Patents by Inventor Chi-Ming Lin
Chi-Ming Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12287380Abstract: Sensor-based privacy-event detection for a mounted electronic device is described. In aspects, a security system includes a head assembly removably and magnetically coupled to a mounting device having a magnet. The electronic device also includes a camera module and a sensor disposed within the housing. The sensor detects a magnetic field associated with the magnet when the head assembly is coupled to the mounting device. When a user detaches the head assembly from the mounting device (e.g., to recharge the electronic device), the sensor no longer detects the magnetic field and determines the occurrence of a privacy event, which is used to deactivate the camera module to prevent unintentional recordings during the privacy event.Type: GrantFiled: July 26, 2022Date of Patent: April 29, 2025Assignee: Google LLCInventors: Mark Benjamin Kraz, Aditya Shailesh Ghadiali, Kok Yen Cheng, Félix Ambroise Étienne Senepin, Chi-Ming Lin
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Patent number: 12085841Abstract: This document describes a security camera with an angled cable attachment for an increased downward viewing angle. The security camera is battery-powered and can be magnetically coupled to a mounting device and electrically connected to another device via a cable. The cable has a cable attachment that, when coupled to the security camera, is angled toward a front of the security camera. This cable angle enables an increased downward tilt angle of the security camera by reducing interference of the cable attachment with the mounting device when the security camera is tilted downward. The security camera also has exposed contacts on a printed circuit board that connect with pins on the cable attachment.Type: GrantFiled: August 2, 2021Date of Patent: September 10, 2024Assignee: Google LLCInventors: Chi-Ming Lin, Mark Benjamin Kraz, Kok Yen Cheng, Aditya Shailesh Ghadiali
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Publication number: 20240085766Abstract: This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: Google LLCInventors: Ihab A. Ali, Arun Prakash Raghupathy, Mark Benjamin Kraz, Kok Yen Cheng, Chi-Ming Lin
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Patent number: 11852957Abstract: This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.Type: GrantFiled: September 22, 2020Date of Patent: December 26, 2023Assignee: Google LLCInventors: Ihab A. Ali, Arun Prakash Raghupathy, Mark Benjamin Kraz, Kok Yen Cheng, Chi-Ming Lin
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Publication number: 20230031426Abstract: Sensor-based privacy-event detection for a mounted electronic device is described. In aspects, a security system includes a head assembly removably and magnetically coupled to a mounting device having a magnet. The electronic device also includes a camera module and a sensor disposed within the housing. The sensor detects a magnetic field associated with the magnet when the head assembly is coupled to the mounting device. When a user detaches the head assembly from the mounting device (e.g., to recharge the electronic device), the sensor no longer detects the magnetic field and determines the occurrence of a privacy event, which is used to deactivate the camera module to prevent unintentional recordings during the privacy event.Type: ApplicationFiled: July 26, 2022Publication date: February 2, 2023Applicant: Google LLCInventors: Mark Benjamin Kraz, Aditya Shailesh Ghadiali, Kok Yen Cheng, Félix Ambroise Étienne Senepin, Chi-Ming Lin
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Publication number: 20220091484Abstract: This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.Type: ApplicationFiled: September 22, 2020Publication date: March 24, 2022Applicant: Google LLCInventors: Ihab A. Ali, Arun Prakash Raghupathy, Mark Benjamin Kraz, Kok Yen Cheng, Chi-Ming Lin
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Publication number: 20200142556Abstract: A device for checking aspects of equipment includes a display screen, a memory, a processor, and an equipment checking system in a computer. The system includes a control unit and a checklist generating unit. The display screen can display a checking interface of an equipment. The checking interface includes item information of items for checking corresponding to the equipment, a data inputting area, and first and second confirmation icons. Data arising from inspections and checks can be input into the data inputting area. The checklist generating unit generates a checklist of all items for checking and checks carried out in response to an operation on the first confirmation icon. The checklist includes information as to an equipment, data as to checks required, and data as to results of checks carried out.Type: ApplicationFiled: December 26, 2018Publication date: May 7, 2020Inventors: CHI-MING LIN, CHI-YUAN CHANG, SHU-BING HU
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Publication number: 20160222479Abstract: A desulfurization composition includes calcium oxide, silicon dioxide and aluminum oxide. The desulfurization composition is free of an alkali metal oxide. Aluminum oxide is present in an amount ranging from 20 to 26 wt % based on the total weight of the desulfurization composition, and the weight ratio of calcium oxide to aluminum oxide is within a range of 2.19 to 3. A method for desulfurizing molten steel using the desulfurization composition is also disclosed.Type: ApplicationFiled: January 29, 2016Publication date: August 4, 2016Inventors: Wei-Te WU, Chi-Ming LIN, Chia-Chun LI, Kun-Hsien LIN
