Abstract: A fiber-optics communication component test device is provided, which includes a daughterboard, a motherboard and a connector. The daughterboard includes a controller and the controller generates a digital waveform signal (or bit signal). The motherboard includes a test area and a fiber-optics communication component is disposed in the test area. The connector is disposed on the motherboard and the daughterboard is detachably connected to the connector. The fiber-optics communication component receives the digital waveform signal via the connector to generate a light signal. The light signal is processed by a signal processing system to generate an input signal. The controller receives the input signal and generates a test result, including bit error rate, voltage amplitude and electric signal eye pattern, according to the input signal.

Abstract: The invention provides a package structure of optical connector, comprising: an input circuit board, an output circuit board, a flexible circuit board, an optical transceiver module, and an enclosure for packing the above components. The input/output circuit board comprises a connecting terminal and an input/output terminal comprising a plurality of input/output ports, wherein the input circuit board and the output circuit board are fixed by the two opposite sides of the enclosure to create a specific space between the input circuit board and the output circuit board. The flexible circuit board is electrically connected to the connecting terminal of the input circuit board and/or the connecting terminal of the output circuit board. The optical transceiver module is electrically connected to the input circuit board and the output circuit board. The enclosure comprises an electrical connecting opening and an optical connecting opening corresponding to the electrical connecting opening.

Abstract: A replaceable transmitting module is disposed on an optical connector. The replaceable transmitting module comprises a plurality of optical sub-assemblies disposed independently respectively, and at least one positioning mount disposed on the optical connector. The optical sub-assemblies comprises at least one edge-emitting laser diode, a second cover disposed on the edge-emitting laser diode, and a second lens disposed on the second cover and corresponding to the edge-emitting laser diode. The positioning mount comprises a base and a plurality of positioning portions which are disposed on the base and to fix the optical sub-assemblies, respectively.

Abstract: A replaceable transmitting module is disposed on an optical connector. The replaceable transmitting module comprises a plurality of optical sub-assemblies disposed independently respectively, and at least one positioning mount disposed on the optical connector. The optical sub-assemblies comprises at least one edge-emitting laser diode, a second cover disposed on the edge-emitting laser diode, and a second lens disposed on the second cover and corresponding to the edge-emitting laser diode. The positioning mount comprises a base and a plurality of positioning portions which are disposed on the base and to fix the optical sub-assemblies, respectively.

Abstract: The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical receiving diode; wherein the pins are provided and passed through the metal base and insulated with the metal base by using an insulating material; the optical emitting diode and the optical receiving diode are each mounted on the metal base through a sub-mount, respectively. The optical emitting diode/optical receiving diode is connected to the pins neighboring therewith by a wire directly or through the sub-mount, when set the top surface of the pins be a reference level, at least one of the top surfaces of the optical emitting diode, the optical receiving diode, and sub-mount is flush with the reference level.

Abstract: The invention provides a package structure of optical connector, comprising: an input circuit board, an output circuit board, a flexible circuit board, an optical transceiver module, and an enclosure for packing the above components. The input/output circuit board comprises a connecting terminal and an input/output terminal comprising a plurality of input/output ports, wherein the input circuit board and the output circuit board are fixed by the two opposite sides of the enclosure to create a specific space between the input circuit board and the output circuit board. The flexible circuit board is electrically connected to the connecting terminal of the input circuit board and/or the connecting terminal of the output circuit board. The optical transceiver module is electrically connected to the input circuit board and the output circuit board. The enclosure comprises an electrical connecting opening and an optical connecting opening corresponding to the electrical connecting opening.

Abstract: The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical receiving diode; wherein the pins are provided and passed through the metal base and insulated with the metal base by using an insulating material; the optical emitting diode and the optical receiving diode are each mounted on the metal base through a sub-mount, respectively. The optical emitting diode/optical receiving diode is connected to the pins neighboring therewith by a wire directly or through the sub-mount, when set the top surface of the pins be a reference level, at least one of the top surfaces of the optical emitting diode, the optical receiving diode, and sub-mount is flush with the reference level.

Abstract: The present invention provides an optical transceiver module, comprising: a circuit substrate; a z-axis positioning base connected to the circuit substrate that, wherein the z-axis positioning base comprises two first sides respectively provided on two lateral sides of the optical transceiver sub-module, a second side provided between and connecting the two first sides, an opening corresponding in position to a side of the optical transceiver sub-module that faces away from the second side, and a step difference provided on each of the two first sides and the second side; a fiber-optic lens element provided on the z-axis positioning base and comprises a cover and a fiber-optic lens sub-module, wherein the cover comprises a recess and step differences surrounding the recess and respectively corresponding in position to the step differences provided on the z-axis positioning base, so as for the cover to be fitted on the z-axis positioning base.

Abstract: The present invention provides an optical transceiver module, comprising: a circuit substrate; a z-axis positioning base connected to the circuit substrate that, wherein the z-axis positioning base comprises two first sides respectively provided on two lateral sides of the optical transceiver sub-module, a second side provided between and connecting the two first sides, an opening corresponding in position to a side of the optical transceiver sub-module that faces away from the second side, and a step difference provided on each of the two first sides and the second side; a fiber-optic lens element provided on the z-axis positioning base and comprises a cover and a fiber-optic lens sub-module, wherein the cover comprises a recess and step differences surrounding the recess and respectively corresponding in position to the step differences provided on the z-axis positioning base, so as for the cover to be fitted on the z-axis positioning base.