Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having one or more interior surfaces forming a recess within an upper surface of the substrate. Source/drain regions are disposed within the substrate on opposing sides of the recess. A first gate dielectric is arranged along the one or more interior surfaces forming the recess, and a second gate dielectric is arranged on the first gate dielectric and within the recess. A gate electrode is disposed on the second gate dielectric. The second gate dielectric includes one or more protrusions that extend outward from a recessed upper surface of the second gate dielectric and that are arranged along opposing sides of the second gate dielectric.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A battery contact mechanism (10) including a battery contact spring (12) for electrically connecting a battery (24) with electronic componentry (20) within a battery-powered device (14), such as, for example, a portable, hand-held GPS unit or personal digital assistant (PDA). The battery contact mechanism (10) includes a single-piece battery contact spring (12), including a center section (34), an upper tang (36) for contacting the battery (24), and a lower tang (38) for contacting the electronic componentry (20); a post or rib projection (28) for securing the spring (12) within the device (14); and a sealant reservoir (30) for preventing leakage of moisture or other substances to the electronic componentry (20).

Abstract: A battery contact mechanism (10) including a battery contact spring (12) for electrically connecting a battery (24) with electronic componentry (20) within a battery-powered device (14), such as, for example, a portable, hand-held GPS unit or personal digital assistant (PDA). The battery contact mechanism (10) includes a single-piece battery contact spring (12), including a center section (34), an upper tang (36) for contacting the battery (24), and a lower tang (38) for contacting the electronic componentry (20); a post or rib projection (28) for securing the spring (12) within the device (14); and a sealant reservoir (30) for preventing leakage of moisture or other substances to the electronic componentry (20).