Patents by Inventor Chi-Ming Liu

Chi-Ming Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240385516
    Abstract: An organometallic precursor for extreme ultraviolet (EUV) lithography is provided. An organometallic precursor includes an aromatic di-dentate ligand, a transition metal coordinated to the aromatic di-dentate ligand, and an extreme ultraviolet (EUV) cleavable ligand coordinated to the transition metal. The aromatic di-dentate ligand includes a plurality of pyrazine molecules.
    Type: Application
    Filed: June 28, 2024
    Publication date: November 21, 2024
    Inventors: Chih-Cheng Liu, Yi-Chen Kuo, Yen-Yu Chen, Jr-Hung Li, Chi-Ming Yang, Tze-Liang Lee
  • Publication number: 20240377732
    Abstract: An organometallic precursor for extreme ultraviolet (EUV) lithography is provided. An organometallic precursor includes a chemical formula of MaXbLc, where M is a metal, X is a multidentate aromatic ligand that includes a pyrrole-like nitrogen and a pyridine-like nitrogen, L is an extreme ultraviolet (EUV) cleavable ligand, a is between 1 and 2, b is equal to or greater than 1, and c is equal to or greater than 1.
    Type: Application
    Filed: July 23, 2024
    Publication date: November 14, 2024
    Inventors: Chih-Cheng Liu, Yi-Chen Kuo, Yen-Yu Chen, Jr-Hung Li, Chi-Ming Yang, Tze-Liang Lee
  • Publication number: 20240371959
    Abstract: A method includes forming a first fin structure and a second fin structure protruding from a substrate, forming a dielectric fin between the first fin structure and the second fin structure, recessing the dielectric fin to form a trench between the first fin structure and the second fin structure, and depositing a first dielectric layer on sidewall surfaces of the trench and on a top surface of the recessed dielectric fin. After the depositing the first dielectric layer, a second dielectric layer is deposited in the trench. The method further includes depositing a third dielectric layer to cap the second dielectric layer in the trench, and forming a gate structure on the first fin structure, the second fin structure, and the third dielectric layer.
    Type: Application
    Filed: July 17, 2024
    Publication date: November 7, 2024
    Inventors: Chih-Chung Chang, Sung-En Lin, Chung-Ting Ko, You-Ting Lin, Yi-Hsiu Liu, Po-Wei Liang, Jiun-Ming Kuo, Yung-Cheng Lu, Chi On Chui, Yuan-Ching Peng, Jen-Hong Chang
  • Patent number: 12113113
    Abstract: A semiconductor device includes a pair of fin structures on a semiconductor substrate, each including a vertically stacked plurality of channel layers, a dielectric fin extending in parallel to and between the fin structures, and a gate structure on and extending perpendicularly to the fin structures, the gate structure engaging with the plurality of channel layers. The dielectric fin includes a fin bottom and a fin top over the fin bottom. The fin bottom has a top surface extending above a bottom surface of a topmost channel layer. The fin top includes a core and a shell, the core having a first dielectric material, the shell surrounding the core and having a second dielectric material different from the first dielectric material.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: October 8, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Chung Chang, Sung-En Lin, Chung-Ting Ko, You-Ting Lin, Yi-Hsiu Liu, Po-Wei Liang, Jiun-Ming Kuo, Yung-Cheng Lu, Chi On Chui, Yuan-Ching Peng, Jen-Hong Chang
  • Publication number: 20240304681
    Abstract: The method of forming the semiconductor device includes the following steps. An isolation structure is formed between a plurality of active areas. Semiconductor structures are formed over the active areas, and a portion of each semiconductor structure is embedded in the isolation structure. Sacrificial structures are formed on the semiconductor structures. An ion implantation process is performed to form implanted regions between the portions of the semiconductor structures embedded in the isolation structure. The sacrificial structures are removed to form patterned semiconductor structures. A dielectric structure is formed on the patterned semiconductor structure. A control structure is formed on the dielectric structure.
    Type: Application
    Filed: July 3, 2023
    Publication date: September 12, 2024
    Inventors: Chi-Ching LIU, Chia-Ming LIU, Yao-Ting TSAI, Chang-Tsung PAI
  • Publication number: 20240290629
    Abstract: A method for CMP includes following operations. A first metal layer and a second metal layer are formed in a dielectric structure. The second metal layer is formed over a portion of the first metal layer. A first composition is provided to remove a portion of the first metal layer. A second composition is provided to form a protecting layer over the second metal layer. The protecting layer is removed to expose the second metal layer. A CMP operation is performed to remove a portion of the first metal layer, a portion of the second metal layer and a portion of the dielectric structure.
