Abstract: Provided herein are protective masks made with polymer-based materials and methods of forming the materials. Methods of forming the interlaced polymer-based materials comprise applying adhesive to a substrate, electrospinning a first polymer solution onto the substrate from a first group of spinning electrodes, electrospinning a second polymer solution onto the substrate from a second group of spinning electrodes, and applying hot air to dry the polymer-based materials electrospun from the first polymer solution and the second polymer solution to form the interlaced polymer-based materials.

Abstract: A high power LED module assembly may include at least one high power LED module each of which includes a MCPCB and a high power LED disposed on the MCPCB, a flex tube which includes a base engaging with each of the high power LED modules and a cover enclosing the base; wherein the high power LED module assembly further comprises at least one heat sink each of which is correspondingly connected to the bottom of each high power LED modules; and wherein the cover is engaged with the heat sink and encloses the base, the high power LED module and all other sides of the heat sink than the bottom side thereof which is exposed to ambient environment.

Abstract: The present invention discloses an LED module comprising: a waterproof enclosure; an LED accommodated in the waterproof enclosure; a wire for coupling the LED module with other LED modules and a driver; and a radiating unit set in the bottom of the waterproof enclosure and exposed to the external environment. The invention further provides an LED chain comprising the above said LED module and a driver coupled with the LED module. The LED chain according to the invention may have a high waterproof level, for example, IP65. The heat generated during the operation of the high power LED module may be transmitted to the external environment in time via a heat sink set on the LED module, thereby effective thermal management for the LED module and a long service life of the LED module may be obtained. Moreover, the finish surface of the driver may be made handsome by encapsulating the driver through the low pressure molding.

Abstract: A high power LED module assembly may include at least one high power LED module each of which includes a MCPCB and a high power LED disposed on the MCPCB, a flex tube which includes a base engaging with each of the high power LED modules and a cover enclosing the base; wherein the high power LED module assembly further comprises at least one heat sink each of which is correspondingly connected to the bottom of each high power LED modules; and wherein the cover is engaged with the heat sink and encloses the base, the high power LED module and all other sides of the heat sink than the bottom side thereof which is exposed to ambient environment.

Abstract: The present invention discloses an LED module comprising: a waterproof enclosure; an LED accommodated in the waterproof enclosure; a wire for coupling the LED module with other LED modules and a driver; and a radiating unit set in the bottom of the waterproof enclosure and exposed to the external environment. The invention further provides an LED chain comprising the above said LED module and a driver coupled with the LED module. The LED chain according to the invention may have a high waterproof level, for example, IP65. The heat generated during the operation of the high power LED module may be transmitted to the external environment in time via a heat sink set on the LED module, thereby effective thermal management for the LED module and a long service life of the LED module may be obtained. Moreover, the finish surface of the driver may be made handsome by encapsulating the driver through the low pressure molding.