Patents by Inventor CHI-LU CHIH

CHI-LU CHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Brittle nonmetallic workpiece and method and device for making same
    Patent number: 8497451
    Abstract: An exemplary brittle non-metallic workpiece (70) is made by the laser beam (31), a cutting surface (701 ) of the brittle non-metallic workpiece has no micro cracks. A method for making the brittle non-metallic workpiece includes: focusing a laser beam on the brittle non-metallic substrate to form an elliptic beam spot; driving the laser beam to move along a predetermined curved cutting path, making a center of a major axis of the elliptic beam spot intersecting along the predetermined curved cutting path and the major axis being tangent to the predetermined curved cutting path at the intersecting point; a coolant stream following the elliptic beam spot to move, thus producing a crack in the brittle non-metallic substrate corresponding to the predetermined curved cutting path; separating the brittle non-metallic substrate along the crack. A laser cutting device (40) for making the same is also provided.
    Type: Grant
    Filed: June 18, 2008
    Date of Patent: July 30, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Mu-Chi Hsu, Qing Liu, Guo-Han Yue, Chi-Lu Chih, Jun-Qi Li
  • BRITTLE NONMETALLIC WORKPIECE AND METHOD AND DEVICE FOR MAKING SAME
    Publication number: 20090159580
    Abstract: An exemplary brittle non-metallic workpiece (70) is made by the laser beam (31), a cutting surface (701 ) of the brittle non-metallic workpiece has no micro cracks. A method for making the brittle non-metallic workpiece includes: focusing a laser beam on the brittle non-metallic substrate to form an elliptic beam spot; driving the laser beam to move along a predetermined curved cutting path, making a center of a major axis of the elliptic beam spot intersecting along the predetermined curved cutting path and the major axis being tangent to the predetermined curved cutting path at the intersecting point; a coolant stream following the elliptic beam spot to move, thus producing a crack in the brittle non-metallic substrate corresponding to the predetermined curved cutting path; separating the brittle non-metallic substrate along the crack. A laser cutting device (40) for making the same is also provided.
    Type: Application
    Filed: June 18, 2008
    Publication date: June 25, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: MU-CHI HSU, QING LIU, GUO-HAN YUE, CHI-LU CHIH, JUN-QI LI