    Type: Application
    Filed: April 29, 2024
    Publication date: August 29, 2024
    Inventors: JI CUI, FU-MING HUANG, TING-KUI CHANG, TANG-KUEI CHANG, CHUN-CHIEH LIN, WEI-WEI LIANG, LIANG-GUANG CHEN, KEI-WEI CHEN, HUNG YEN, TING-HSUN CHANG, CHI-HSIANG SHEN, LI-CHIEH WU, CHI-JEN LIU
  • Patent number: 12062513
    Abstract: A circuit element protection apparatus applied to a signal input terminal, the circuit element protection apparatus includes a slave processing unit, a main processing unit, a first soft start unit and a second soft start unit. The first soft start unit receives a signal from the signal input terminal, and is used for noise filtering on the signal and delayed a transmission of the signal to the slave processing unit. The second soft start unit receives the signal from the signal input terminal, and is used for noise filtering on the signal and delayed the transmission of the signal to the main processing unit. The present disclosure further includes a protection method for circuit elements.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: August 13, 2024
    Assignee: JESS-LINK PRODUCTS CO., LTD.
    Inventors: Chi-Hsien Sun, Ching-Hung Liu, Chieh-Ming Cheng
  • Publication number: 20240248412
    Abstract: A lithography method to pattern a first semiconductor wafer is disclosed. An optical mask is positioned over the first semiconductor wafer. A first region of the first semiconductor wafer is patterned by directing light from a light source through transparent regions of the optical mask. A second region of the first semiconductor wafer is patterned by directing energy from an energy source to the second region, wherein the patterning of the second region comprises direct-beam writing.
    Type: Application
    Filed: March 1, 2024
    Publication date: July 25, 2024
    Inventors: Tsiao-Chen WU, Chi-Ming YANG, Hsu-Shui LIU
  • Patent number: 12044966
    Abstract: An organometallic precursor for extreme ultraviolet (EUV) lithography is provided. An organometallic precursor includes an aromatic di-dentate ligand, a transition metal coordinated to the aromatic di-dentate ligand, and an extreme ultraviolet (EUV) cleavable ligand coordinated to the transition metal. The aromatic di-dentate ligand includes a plurality of pyrazine molecules.
    Type: Grant
    Filed: July 20, 2023
    Date of Patent: July 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Cheng Liu, Yi-Chen Kuo, Yen-Yu Chen, Jr-Hung Li, Chi-Ming Yang, Tze-Liang Lee
  • Patent number: 11921001
    Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: March 5, 2024
    Assignee: Hiwin Technologies Corp.
    Inventors: Hsien-Yu Chen, Yu-Sheng Chiu, Chih-Chun Cheng, Wen-Nan Cheng, Chi-Ming Liu
  • Publication number: 20230320041
    Abstract: A server device includes a chassis, plural fan modules and a controller. The fan modules are adapted to be installed in the chassis in a hot-swappable manner. The controller is configured to reduce a fan speed of each fan module in the chassis from a target speed to a temporary speed in response to a fan module insertion event, and then to increase the fan speed of each fan module to the target speed after a predetermined time elapses.
    Type: Application
    Filed: February 2, 2023
    Publication date: October 5, 2023
    Inventor: Chi Ming LIU
  • Publication number: 20230288290
    Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.
    Type: Application
    Filed: March 11, 2022
    Publication date: September 14, 2023
    Inventors: Hsien-Yu CHEN, Yu-Sheng CHIU, Chih-Chun CHENG, Wen-Nan CHENG, Chi-Ming LIU
  • Patent number: 9448474
    Abstract: A positive photosensitive resin composition, a pattern forming method, a thin film transistor array substrate, and a liquid crystal display device are provided. The positive photosensitive resin includes a novolac resin (A), an alkali-soluble resin (B), an ester (C) of an o-naphthoquinone diazide sulfonic acid, and a solvent (D). The alkali-soluble resin (B) includes a first alkali-soluble resin (B-1) produced by polymerizing a mixture. The mixture includes an epoxy compound (i) and a compound (ii), wherein the epoxy compound (i) has at least two epoxy groups, and the compound (ii) has at least one carboxylic acid group and at least one ethylenically unsaturated group.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: September 20, 2016
    Assignee: Chi Mei Corporation
    Inventors: Chi-Ming Liu, Chun-An Shih
  • Patent number: 9422748
    Abstract: The present invention discloses a lock and the application thereof. The lock is applied on a base having an inner surface and an outer surface. The lock comprises a locking plate and a motion module. The motion module has a curved surface facing the locking plate. The curved surface has a first surface and a second surface. A main feature of the present invention is that the lock has a close status and a far status. The locking plate contacts with the first surface and has a first distance from the base in the close status, and contacts with the second surface of the base and has a second distance, which is greater than the first distance, from the base in the far status. The invention has the advantages of low cost and simplicity, and solves the long lasting problem of the prior arts.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: August 23, 2016
    Assignee: CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO., LTD.