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Patent number: 8754328Abstract: A laminate circuit board with a multi-layer circuit structure which includes a substrate, a first circuit metal layer, a second circuit metal layer, a first nanometer plating layer, a second nanometer plating layer and a cover layer is disclosed. The first circuit metal layer is embedded in the substrate or formed on at least one surface of the substrate which is smooth. The first nanometer plating layer with a smooth surface covers the first circuit metal layer. The second nanometer plating layer is formed on the other surface of the substrate and fills up the opening in the cover layer to electrically connect the first circuit metal layer. The junction adhesion is improved by the chemical bonding between the nanometer plating layer and the cover layer/the substrate. Therefore, the circuit metal layer does not need to be roughened and the density of the circuit increases.Type: GrantFiled: October 29, 2012Date of Patent: June 17, 2014Assignee: Kinsus Interconnect Technology Corp.Inventors: Jun-Chung Hsu, Chi-Ming Lin, Tso-Hung Yeh, Ya-Hsiang Chen
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Publication number: 20130284500Abstract: A laminate circuit board structure from button up including a substrate, a circuit metal layer, a nanometer plating layer and a cover layer is disclosed. The nanometer plating layer is smooth a thickness of 5-40 nm, and can be directly forming on the outer surface of the circuit metal layer or manufactured by firstly forming the nanometer plating layer on a preforming substrate, then pressing the substrate against the nanometer plating layer, and finally removing the preforming substrate. The junction adhesion between the nanometer plating layer and the cover layer or the substrate is improved by chemical bonding. Therefore it does not need to roughen the circuit metal layer or reserve circuit width for compensation such that the density of the circuit increases and much more dense circuit can be implemented in the substrate with the same area.Type: ApplicationFiled: April 25, 2012Publication date: October 31, 2013Inventors: Jun-Chung Hsu, Chi-Ming Lin, Tso-Hung Yeh, Ya-Hsiang Chen
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Publication number: 20130255858Abstract: A method of manufacturing a laminate circuit board is disclosed. The method includes forming a metal layer on a substrate, patterning the metal layer to form a circuit metal layer, forming a nanometer plating layer with a thickness of 5 to 40 nm over the circuit metal layer, and forming a cover layer covering the substrate and the nanometer plating layer with improved adhesion by chemical bonding to form the laminate circuit board. Another method includes forming the circuit metal layer and the nanometer plating layer on a preforming substrate, pressing the preforming substrate against a substrate to push the circuit metal layer and the nanometer plating layer into the substrate, and removing the preforming substrate. By the present invention, the density of circuit is increased and much denser circuit can be implemented on the substrate with the same area.Type: ApplicationFiled: April 3, 2012Publication date: October 3, 2013Inventors: Jun-Chung Hsu, Chi-Ming Lin, Tso-Hung Yeh, Ya-Hsiang Chen
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Publication number: 20120130860Abstract: Systems and techniques to provide an improved reputation scoring for products in an online storefront are described. A technique may include obtaining at least one objective measure and at least one subjective measure about a product in an online storefront; calculating a reputation level for the product from the subjective and objective measures; and displaying a listing for the product in the online storefront according to the reputation level. A technique may further include providing feedback to product developers about the reputation level of the product. Other embodiments are described and claimed.Type: ApplicationFiled: November 19, 2010Publication date: May 24, 2012Applicant: MICROSOFT CORPORATIONInventors: Clifford Akihiko Suzuki, Aayaz Bhorania, Rajesh Selvamani, Daniel Schonberg, Chi-Ming Lin, Jeffrey Johnson, John Mullally
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Patent number: 8092621Abstract: A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)3Sn4) layer at the (Cu,Ni)6Sn5/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder alloy with a Cu-content of 0.5˜1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)3Sn4 layer between the (Cu,Ni)6Sn5 and nickel in the subsequent use at temperatures ranging from 100° C. to 180° C.Type: GrantFiled: May 10, 2010Date of Patent: January 10, 2012Assignee: Yuan Ze UniversityInventors: Cheng-En Ho, Chi-Ming Lin
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Publication number: 20110139314Abstract: A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)3Sn4) layer at the (Cu,Ni)6Sn5/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder alloy with a Cu-content of 0.5˜1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)3Sn4 layer between the (Cu,Ni)6Sn5 and nickel in the subsequent use at temperatures ranging from 100° C. to 180° C.Type: ApplicationFiled: May 10, 2010Publication date: June 16, 2011Inventors: Cheng-En Ho, Chi-Ming Lin
