Patents by Inventor Chi-Ming Liu

Chi-Ming Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250053039
    Abstract: An E-paper display panel including an E-paper display layer, a first substrate, a pixel array layer, a common electrode layer, and a driving circuit is provided. The first substrate is disposed at a first side of the E-paper display layer. The pixel array substrate is disposed between the first substrate and the E-paper display layer and includes touch electrodes and driving pixels arranged in an array. Each driving pixel includes a first pixel electrode and a second pixel electrode. The touch electrodes, the first pixel electrode, and the second pixel electrode are overlapped with each other. The common electrode layer is disposed at a second side of the E-paper display layer. The first side is opposite to the second side. The driving circuit is in signal communication with the common electrode layer and the pixel array layer. The touch electrodes are individually in signal communication with the driving circuit.
    Type: Application
    Filed: July 11, 2024
    Publication date: February 13, 2025
    Applicant: E Ink Holdings Inc.
    Inventors: Chia-Ming Hsieh, Chi-Mao Hung, Sung-Hui Huang, Chuen-Jen Liu, Liang-Yu Yan, Pei Ju Wu, Po-Chun Chuang, Che-Sheng Chang, Wen-Chung Yang
  • Patent number: 12224179
    Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: February 11, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu, Chia-Wei Ho, Yang-Chun Cheng, William Weilun Hong, Liang-Guang Chen, Kei-Wei Chen
  • Patent number: 12215879
    Abstract: A thermostatic radiator valve supports a display that is configurable to display TRV information for a desired viewing direction to facilitate reading by a user, where the TRV comprises a configurable electronic display, a configuration circuit, and a processing device. The configuration circuit is capable of detecting when the TRV has been installed, determining a desired display orientation from a plurality of orientations with respect to a designated surface via a sensor in response to the detecting, and generating a display indicator indicative of the desired display orientation. The processing device is capable of receiving the display indicator and configuring the configurable electronic display to display the TRV information in the desired display orientation.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: February 4, 2025
    Assignee: Computime Ltd.
    Inventors: Kam Wai Raymond Ho, Kam Yuen Lam, Rui Feng Li, Siu Fung Liu, Fai Keung Seto, Wai Yin Shum, Chi Ming So
  • Patent number: 12207449
    Abstract: A cooling apparatus is provided. An external cooling fluid flows into an external inlet opening from an external inlet pipe and passes through a heat exchanger to flow out of an external outlet opening to an external outlet pipe. An internal cooling fluid flows into an internal inlet pipe from the server and flows into an internal inlet opening from the internal inlet pipe and passes through the heat exchanger for heat exchange with the external cooling fluid to flow out of an internal outlet opening to an internal outlet pipe. A hot-swap pump has a pump main body, an inlet anti-leakage pipe, an outlet anti-leakage pipe and a hot-swap connector. The inlet anti-leakage pipe includes an inlet connector and an inlet anti-leakage valve. The outlet anti-leakage pipe includes an outlet connector and an outlet anti-leakage valve. The hot-swap connector is electrically connected to the pump main body.
    Type: Grant
    Filed: April 5, 2022
    Date of Patent: January 21, 2025
    Assignee: Super Micro Computer, Inc.
    Inventors: Chia-Wei Chen, Te-Chang Lin, Yueh-Ming Liu, Yu-Hsiang Huang, Ya-Lin Liu, Chi-Che Chang
  • Patent number: 11921001
    Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: March 5, 2024
    Assignee: Hiwin Technologies Corp.
    Inventors: Hsien-Yu Chen, Yu-Sheng Chiu, Chih-Chun Cheng, Wen-Nan Cheng, Chi-Ming Liu
  • Publication number: 20230320041
    Abstract: A server device includes a chassis, plural fan modules and a controller. The fan modules are adapted to be installed in the chassis in a hot-swappable manner. The controller is configured to reduce a fan speed of each fan module in the chassis from a target speed to a temporary speed in response to a fan module insertion event, and then to increase the fan speed of each fan module to the target speed after a predetermined time elapses.
