Patents by Inventor Chi-Ming Chan
Chi-Ming Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7883643Abstract: The invention provides a process for preparing an overvoltage protection material comprising: (i) preparing a mixture comprising a polymer binder precursor and a conductive material; and (ii) heating the mixture to cause reaction of the polymer binder precursor and generate a polymer matrix having conductive material dispersed therein, wherein the polymer binder precursor is chosen such that substantially no solvent is generated during the reaction.Type: GrantFiled: October 21, 2002Date of Patent: February 8, 2011Inventors: Chi-Ming Chan, Kai-Mo Ng, Catherine Yuen-Chien Wong, Ying Kit Cheung
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Patent number: 7803289Abstract: The invention provides a process for preparing an overvoltage protection material comprising: (i) preparing a mixture comprising a polymer binder precursor and a conductive material; and (ii) heating the mixture to cause reaction of the polymer binder precursor and generate a polymer matrix having conductive material dispersed therein, wherein the polymer binder precursor is chosen such that substantially no solvent is generated during the reaction.Type: GrantFiled: March 8, 2006Date of Patent: September 28, 2010Assignee: The Hong Kong University of Science and TechnologyInventors: Chi-Ming Chan, Kai-Mo Ng, Catherine Yuen Chien Wong, Ying Kit Cheung
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Patent number: 7763185Abstract: The invention provides a process for preparing an overvoltage protection material comprising: (i) preparing a mixture comprising a polymer binder precursor and a conductive material; and (ii) heating the mixture to cause reaction of the polymer binder precursor and generate a polymer matrix having conductive material dispersed therein, wherein the polymer binder precursor is chosen such that substantially no solvent is generated during the reaction.Type: GrantFiled: January 18, 2007Date of Patent: July 27, 2010Assignee: The Hong Kong University of Science and TechnologyInventors: Chi-Ming Chan, Kai-Mo Ng, Catherine Yuen-Chien Wong, Ying Kit Cheung
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Patent number: 7589611Abstract: The invention provides a process for preparing an overvoltage protection material comprising: (i) preparing a mixture comprising a polymer binder precursor and a conductive material; and (ii) heating the mixture to cause reaction of the polymer binder precursor and generate a polymer matrix having conductive material dispersed therein, wherein the polymer binder precursor is chosen such that substantially no solvent is generated during the reaction.Type: GrantFiled: August 30, 2006Date of Patent: September 15, 2009Assignee: The Hong Kong Universtiy of Science and TechnologyInventors: Chi-Ming Chan, Kai-Mo Ng, Catherine Yuen-Chien Wong, Ying Kit Cheung
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Patent number: 7355504Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals. Preferably preferred devices contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes.Type: GrantFiled: November 25, 2003Date of Patent: April 8, 2008Assignee: Tyco Electronics CorporationInventors: Gregory A. Graves, Michael Zhang, Daniel Chandler, Chi-Ming Chan, Shou-Mean Fang, Dennis Siden, Mark Thompson
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Publication number: 20070148440Abstract: The invention provides a process for preparing an overvoltage protection material comprising: (i) preparing a mixture comprising a polymer binder precursor and a conductive material; and (ii) heating the mixture to cause reaction of the polymer binder precursor and generate a polymer matrix having conductive material dispersed therein, wherein the polymer binder precursor is chosen such that substantially no solvent is generated during the reaction.Type: ApplicationFiled: January 18, 2007Publication date: June 28, 2007Inventors: Chi-Ming Chan, Kai-Mo Ng, Catherine Wong, Ying Cheung
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Publication number: 20070138440Abstract: The invention provides a process for preparing an overvoltage protection material comprising: (i) preparing a mixture comprising a polymer binder precursor and a conductive material; and (ii) heating the mixture to cause reaction of the polymer binder precursor and generate a polymer matrix having conductive material dispersed therein, wherein the polymer binder precursor is chosen such that substantially no solvent is generated during the reaction.Type: ApplicationFiled: January 18, 2007Publication date: June 21, 2007Inventors: Chi-Ming Chan, Kai-Mo NG, Catherine Wong, Ying Cheung
