI LUH CHANG, CHENG YI WANG