    Type: Application
    Filed: February 2, 2023
    Publication date: October 5, 2023
    Inventor: Chi Ming LIU
  • Publication number: 20230288290
    Abstract: A method and system for inspecting deviation in dynamic characteristics of a feeding system are provided, and the method includes: exciting the feeding system and detecting vibrations of a subcomponent of a component to be inspected of the feeding system to generate a monitoring excitation signal in a monitoring mode; calculating, by a modal analysis method, monitoring eigenvalues and monitoring eigenvectors of the monitoring excitation signal; determining, by a modal verification method, similarity between the monitoring eigenvalues and standard eigenvalues of a digital twin model and similarity between the monitoring eigenvectors and standard eigenvectors of the digital twin model; determining that the dynamic characteristics of the subcomponent are deviated, when the monitoring eigenvalues and monitoring eigenvectors are not similar to the standard eigenvalues and standard eigenvectors. Therefore, the subcomponent whose dynamic characteristics are deviated can be sensed remotely and precisely.
    Type: Application
    Filed: March 11, 2022
    Publication date: September 14, 2023
    Inventors: Hsien-Yu CHEN, Yu-Sheng CHIU, Chih-Chun CHENG, Wen-Nan CHENG, Chi-Ming LIU
  • Patent number: 9448474
    Abstract: A positive photosensitive resin composition, a pattern forming method, a thin film transistor array substrate, and a liquid crystal display device are provided. The positive photosensitive resin includes a novolac resin (A), an alkali-soluble resin (B), an ester (C) of an o-naphthoquinone diazide sulfonic acid, and a solvent (D). The alkali-soluble resin (B) includes a first alkali-soluble resin (B-1) produced by polymerizing a mixture. The mixture includes an epoxy compound (i) and a compound (ii), wherein the epoxy compound (i) has at least two epoxy groups, and the compound (ii) has at least one carboxylic acid group and at least one ethylenically unsaturated group.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: September 20, 2016
    Assignee: Chi Mei Corporation
    Inventors: Chi-Ming Liu, Chun-An Shih
  • Patent number: 9422748
    Abstract: The present invention discloses a lock and the application thereof. The lock is applied on a base having an inner surface and an outer surface. The lock comprises a locking plate and a motion module. The motion module has a curved surface facing the locking plate. The curved surface has a first surface and a second surface. A main feature of the present invention is that the lock has a close status and a far status. The locking plate contacts with the first surface and has a first distance from the base in the close status, and contacts with the second surface of the base and has a second distance, which is greater than the first distance, from the base in the far status. The invention has the advantages of low cost and simplicity, and solves the long lasting problem of the prior arts.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: August 23, 2016
    Assignee: CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO., LTD.
    Inventor: Chi-Ming Liu
  • Patent number: 9395627
    Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming a pattern by using the same. The positive photosensitive resin composition includes a novolac resin (A), a polysiloxane (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The novolac resin (A) includes a xylenol-type novolac resin (A-1). The xylenol-type novolac resin (A-1) is synthesized by polycondensing an aldehyde compound with a xylenol compound.
    Type: Grant
    Filed: September 3, 2014
    Date of Patent: July 19, 2016
    Assignee: CHI MEI CORPORATION
    Inventors: Chi-Ming Liu, Chun-An Shih
  • Publication number: 20150160554
    Abstract: A positive-type photosensitive resin composition, a pattern forming method, a thin film transistor array substrate, and a liquid crystal display device are provided. The positive-type photosensitive resin includes a novolac resin (A), an alkali-soluble resin (B), an ester (C) of an o-naphthoquinone diazide sulfonic acid, and a solvent (D). The alkali-soluble resin (B) includes a first alkali-soluble resin (B-1) produced by polymerizing a mixture. The mixture includes an epoxy compound (i) and a compound (ii), wherein the epoxy compound (i) has at least two epoxy groups, and the compound (ii) has at least one carboxylic acid group and at least one ethylenically unsaturated group.
    Type: Application
    Filed: November 27, 2014
    Publication date: June 11, 2015
    Inventors: Chi-Ming Liu, Chun-An Shih
  • Publication number: 20150072275
    Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming a pattern by using the same. The positive photosensitive resin composition includes a novolac resin (A), a polysiloxane (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The novolac resin (A) includes a xylenol-type novolac resin (A-1). The xylenol-type novolac resin (A-1) is synthesized by polycondensing an aldehyde compound with a xylenol compound.
