Patents by Inventor Chi-Min Yu

Chi-Min Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    Publication number: 20240079346
    Abstract: An electronic component includes a board, an electronic device, and a stiffening structure is provided. The electronic device is disposed on the board. The stiffening structure is disposed on the board. The stiffening structure includes a ring portion corresponding the edge of the board. The stiffening structure includes a core base and a cladding layer. The cladding layer covers the core base.
    Type: Application
    Filed: September 1, 2022
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Jung-Wei Cheng, Yu-Min Liang, Chien-Hsun Lee
  • Method of supplying polishing liquid
    Patent number: 7828625
    Abstract: The present invention relates to a method of supplying the polishing liquid by periodically interrupt the supply of the polishing liquid, thus avoid over-supply or wastage of the polishing liquid. Hence, the consumption of the polishing liquid can be decreased and the production cost can be lower.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: November 9, 2010
    Assignee: United Microelectronics Corp.
    Inventors: Chi-Min Yu, Chi-Chih Chuang, Hui-Shen Shih
  • CMP head
    Patent number: 7731572
    Abstract: A CMP head includes a membrane support and a membrane. The membrane support is disk-shaped, having an origin and a radius R. The membrane support has at least a ventilator disposed in a central region within the range between origin and (?) R, and at least a diversion opening disposed in a peripheral region within the range between (?) R and R. The membrane includes a disk-shaped part disposed on the first surface of the membrane support, and an annular part surrounding the annular sidewall of the membrane support.
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: June 8, 2010
    Assignee: United Microelectronics Corp.
    Inventors: Chi-Min Yu, Chi-Chih Chuang, Yu-Fang Chien, Hui-Shen Shih
  • METHOD OF SUPPLYING POLISHING LIQUID
    Publication number: 20090111361
    Abstract: The present invention relates to a method of supplying the polishing liquid by periodically interrupt the supply of the polishing liquid, thus avoid over-supply or wastage of the polishing liquid. Hence, the consumption of the polishing liquid can be decreased and the production cost can be lower.
    Type: Application
    Filed: October 30, 2007
    Publication date: April 30, 2009
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chi-Min Yu, Chi-Chih Chuang, Hui-Shen Shih
  • CMP HEAD AND METHOD OF MAKING THE SAME
    Publication number: 20080293342
    Abstract: A CMP head includes a membrane support and a membrane. The membrane support is disk-shaped, having an origin and a radius R. The membrane support has at least a ventilator disposed in a central region within the range between origin and (2/3) R, and at least a diversion opening disposed in a peripheral region within the range between (2/3) R and R. The membrane includes a disk-shaped part disposed on the first surface of the membrane support, and an annular part surrounding the annular sidewall of the membrane support.
    Type: Application
    Filed: May 24, 2007
    Publication date: November 27, 2008
    Inventors: Chi-Min Yu, Chi-Chih Chuang