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Publication number: 20070123057Abstract: The invention provides a process for preparing an overvoltage protection material comprising: (i) preparing a mixture comprising a polymer binder precursor and a conductive material; and (ii) heating the mixture to cause reaction of the polymer binder precursor and generate a polymer matrix having conductive material dispersed therein, wherein the polymer binder precursor is chosen such that substantially no solvent is generated during the reaction.Type: ApplicationFiled: January 12, 2007Publication date: May 31, 2007Inventors: Chi-Ming Chan, Kai-Mo Ng, Catherine Wong, Ying Cheung
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Publication number: 20070102675Abstract: The invention provides a process for preparing an overvoltage protection material comprising: (i) preparing a mixture comprising a polymer binder precursor and a conductive material; and (ii) heating the mixture to cause reaction of the polymer binder precursor and generate a polymer matrix having conductive material dispersed therein, wherein the polymer binder precursor is chosen such that substantially no solvent is generated during the reaction.Type: ApplicationFiled: August 30, 2006Publication date: May 10, 2007Inventors: Chi-Ming Chan, Kai-Mo Ng, Catherine Wong, Ying Cheung
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Publication number: 20060151755Abstract: The invention provides a process for preparing an overvoltage protection material comprising: (i) preparing a mixture comprising a polymer binder precursor and a conductive material; and (ii) heating the mixture to cause reaction of the polymer binder precursor and generate a polymer matrix having conductive material dispersed therein, wherein the polymer binder precursor is chosen such that substantially no solvent is generated during the reaction.Type: ApplicationFiled: March 8, 2006Publication date: July 13, 2006Inventors: Chi-Ming Chan, Kai-Mo Ng, Catherine Wong, Ying Cheung
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Publication number: 20040246092Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprisingType: ApplicationFiled: November 25, 2003Publication date: December 9, 2004Inventors: Gregory A. Graves, Michael Mengruo Zhang, Daniel Chandler, Chi-Ming Chan, Shou-Mean Fang, Dennis Siden, Mark Thompson
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Publication number: 20040075085Abstract: The invention provides a process for preparing an overvoltage protection material comprising:Type: ApplicationFiled: October 21, 2002Publication date: April 22, 2004Inventors: Chi-Ming Chan, Kai-Mo NG, Catherine Yuen-Chien Wong, Ying Kit Cheung
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Patent number: 6651315Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising: (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals. Preferably preferred devices contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes.Type: GrantFiled: October 27, 1998Date of Patent: November 25, 2003Assignee: Tyco Electronics CorporationInventors: Gregory A. Graves, Michael Mengruo Zhang, Daniel Chandler, Chi-Ming Chan, Shou-Mean Fang, Dennis Siden, Mark Thompson
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Publication number: 20030060547Abstract: The present invention provides a composite material comprising calcium carbonate particles dispersed within a polypropylene matrix, wherein the calcium carbonate particles have a size within the range of 1 to 100 nm and a filling ratio of less than about 30% by volume, more preferably less than about 10% by volume. The particles have a mean size of around 40 to 50 nm.Type: ApplicationFiled: July 24, 2001Publication date: March 27, 2003Inventors: Chi-Ming Chan, Jingshen Wu, Jiang Xion Li, Ying-Kit Cheung
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Patent number: 6063867Abstract: The present invention provides a method for creating durable blends of polystyrene and polyolefin. The blends of the present invention have improved mechanical properties evidenced by measurement of impact strength, tensile strength, and elongation at break. Polyolefin is first crosslinked by creating a melt of polyolefin and a small amount of peroxide in a mixer at elevated temperature. The crosslinked polyolefin is then melt-blended with polystyrene at elevated temperature. Finally, a styrene-butadiene-styrene block copolymer is mixed into the melt. The method of the present invention can be applied to various blend systems of otherwise incompatible polymers provided it contains at least one component and a compatibilizer that are crosslinkable.Type: GrantFiled: February 12, 1998Date of Patent: May 16, 2000Assignee: The Hong Kong University of Science & TechnologyInventors: Zhi Wang, Chi-Ming Chan, Jiarui Shen
