Patents by Inventor Chi Lung Wong

Chi Lung Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9176011
    Abstract: A analog integrated sensor device has an interface with only a single ground line and a single signal line configured to receive power and output an analog value. A power capacitor is coupled between the ground line and the single signal line. An analog sensor circuitry is operable to be powered by the power capacitor and further operable to output an analog output signal on the single signal line once the power capacitor has bee charged sufficiently.
    Type: Grant
    Filed: March 6, 2013
    Date of Patent: November 3, 2015
    Assignee: MICROCHIP TECHNOLOGY INCORPORATED
    Inventors: Ge Wang, Ezana H. Aberra, Ronaldo Francisco, Chi Lung Wong
  • Publication number: 20140254630
    Abstract: A analog integrated sensor device has an interface with only a single ground line and a single signal line configured to receive power and output an analog value. A power capacitor is coupled between the ground line and the single signal line. An analog sensor circuitry is operable to be powered by the power capacitor and further operable to output an analog output signal on the single signal line once the power capacitor has bee charged sufficiently.
    Type: Application
    Filed: March 6, 2013
    Publication date: September 11, 2014
    Applicant: MICROCHIP TECHNOLOGY INCORPORATED
    Inventors: Ge Wang, Ezana H. Aberra, Ronaldo Francisco, Chi Lung Wong
  • Patent number: 8547122
    Abstract: A plurality of devices under test (DUT) are arranged in a strip tester having a temperature controlled heater block. Each DUT has a respective set of electrical test probes and a thermally conductive test probe for electrically and thermally coupling, respectively, of the strip tester to the DUTs. Temperature measurement of each of the plurality of DUTs is performed by a temperature measuring device. The temperature measuring device can be part of the test board of the strip tester and will be in thermal communications with the DUT through the thermally conductive test probe, or temperature of the DUT can be measurement with an RTD embedded in the thermally conductive test probe, thereby providing faster thermal response time.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: October 1, 2013
    Assignee: Microchip Technology Incorporated
    Inventors: Ronaldo Francisco, Chi Lung Wong, Tim Messang, Ezana Haile Aberra
  • Publication number: 20130015869
    Abstract: A plurality of devices under test (DUT) are arranged in a strip tester having a temperature controlled heater block. Each DUT has a respective set of electrical test probes and a thermally conductive test probe for electrically and thermally coupling, respectively, of the strip tester to the DUTs. Temperature measurement of each of the plurality of DUTs is performed by a temperature measuring device. The temperature measuring device can be part of the test board of the strip tester and will be in thermal communications with the DUT through the thermally conductive test probe, or temperature of the DUT can be measurement with an RTD embedded in the thermally conductive test probe, thereby providing faster thermal response time.
    Type: Application
    Filed: July 11, 2011
    Publication date: January 17, 2013
    Inventors: Ronaldo Francisco, Chi Lung Wong, Tim Messang, Ezana Haile Aberra