    Inventor: Chi-Ming Liu
  • Patent number: 9395627
    Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming a pattern by using the same. The positive photosensitive resin composition includes a novolac resin (A), a polysiloxane (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The novolac resin (A) includes a xylenol-type novolac resin (A-1). The xylenol-type novolac resin (A-1) is synthesized by polycondensing an aldehyde compound with a xylenol compound.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: July 19, 2016
    Assignee: CHI MEI CORPORATION
    Inventors: Chi-Ming Liu, Chun-An Shih
  • Publication number: 20150160554
    Abstract: A positive-type photosensitive resin composition, a pattern forming method, a thin film transistor array substrate, and a liquid crystal display device are provided. The positive-type photosensitive resin includes a novolac resin (A), an alkali-soluble resin (B), an ester (C) of an o-naphthoquinone diazide sulfonic acid, and a solvent (D). The alkali-soluble resin (B) includes a first alkali-soluble resin (B-1) produced by polymerizing a mixture. The mixture includes an epoxy compound (i) and a compound (ii), wherein the epoxy compound (i) has at least two epoxy groups, and the compound (ii) has at least one carboxylic acid group and at least one ethylenically unsaturated group.
    Type: Application
    Filed: November 27, 2014
    Publication date: June 11, 2015
    Inventors: Chi-Ming Liu, Chun-An Shih
  • Publication number: 20150072275
    Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming a pattern by using the same. The positive photosensitive resin composition includes a novolac resin (A), a polysiloxane (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The novolac resin (A) includes a xylenol-type novolac resin (A-1). The xylenol-type novolac resin (A-1) is synthesized by polycondensing an aldehyde compound with a xylenol compound.
    Type: Application
    Filed: September 3, 2014
    Publication date: March 12, 2015
    Inventors: Chi-Ming LIU, Chun-An SHIH
  • Publication number: 20140242504
    Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming patterns by using the same. The positive photosensitive resin composition includes a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B), a hydroxycompound (C) and a solvent (D). The novolac resin (A) further includes a hydroxy-type novolac resin (A-1) and a xylenol-type novolac resin (A-2). The hydroxy-type novolac resin (A-1) is synthesized by condensing hydroxyl benzaldehyde compound with aromatic hydroxyl compound. The xylenol-type novolac resin (A-2) is synthesized by condensing aldehyde compound with xylenol compound. The postbaked positive photosensitive resin composition can be beneficially formed to patterns with high film thickness and well cross-sectional profile.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 28, 2014
    Applicant: CHI MEI CORPORATION
    Inventors: Chi-Ming LIU, Chun-An SHIH
  • Publication number: 20130130869
    Abstract: A platform for supporting a conveyor belt of a treadmill includes a wooden plate, a reinforcement plate above the wooden plate, and a shock-absorbing plate sandwiched between the wooden plate and the reinforcement plate. The shock-absorbing plate has a surface facing the wooden plate base, and a plurality of cushions protruding from the surface and stopping against the wooden plate for providing good elastic support force and cushion effect.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Inventors: Kuang-Hua Hou, Hung Yang, Chi-ming Liu, Terry Chen, Ren Chiu, Fong-chiao Chung
  • Publication number: 20130130868
    Abstract: A hardness adjustable platform for supporting a conveyor belt of a treadmill includes a platform body having internal spaces, and a plurality of elastic fillers moveably and respectively disposed in the internal spaces of the platform body for providing a cushion effect. The fillers are moveable relative to the platform body by an external force and divide the platform body into first and second regions having different hardness. As a result, the runner who uses the treadmill equipped with the aforesaid platform may adjust the positions of the fillers according to his/her physical condition and running speed to change the hardness distribution of the platform so as to enhance his/her running efficiency and reduce the risk of exercise injury.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Inventors: Kuang-Hua HOU, Hung Yang, Chi-ming Liu, Terry Chen, Ren Chiu, Fong-chiao Chung