Patents by Inventor Chi-Mei Yan

Chi-Mei Yan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11675448
    Abstract: A touch panel having a visible area and a non-visible area disposed at least on one side of the visible area. The touch panel includes a substrate, a nano-metal conductive layer, a trace layer, a first passivation layer, and a second passivation layer. The nano-metal conductive layer is disposed on the substrate and at least in the visible area. The trace layer is disposed on the substrate and in the non-visible area. The trace layer is electrically connected to the nano-metal conductive layer. The first passivation layer covers the trace layer. The second passivation layer covers at least a portion of the first passivation layer. The first passivation layer has a different Young's modulus than the second passivation layer.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: June 13, 2023
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Chi-Mei Yan, Jin-Hui Zhang, Fang Fang, Kang-Yu Liu
  • Publication number: 20220187932
    Abstract: A touch panel having a visible area and a non-visible area disposed at least on one side of the visible area. The touch panel includes a substrate, a nano-metal conductive layer, a trace layer, a first passivation layer, and a second passivation layer. The nano-metal conductive layer is disposed on the substrate and at least in the visible area. The trace layer is disposed on the substrate and in the non-visible area. The trace layer is electrically connected to the nano-metal conductive layer. The first passivation layer covers the trace layer. The second passivation layer covers at least a portion of the first passivation layer. The first passivation layer has a different Young's modulus than the second passivation layer.
    Type: Application
    Filed: December 11, 2020
    Publication date: June 16, 2022
    Inventors: Chi-Mei Yan, Jin-Hui Zhang, Fang Fang, Kang-Yu Liu