Abstract: In a method for obtaining the equivalent oxide thickness of a dielectric layer, a first semiconductor capacitor including a first silicon dioxide layer and a second semiconductor capacitor including a second silicon dioxide layer are provided and a modulation voltage is applied to the semiconductor capacitors to measure a first scanning capacitance microscopic signal and a second scanning capacitance microscopic signal. According to the equivalent oxide thicknesses of the silicon dioxide layers and the scanning capacitance microscopic signals, an impedance ratio is calculated. The modulation voltage is applied to a third semiconductor capacitor including a dielectric layer to measure a third scanning capacitance microscopic signal. Finally, the equivalent oxide thickness of the dielectric layer is obtained according to the equivalent oxide thickness of the first silicon dioxide layer, the first scanning capacitance microscopic signal, third scanning capacitance microscopic signal, and the impedance ratio.

Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: A computer-implemented method for medical device modeling includes accessing an electronic definition for a model of a three-dimensional item and an electronic definition of a three-dimensional spline relating to an internal anatomical volume; determining, with a computer-based finite element analysis system and using the electronic definitions, stresses created by the three-dimensional item along the three-dimensional spline, for different points along the three-dimensional spline; and displaying stress data generated by the finite element analysis system with a visualization system, the display of the stress data indicating levels of stress on portions of the three-dimensional item at particular locations along the three-dimensional spline.

Abstract: A computer-implemented method for medical device modeling includes accessing an electronic definition for a model of a three-dimensional item and an electronic definition of a three-dimensional spline relating to an internal anatomical volume; determining, with a computer-based finite element analysis system and using the electronic definitions, stresses created by the three-dimensional item along the three-dimensional spline, for different points along the three-dimensional spline; and displaying stress data generated by the finite element analysis system with a visualization system, the display of the stress data indicating levels of stress on portions of the three-dimensional item at particular locations along the three-dimensional spline.

Abstract: A computer-implemented method for medical device modeling includes accessing an electronic definition for a model of a three-dimensional item and an electronic definition of a three-dimensional spline relating to an internal anatomical volume; determining, with a computer-based finite element analysis system and using the electronic definitions, stresses created by the three-dimensional item along the three-dimensional spline, for different points along the three-dimensional spline; and displaying stress data generated by the finite element analysis system with a visualization system, the display of the stress data indicating levels of stress on portions of the three-dimensional item at particular locations along the three-dimensional spline.

Abstract: A computer-implemented method for medical device modeling includes accessing an electronic definition for a model of a three-dimensional item and an electronic definition of a three-dimensional spline relating to an internal anatomical volume; determining, with a computer-based finite element analysis system and using the electronic definitions, stresses created by the three-dimensional item along the three-dimensional spline, for different points along the three-dimensional spline; and displaying stress data generated by the finite element analysis system with a visualization system, the display of the stress data indicating levels of stress on portions of the three-dimensional item at particular locations along the three-dimensional spline.

Abstract: This disclosure is directed to apparatuses, systems, and methods associated with a connector assembly for use with surface mount technology (SMT). The connector assembly has a connector header configured to be mounted to a circuit board and is constructed of a high-temperature resistant material suitable for use with a reflow soldering process. The connector header includes at least one connector socket and at least one mounting shoulder, and is configured to be coupled to a header attachment assembly. The header attachment assembly comprises at least one connector pin and at least one mounting shoulder, and is configured to be coupled to the connector header. An electronic device, such as a card reader or hard drive, may be connected to the header attachment assembly and thereby to the circuit board. The connector assembly allows for the obstructed view inserting and attaching in a manual or an automated assembly process.

Abstract: This disclosure is directed to apparatuses, systems, and methods associated with a connector assembly for use with surface mount technology (SMT). The connector assembly has a connector header configured to be mounted to a circuit board and is constructed of a high-temperature resistant material suitable for use with a reflow soldering process. The connector header includes at least one connector socket and at least one mounting shoulder, and is configured to be coupled to a header attachment assembly. The header attachment assembly comprises at least one connector pin and at least one mounting shoulder, and is configured to be coupled to the connector header. An electronic device, such as a card reader or hard drive, may be connected to the header attachment assembly and thereby to the circuit board. The connector assembly allows for the obstructed view inserting and attaching in a manual or an automated assembly process.

Abstract: This disclosure is directed to apparatuses, systems, and methods associated with a heat-dissipating card connector for use with a card reader connected to an electronic device. The connector has a body configured to receive a card that has circuitry, when the card is inserted into the card reader. The connector body includes a plurality of electronic contacts that engage the card circuitry and operationally link the card to the electronic device. The connector body includes at least one heat conductive spring that includes a card engaging portion. The card engaging portion contacts the card and directs heat from the card when the card is inserted in the card reader. A heat directing element, also part of the heat conductive spring, transfers heat from the card engaging portion to a heat-dissipating structure of the electronic device when the card is inserted in the card reader.

Abstract: This disclosure is directed to apparatuses, systems, and methods associated with a heat-dissipating card connector for use with a card reader connected to an electronic device. The connector has a body configured to receive a card that has circuitry, when the card is inserted into the card reader. The connector body includes a plurality of electronic contacts that engage the card circuitry and operationally link the card to the electronic device. The connector body includes at least one heat conductive spring that includes a card engaging portion. The card engaging portion contacts the card and directs heat from the card when the card is inserted in the card reader. A heat directing element, also part of the heat conductive spring, transfers heat from the card engaging portion to a heat-dissipating structure of the electronic device when the card is inserted in the card reader.

Abstract: This disclosure is directed to apparatuses, systems, and methods associated with a connector assembly for use with surface mount technology (SMT). The connector assembly has a connector header configured to be mounted to a circuit board and is constructed of a high-temperature resistant material suitable for use with a reflow soldering process. The connector header includes at least one connector socket and at least one mounting shoulder, and is configured to be coupled to a header attachment assembly. The header attachment assembly comprises at least one connector pin and at least one mounting shoulder, and is configured to be coupled to the connector header. An electronic device, such as a card reader or hard drive, may be connected to the header attachment assembly and thereby to the circuit board. The connector assembly allows for the obstructed view inserting and attaching in a manual or an automated assembly process.