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Patent number: 7761538Abstract: Computing systems can be dynamically configured, allocated, and deployed based on user requirements. For example, a user can request a number of servers for dynamic configuration, allocation, and deployment. Embodiments provide a quick and efficient way for users to test code and programs, debug code and programs, and/or perform other configuration and testing operations using one or more computing systems, such as a cluster of servers. Reserved systems are dynamically configured with necessary code and/or content according to user requirements. The reserved cluster of systems can be returned to an available pool once a reservation expires, allowing the returned systems to be used for a subsequent reservation.Type: GrantFiled: August 30, 2006Date of Patent: July 20, 2010Assignee: Microsoft CorporationInventors: Chi-Ming Lin, Sheng Zhou, Durgesh Nandan, Jeffrey Lee Albertson
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Patent number: 7509406Abstract: Systems, computer-program-products, and methods for managing terminal services (TS) accounts and sessions for online utilization of hosted applications are provided. A system is operative to monitor a supply of available TS accounts and create TS accounts in response to detecting that the supply of available TS accounts is below a minimum number. When a request to access a TS session is detected, the system provisions a TS account for the user to immediately access the TS session without entering credentials. The provisioned TS account provides access and is associated with a unique profile. The system is also operative to receive the request to access the hosted application and decrypt credentials generated for the user. A method involves reading a username assigned to a user requesting access, locating the TS account associated with the username, identifying the language associated with the TS account, and launching the hosted application in that language.Type: GrantFiled: September 30, 2004Date of Patent: March 24, 2009Assignee: Microsoft CorporationInventors: Ralph Abdo, Jeffrey Allen Case, Chi-Ming Lin
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Patent number: 7448961Abstract: A golf club head includes a golf club head body and a complex plate. The golf club head body includes an assembling opening to mount the complex plate. The complex plate includes a base plate and a protrusion structure which are made of different metal material. The upraised protrusion structure has a buffer structure formed therein. The complex plate has an outer (front) surface and an inner (rear) surface opposite to the outer surface. The protrusion structure is disposed on the inner surface of the complex plate. In assembling operation, the complex plate is received in the assembling opening of the golf club head body so as to constitute the golf club head.Type: GrantFiled: March 23, 2006Date of Patent: November 11, 2008Assignees: Fu Sheng Industrial Co., Ltd., Nelson Precision Casting Co., Ltd.Inventor: Chi-Ming Lin
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Patent number: 7376654Abstract: A computing systems data reporting system is comprised of a processing component and a reporting component. The processing component includes a configuration file and a system analysis and aggregation executable program module. The system analysis and aggregation executable module utilizes the input and output directory information from the configuration file to collect performance, usage and security data from sources such as those described above. The reporting component comprises an XML output memory component for storing aggregated data received from the executable module of the processing component. As XML data is passed to the reporting component, the XML data is transformed for publication via an Internet-based web page such that the data is viewable by interested users on a near real-time basis.Type: GrantFiled: April 29, 2003Date of Patent: May 20, 2008Assignee: Microsoft CorporationInventors: Bill Chau, Fuyau Lin, Chi-Ming Lin
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Publication number: 20080059610Abstract: Computing systems can be dynamically configured, allocated, and deployed based on user requirements. For example, a user can request a number of servers for dynamic configuration, allocation, and deployment. Embodiments provide a quick and efficient way for users to test code and programs, debug code and programs, and/or perform other configuration and testing operations using one or more computing systems, such as a cluster of servers. Reserved systems are dynamically configured with necessary code and/or content according to user requirements. The reserved cluster of systems can be returned to an available pool once a reservation expires, allowing the returned systems to be used for a subsequent reservation.Type: ApplicationFiled: August 30, 2006Publication date: March 6, 2008Applicant: Microsoft CoporationInventors: Chi-Ming Lin, Sheng Zhou, Durgesh Nandan, Jeffrey Lee Albertson
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Publication number: 20070225086Abstract: A golf club head includes a golf club head body and a complex plate. The golf club head body includes an assembling opening to mount the complex plate. The complex plate includes a base plate and a protrusion structure which are made of different metal material. The upraised protrusion structure has a buffer structure formed therein. The complex plate has an outer (front) surface and an inner (rear) surface opposite to the outer surface. The protrusion structure is disposed on the inner surface of the complex plate. In assembling operation, the complex plate is received in the assembling opening of the golf club head body so as to constitute the golf club head.Type: ApplicationFiled: March 23, 2006Publication date: September 27, 2007Inventor: Chi-Ming Lin