    Type: Application
    Filed: September 3, 2014
    Publication date: March 12, 2015
    Inventors: Chi-Ming LIU, Chun-An SHIH
  • Publication number: 20140242504
    Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming patterns by using the same. The positive photosensitive resin composition includes a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B), a hydroxycompound (C) and a solvent (D). The novolac resin (A) further includes a hydroxy-type novolac resin (A-1) and a xylenol-type novolac resin (A-2). The hydroxy-type novolac resin (A-1) is synthesized by condensing hydroxyl benzaldehyde compound with aromatic hydroxyl compound. The xylenol-type novolac resin (A-2) is synthesized by condensing aldehyde compound with xylenol compound. The postbaked positive photosensitive resin composition can be beneficially formed to patterns with high film thickness and well cross-sectional profile.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 28, 2014
    Applicant: CHI MEI CORPORATION
    Inventors: Chi-Ming LIU, Chun-An SHIH
  • Publication number: 20130130869
    Abstract: A platform for supporting a conveyor belt of a treadmill includes a wooden plate, a reinforcement plate above the wooden plate, and a shock-absorbing plate sandwiched between the wooden plate and the reinforcement plate. The shock-absorbing plate has a surface facing the wooden plate base, and a plurality of cushions protruding from the surface and stopping against the wooden plate for providing good elastic support force and cushion effect.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Inventors: Kuang-Hua Hou, Hung Yang, Chi-ming Liu, Terry Chen, Ren Chiu, Fong-chiao Chung
  • Publication number: 20130130868
    Abstract: A hardness adjustable platform for supporting a conveyor belt of a treadmill includes a platform body having internal spaces, and a plurality of elastic fillers moveably and respectively disposed in the internal spaces of the platform body for providing a cushion effect. The fillers are moveable relative to the platform body by an external force and divide the platform body into first and second regions having different hardness. As a result, the runner who uses the treadmill equipped with the aforesaid platform may adjust the positions of the fillers according to his/her physical condition and running speed to change the hardness distribution of the platform so as to enhance his/her running efficiency and reduce the risk of exercise injury.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Inventors: Kuang-Hua HOU, Hung Yang, Chi-ming Liu, Terry Chen, Ren Chiu, Fong-chiao Chung
  • Publication number: 20120328799
    Abstract: A photosensitive resin composition and a method for forming patterns by using the same are disclosed. The photosensitive resin composition comprises a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B) and a ketol solvent (C). The novolac resin (A) includes a high-ortho novolac resin (A-1) that has ortho-ortho methylene bonding to all methylene bonding in a ratio of 18% to 25%, and a weight ratio (A-1)/(C) of the high-ortho novolac resin (A-1) to the ketol solvent (C) is 0.1 to 2.0, thereby exhibiting excellent temporal stability and further forming patterns with superior film to thickness uniformity and high resolution.
    Type: Application
    Filed: June 8, 2012
    Publication date: December 27, 2012
    Applicant: CHI MEI CORPORATION
    Inventors: Chi-Ming LIU, Chun-An SHIH
  • Publication number: 20120287393
    Abstract: A positive photosensitive resin composition and a method for forming patterns by using the same are disclosed. The photosensitive resin composition comprises a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B), a dye (C) and a solvent (D). The novolac resin (A) includes a high-ortho novolac resin (A-1) that has ortho-ortho methylene bonding to all methylene bonding in a ratio of 18% to 25%, thereby exhibiting excellent temporal stability and forming patterns with high resolution.
    Type: Application
    Filed: April 26, 2012
    Publication date: November 15, 2012
    Applicant: CHI MEI COOPERATION
    Inventors: Chi-Ming LIU, Chun-An SHIH
  • Patent number: 6747471
    Abstract: A method and apparatus for estimating burn-in time for integrated circuit die on a wafer employs a reliability testing structure placed in a scribe line area of a wafer to permit improved estimation of burn-in time for integrated circuit on a wafer. Each reliability testing structure has a plurality of evaluation device structures formed on the substrate. Groups of the evaluation device structures are stacked on the surface of the substrate. The device structures are created to permit evaluation of one of a plurality of failure mechanisms of the integrated circuit. A forcing input pad and a sensing output pad are connected through a selection circuit to at least one of the evaluation devices. The selection circuit selects which of the evaluation devices are to receive a stimulus and to transmit a response. The stimulus is activated and the substrate is then stressed.
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: June 8, 2004
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Kuo-Tso Chen, Chi-Ming Liu