Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a redistribution layer, a semiconductor die, conducting connectors, dummy bumps and an underfill. The semiconductor die is disposed on a top surface of the redistribution layer and electrically connected with the redistribution layer. The conducting connectors are disposed between the semiconductor die and the redistribution layer, and are physically and electrically connected with the semiconductor die and the redistribution layer. The dummy bumps are disposed on the top surface of the redistribution layer, beside the conducting connectors and under the semiconductor die. The underfill is disposed between the semiconductor die and the redistribution layer and sandwiched between the dummy bumps and the semiconductor die. The dummy bumps are electrically floating. The dummy bumps are in contact with the underfill without contacting the semiconductor die.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, a second encapsulant, and a conductive terminal. The first die includes a first connector, and the second die includes a second connector. The first encapsulant includes: a first portion, on the second die; a second portion, sandwiched between a first sidewall of the first die and a first sidewall of the second die; and a third portion, covering a second sidewall of the second die. The second encapsulant, laterally encapsulating the first die, the second die and the first encapsulant. The conductive terminal, electrically connected to the first die and the second die through a redistribution layer (RDL) structure. The third portion of first encapsulant is sandwiched between the second sidewall of the second die and the second encapsulant.

Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.

Abstract: An antenna module includes a feeding end, multiple first forked radiators, and multiple connecting parts. The first forked radiators are disposed side by side. The connecting parts respectively extend from the feeding end to the first forked radiators. The feeding end, the first forked radiators, and the connecting parts are located on a same plane. The antenna module resonates at a frequency band, and a path length from the feeding end to an end of each of the forked radiators through the corresponding connecting part is ¼ wavelength of the frequency band.

Abstract: A semiconductor structure includes a redistribution structure, topmost and bottom conductive terminals. The redistribution structure includes a topmost pad in a topmost dielectric layer, a topmost under-bump metallization (UBM) pattern directly disposed on the topmost pad and the topmost dielectric layer, a bottommost UBM pad embedded in a bottommost dielectric layer, and a bottommost via laterally covered by the bottommost dielectric layer. Bottom surfaces of the topmost pad and the topmost dielectric layer are substantially coplanar, bottom surfaces of the bottommost UBM pad and the bottommost dielectric layer are substantially coplanar, the bottommost via is disposed on a top surface of the bottommost UBM pad, top surfaces of the bottommost via and the bottommost dielectric layer are substantially coplanar. The topmost conductive terminal lands on a recessed top surface of the topmost UBM pattern, and the bottommost conductive terminal lands on the planar bottom surface of the bottommost UBM.

Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.

Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a gate electrode, a gate insulating layer, an active layer, a dielectric layer, a source electrode, and a drain electrode. The gate insulating layer is disposed between the gate electrode and the active layer, the dielectric layer is disposed on a side of the active layer, and the source electrode and the drain electrode pass through the dielectric layer to electrically connect with the active layer, wherein a first contact surface is formed between the source electrode and the active layer, a second contact surface is formed between the drain electrode and the active layer, the first contact surface and the second contact surface are subjected to a plasma treatment or a deposition treatment to form a protective interface layer.

Abstract: Provided is a word line structure including a substrate, a stack structure, and a metal silicide structure. The stack structure is disposed on the substrate. The metal silicide structure is disposed on the stack structure. The metal silicide structure includes a first metal element, a second metal element, and a silicon element. The first metal element is different from the second metal element, and concentrations of the first metal element and the second metal element gradually decrease along a direction from a top surface of the metal silicide structure to the substrate.

Abstract: Provided is a word line structure including a substrate, a stack structure, and a metal silicide structure. The stack structure is disposed on the substrate. The metal silicide structure is disposed on the stack structure. The metal silicide structure includes a first metal element, a second metal element, and a silicon element. The first metal element is different from the second metal element, and concentrations of the first metal element and the second metal element gradually decrease along a direction from a top surface of the metal silicide structure to the substrate.

Abstract: A palette decoding apparatus includes a palette color storage device which stores palette colors, a color index storage device which stores color indices of pixels, and a palette value processing circuit which generates a palette value for each pixel by reading data from the color index storage device and the palette color storage device. A frame is divided into first coding units, and each first coding unit is sub-divided into one or more second coding units. Before a palette value of a last pixel in a first coding unit is generated by the palette value processing circuit, a palette value of a non-last pixel in the first coding unit is generated by the palette value processing circuit and used by a reconstruction circuit of the video decoder.

Abstract: A palette decoding apparatus includes a palette color storage device which stores palette colors, a color index storage device which stores color indices of pixels, and a palette value processing circuit which generates a palette value for each pixel by reading data from the color index storage device and the palette color storage device. A frame is divided into first coding units, and each first coding unit is sub-divided into one or more second coding units. Before a palette value of a last pixel in a first coding unit is generated by the palette value processing circuit, a palette value of a non-last pixel in the first coding unit is generated by the palette value processing circuit and used by a reconstruction circuit of the video decoder.