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Patent number: 5882745Abstract: There are disclosed novel composite materials in which polypropylene is reinforced by the inclusion of bamboo fibers. Preferably the polypropylene may be maleated prior to inclusion of the bamboo fibers in order to promote bonding between the bamboo fibers and the polypropylene matrix.Type: GrantFiled: March 28, 1997Date of Patent: March 16, 1999Assignee: The HongKong Univiersity of Science & TechnologyInventors: Yongli Mi, Xiaoya Chen, Qipeng Cuo, Chi-Ming Chan
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Patent number: 5852397Abstract: A circuit protection device which comprises first and second laminar electrodes; a laminar PTC conductive polymer resistive element sandwiched between the electrodes; a third laminar conductive member which is secured to the same face of the PTC element as the second electrode but is separated therefrom; and an electrical connector which connects the third conductive member and the first electrode. This permits connection to both electrodes from the same side of the device, so that the device can be connected flat on a printed circuit board, with the first electrode on top, without any need for leads. The connector is preferably a cross-conductor which passes through an aperture in the PTC element, because this makes it possible to carry out the steps for preparing the devices on an assembly which corresponds to a number of individual devices, with division of the assembly as the final step.Type: GrantFiled: July 25, 1997Date of Patent: December 22, 1998Assignee: Raychem CorporationInventors: Chi-Ming Chan, Michael Zhang, Daniel Chandler, Shou-Mean Fang, Dennis Siden, Mark Thompson
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Patent number: 5451919Abstract: A conductive polymer composition which has a resistivity of less than 10 ohm-cm and which exhibits PTC behavior comprises a polymeric component and a particulate conductive filler. The polymeric component comprises a first crystalline fluorinated polymer having a first melting point T.sub.m1 and a second crystalline fluorinated polymer having a second melting point T.sub.m2 which is from (T.sub.m1 +25).degree. C. to (T.sub.m1 +100).degree. C. The composition exhibits one of a number of characteristics, including a relatively high PTC anomaly. The composition is useful in circuit protection devices to be used at high ambient conditions.Type: GrantFiled: June 29, 1993Date of Patent: September 19, 1995Assignee: Raychem CorporationInventors: Edward F. Chu, Ann Banich, Robert Ives, Steven Sunshine, Chi-Ming Chan
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Patent number: 5436609Abstract: An electrical device in which a conductive terminal is physically and electrically attached directly or indirectly to a face of a laminar PTC resistive element. The terminal comprises a laminar portion and a non-laminar shaped portion which lies within a projection of the periphery of the PTC resistive element. The shaped portion serves to improve thermal transfer between the PTC element and the atmosphere surrounding the device. Devices of the invention are useful as circuit protection devices.Type: GrantFiled: July 6, 1993Date of Patent: July 25, 1995Assignee: Raychem CorporationInventors: Chi-Ming Chan, Shou-Mean Fang
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Patent number: 5247277Abstract: An electrical device in which a first connection element is in electrical contact with a resistive element. The first connection element defines a cavity into which, when the cavity is empty, a second connection element can be inserted. The second connection element, which may be connected to a source of electrical power, is partially within the cavity, makes physical and electrical contact with the first connection element, and protrudes from the cavity. Such devices can be made in a continuous process by a method of the invention. They are particularly suitable for insertion into a circuit board.Type: GrantFiled: May 27, 1992Date of Patent: September 21, 1993Assignee: Raychem CorporationInventors: Shou-Mean Fang, Vijay K. Dhingra, Chi-Ming Chan, Daniel Chandler