Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A louver heat vent for a chassis of a computer, which is mounted in an opening of the chassis, has two shafts and multiple slats. The shafts each have a channel, into which fasteners of the slats can be inserted. The slats are stacked to conceal and shield the interior of the computer chassis yet allow heat to be dissipated quickly.

Abstract: A louver heat vent for a chassis of a computer, which is mounted in an opening of the chassis, has two shafts and multiple slats. The shafts each have a channel, into which fasteners of the slats can be inserted. The slats are stacked to conceal and shield the interior of the computer chassis yet allow heat to be dissipated quickly.