Abstract: A method of detecting bitmap failure associated with physical coordinates is provided. In the method, data of wafer mapping inspection are obtained first, and the data include images of defects in each of layers within a wafer and a plurality of physical coordinates of the defects. Thereafter, a bitmap failure detection is performed to obtain digital coordinates of failure bits within the wafer. The digital coordinates are converted into a plurality of physical locations, and the physical locations are overlapped with the physical coordinates so as to rapidly obtain correlations between the failure bits and the defects.

Abstract: A method for treating coronavirus infection by administering to a subject in need of the treatment an effective amount of one or more of the following compounds: aklavin, sanguinarine, amiodarone, chlorpromazine, clomiphene, dihydroergotamine, dipyridamole, emetine, ephedrine, prochlorperazine, promazine, propiomazine, aminacrine, fluphenazine, fenoterol, peruvoside, proglumide, atenolol, nerifolin, nefopam, cycloheximide, avermectin B1, bepridil, cinnarizine, ethisterone, pararosaniline, methylbenzethonium, niclosamide, pipobroman, homidium, calcimycin, anisomycin, metergoline, amodiaquine, danazol, danthron, ethopropazine, eucatropine, nortriptyline, resorcinol, mebhydrolin, mebeverine, trimipramine, triflupromazine, chlorprothixene, cyclobenzaprine, enoxacin, sulfanitran, monensin, nigericin, perphenazine, methoxamine, astemizole, trifluoperazine, acriflavinium, rotenone, acebutolol, quabain, methiothepin, convallatoxin, halcinonide, cyclosporin, pimethixene, mycophenolic acid, promethazine, mesoridazine,

Abstract: A method for treating coronavirus infection by administering to a subject in need of the treatment an effective amount of one or more of the following compounds: aklavin, sanguinarine, amiodarone, chlorpromazine, clomiphene, dihydroergotamine, dipyridamole, emetine, ephedrine, prochlorperazine, promazine, propiomazine, aminacrine, fluphenazine, fenoterol, peruvoside, proglumide, atenolol, nerifolin, nefopam, cycloheximide, avermectin B1, bepridil, cinnarizine, ethisterone, pararosaniline, methylbenzethonium, niclosamide, pipobroman, homidium, calcimycin, anisomycin, metergoline, amodiaquine, danazol, danthron, ethopropazine, eucatropine, nortriptyline, resorcinol, mebhydrolin, mebeverine, trimipramine, triflupromazine, chlorprothixene, cyclobenzaprine, enoxacin, sulfanitran, monensin, nigericin, perphenazine, methoxamine, astemizole, trifluoperazine, acriflavinium, rotenone, acebutolol, quabain, methiothepin, convallatoxin, halcinonide, cyclosporin, pimethixene, mycophenolic acid, promethazine, mesoridazine,

Abstract: The present invention provides a method of synthesizing a target polynucleotide encoding a protein, which uses a primer extension technique to constitute the target polynucleotide sequence. Preferably, the method is applied in a method for highly expressing a protein encoded by the target polynucleotide in a host.

Abstract: The present invention relates to an organic electroluminescent device with a light-emitting layer, the light-emitting layer comprising a photo-crosslinkable conductive polymeric host material suitable for facilitating full-color display by spin coating; and at least one small-molecule light-emitting material to achieve high power efficiency. The color-purity of device of the present invention is independent of the distribution of molecular weight of the polymer in the light-emitting layer.

Abstract: An integrated color filter includes a substrate with a black matrix thereon to define a plurality of sub pixels on a surface thereof. A plurality of color filter units disposed in the sub pixels respectively, which are made of pigment doping organic material. The organic material is fluorescence or phosphorescence organic material to provide the image of the display with well saturation and luminance.

Abstract: A method of image format conversion and remote control device using the same. Addition terms for a first layer are derived from an image conversion table. Every two addition terms are assigned to an addition group, obtaining a plurality of addition groups. The two addition terms of each addition group are added by using an adder to obtain addition terms for next layer thereafter. The bit number of the adder is equivalent to that of one addition term comprising the maximum bit number in every addition group. Finally, the addition process is repeated to obtain the operation result.

Abstract: The present invention provides a safe, efficient, nonpolluting and economical method for inactivating viruses in a biomaterial, characterized in comprising a step of introducing a high-pressure fluid into a container containing a biomaterial to be treated at a speed capable of forming non-turbulent flow with Reynold's number of 2000 or less, thereby inactivating viruses potentially existing in the biomaterial. The method in accordance with the present invention can inactivate or eliminate viruses in a heat-sensitive biomaterial such as proteinous material, without decreasing the biological activities of the biomaterial significantly.

Abstract: The invention discloses a method for detecting resolution and a device for the same. Resolution data entries corresponding to a display device are classified into a plurality of first and second counting groups according to first and second timing counts respectively. Image signals from a video source are detected, acquiring a first counting group and a second counting group according to the resolution data entries. When the only resolution data entry corresponding to the image signals is included in the first counting group, the image signals corresponding to the resolution data entry is displayed. When a first resolution data entry and at least one second resolution data entry are included in the first counting group and only the first resolution data entry is included in the second counting group, the image signals corresponding to the first resolution data entry is displayed.